LED package with reflecting cup

• US 9,431,591 B1
• Filed: 08/13/2015
• Issued: 08/30/2016
• Est. Priority Date: 07/16/2015
• Status: Active Grant

• Current Assignee: Advanced Optoelectronic Technology, Inc.
• Original Assignee: Advanced Optoelectronic Technology, Inc.
• Inventors: Lin, Hou-Te, Chen, Pin-Chuan, Chen, Lung-Hsin, Tseng, Wen-Liang
• Primary Examiner(s): Pham, Thanh V
• Application Number:
  US14/825,618
• Time in Patent Office: 383 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

The present disclosure provides a light emitting diode package which includes a plurality of electrodes, an LED die, a reflecting cup, and a phosphor layer. The LED die are electrically connected with the electrodes. The LED die includes a top light emitting surface and a plurality of lateral sides extending downward from the top light emitting surface. The reflecting cup is formed on the electrodes and surrounds the LED die. The reflecting cup includes an inner surface. The inner surface contacts with bottom portion of the LED die. A cavity is defined between the inner surface and other portion except the bottom portion of the LED die. The phosphor layer covers and seals the LED die.

Claims

1. A light emitting diode (LED) package, comprising:

a plurality of electrodes;

an LED die electrically connected with the plurality of electrodes and comprising a top light emitting surface and a plurality of lateral sides extending downward from the top light emitting surface;

a reflecting cup formed on the electrodes and surrounding the LED die, the reflecting cup comprising an inner surface contacting with bottom portion of the LED die;

the inner surface and other portions, except the bottom portion, of the LED die forming a cavity; and

a phosphor layer covering and sealing the LED die;

wherein the inner surface comprises a convex face protruding towards the LED die;

wherein the inner surface further comprises a ladder to receive the phosphor layer, the ladder is above the convex face, and the ladder comprises a first conjoining face extending perpendicularly from the convex face away from the electrodes; and

wherein the ladder further comprises a second conjoining face and a connecting platform connecting the first conjoining face and the second conjoining face.

2. The LED package of claim 1, wherein a beginning edge of the convex face is located at a joint between the LED die and the electrodes.

3. The LED package of claim 2, wherein an ending edge of the convex face is coplanar with the top light emitting surface of the LED die and away from the LED die.

4. The LED package of claim 1, wherein the convex face is arc-shaped.

5. The LED package of claim 1, wherein a transparent colloid is filled in the cavity, and an upper surface of the transparent colloid is coplanar to the top light emitting surface of the LED die.

6. The LED package of claim 5, wherein the transparent colloid comprises a concave face, the concave face is recessed towards the LED die, and the concave face contacts with the convex face entirely.

7. The LED package of claim 5, wherein the phosphor layer is directly stacked on the top light emitting surface of the LED die and the transparent colloid.

8. The LED package of claim 1, wherein the first conjoining face surrounds the phosphor layer to define a rectangular-shaped space.

9. The LED package of claim 1, wherein a distance between the first conjoining face and the LED die is less than a distance between the second conjoining face and the LED die.

10. The LED package of claim 1, wherein the connecting platform extends from top of the first conjoining face away from the LED die, and the second conjoining face extends from an outer edge of the connecting platform away from the electrodes.

11. The LED package of claim 10, wherein the first conjoining face, the connecting platform and the second conjoining face surround the LED die to define a T-shaped space.

12. The LED package of claim 1, wherein the LED die is mounted on the electrode via flip chip bonding.

13. The LED package of claim 12, wherein the electrodes comprises a first electrode and a second electrode spaced from the first electrode, an insulating layer is formed between the first electrode and the second electrode.

14. The LED package of claim 13, wherein top surfaces of the first electrode and the second electrode are coplanar, and bottom surfaces of the first electrode and the second electrode are exposed out of the LED package.

15. The LED package of claim 13, wherein the LED die is attached on the insulating layer with one lateral side contacting with the first electrode and the other lateral side contacting with the second electrode to electrically connect the LED die to the electrodes.