Submount with cavities and through vias for LED packaging

• US 9,431,592 B2
• Filed: 06/01/2012
• Issued: 08/30/2016
• Est. Priority Date: 06/01/2011
• Status: Active Grant

• Current Assignee: Hong Kong University of Science and Technology
• Original Assignee: Hong Kong University of Science and Technology
• Inventors: Lee, Shi-Wei, Zhang, Rong
• Primary Examiner(s): Mandala, Victor A
• Assistant Examiner(s): SNOW, COLLEEN ERIN
• Application Number:
  US14/122,929
• Publication Number:
  US 20140110728A1
• Time in Patent Office: 1,551 Days
• Field of Search: 257/88, 257/98, 438/27
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 25/075 the devices being of a type provided for in group H01L33/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A wafer having a plurality of light-emitting diode (LED) submounts and a method for fabricating an LED submount are provided. Each of the plurality of LED submounts of the wafer includes: a substrate (201), including through vias (203a); an LED die (208) mounted in a cavity (204) on a first side of the substrate (201) and connected to the through vias (203a); a redistribution layer (205a) attached to a second side of the substrate (201) connected to the LED die (208) through the through vias (203a). The method includes providing a wafer as a substrate (201); providing a cavity (204) in the substrate (201) on a first side of the substrate (201); providing through vias (203a) in the substrate (201), providing a redistribution layer (205a) on the second side of the substrate (201), and mounting an LED (208) in the cavity (204), wherein the LED die (208) is connected to the redistribution layer (205a) through the through vias (203a).

Claims

1. A method for fabricating a light-emitting diode (LED) submount, comprising:

providing a wafer as a substrate;

providing a cavity in the substrate on a first side of the substrate;

providing through vias in the substrate, wherein providing the through vias further comprises;

providing blind vias in the substrate on a second side of the substrate;

filling the blind vias with metal; and

etching the substrate within the cavity to expose the metal in the blind vias so as to produce the through vias;

plating solder onto the exposed metal of the through vias within the cavity;

providing a redistribution layer on the second side of the substrate, wherein providing the redistribution layer further comprises;

providing a metal layer on the second side of the substrate; and

patterning the metal layer so as to produce the redistribution layer; and

mounting an LED die in the cavity, wherein the LED die is connected to the redistribution layer through the through vias;

wherein the method further comprises;

providing a translucent plate attached to the first side of the substrate; and

providing a layer of encapsulant mixed with phosphor power on the translucent plate.

2. The method of claim 1, wherein the LED die is mounted in the cavity on solder bumps contacting the LED die and the through vias, and the method further comprises:

plating metal of the through vias exposed in the cavity with solder; and

processing the solder to form the solder bumps.

3. The method of claim 1, further comprising:

providing a first insulation layer on the first side of the substrate;

providing a second insulation layer, which is located between the redistribution layer and the substrate on the second side of the substrate;

and providing insulation of the substrate from metal of the through vias.

4. The method of claim 1, further comprising:

filling the cavity with encapsulant.

5. The method of claim 4, wherein the LED die is a blue LED die and the encapsulant is mixed with phosphor powder so as to cause white light to be emitted when the LED die is turned on.

6. The method of claim 1, further comprising:

providing a reflective layer in the cavity.

7. A light-emitting diode (LED) submount, comprising:

a substrate, the substrate comprising a cavity on a first side of the substrate and blind vias filled with metal on a second side of the substrate, wherein the substrate is a wafer, wherein the substrate comprises an etched region within the cavity where the metal in the blind vias is exposed to provide through vias;

solder plated onto the metal within the cavity of the substrate;

a redistribution layer on the second side of the substrate, wherein the redistribution layer comprises a patterned metal layer;

an LED die mounted in the cavity, wherein the LED die is connected to the redistribution layer through the through vias;

a translucent plate attached to the first side of the substrate; and

a layer of encapsulant mixed with phosphor powder disposed on the translucent plate.