Package structure for flexible organic light emitting diode device, method for packaging the same and flexible display device
First Claim
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1. A package structure for a flexible organic light emitting diode (OLED) device, comprising:
- a flexible substrate, arranged to support the OLED device;
a packaging layer, provided on the flexible substrate;
the OLED device, provided on the packaging layer; and
a waterproof and oxygenproof transparent thin film, covering the OLED device;
wherein the packaging layer comprises a passivation layer and a to-be-cured resin layer;
wherein the flexible substrate comprises an ultra-thin glass having flexibility and a waterproof and oxygenproof resin layer covering the ultra-thin glass;
wherein a size of the waterproof and oxygenproof resin layer is slightly larger than that of the ultra-thin glass such that both a length and a width of the waterproof and oxygenproof resin layer respectively exceed a length and a width of the ultra-thin glass by 0.1 mm-2 mm;
wherein a thickness of the ultra-thin glass is 0.05 mm-0.2 mm and a flexible radius of the ultra-thin glass is 40 mm-80 mm; and
wherein a thickness of the waterproof and oxygenproof resin layer is 0.03 mm-3 mm, and a temperature resistance of the waterproof and oxygenproof resin layer at least satisfies that the waterproof and oxygenproof resin layer is capable of remaining undeformed under 100 degrees Celsius for at least two hours.
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Abstract
According to the present disclosure, there is provided a package structure for a flexible organic light emitting diode (OLED) device, which may include: a flexible substrate, arranged to support the OLED device; a packaging layer, provided on the flexible substrate; the OLED device, provided on the packaging layer; and a waterproof and oxygenproof transparent thin film, covering the OLED device.
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Citations
10 Claims
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1. A package structure for a flexible organic light emitting diode (OLED) device, comprising:
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a flexible substrate, arranged to support the OLED device; a packaging layer, provided on the flexible substrate; the OLED device, provided on the packaging layer; and a waterproof and oxygenproof transparent thin film, covering the OLED device; wherein the packaging layer comprises a passivation layer and a to-be-cured resin layer; wherein the flexible substrate comprises an ultra-thin glass having flexibility and a waterproof and oxygenproof resin layer covering the ultra-thin glass; wherein a size of the waterproof and oxygenproof resin layer is slightly larger than that of the ultra-thin glass such that both a length and a width of the waterproof and oxygenproof resin layer respectively exceed a length and a width of the ultra-thin glass by 0.1 mm-2 mm; wherein a thickness of the ultra-thin glass is 0.05 mm-0.2 mm and a flexible radius of the ultra-thin glass is 40 mm-80 mm; and wherein a thickness of the waterproof and oxygenproof resin layer is 0.03 mm-3 mm, and a temperature resistance of the waterproof and oxygenproof resin layer at least satisfies that the waterproof and oxygenproof resin layer is capable of remaining undeformed under 100 degrees Celsius for at least two hours. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A flexible display device, which comprises a package structure for a flexible organic light emitting diode (OLED) device, the flexible display device comprising:
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a flexible substrate, arranged to support the OLED device; a packaging layer, provided on the flexible substrate; the OLED device, provided on the packaging layer; and a waterproof and oxygenproof transparent thin film, covering the OLED; wherein the packaging layer comprises a passivation layer and a to-be-cured resin layer; wherein the flexible substrate comprises an ultra-thin glass having flexibility and a waterproof and oxygenproof resin layer covering the ultra-thin glass; wherein a size of the waterproof and oxygenproof resin layer is slightly larger than that of the ultra-thin glass such that both a length and a width of the waterproof and oxygenproof resin layer respectively exceed a length and a width of the ultra-thin glass by 0.1 mm-2 mm; wherein a thickness of the ultra-thin glass is 0.05 mm-0.2 mm and a flexible radius of the ultra-thin glass is 40 mm-80 mm; and wherein a thickness of the waterproof and oxygenproof resin layer is 0.03 mm-3 mm, and a temperature resistance of the waterproof and oxygenproof resin layer at least satisfies that the waterproof and oxygenproof resin layer is capable of remaining undeformed under 100 degrees Celsius for at least two hours. - View Dependent Claims (9, 10)
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Specification