Application of fluids to substrates

• US 9,433,962 B2
• Filed: 12/22/2015
• Issued: 09/06/2016
• Est. Priority Date: 05/10/2013
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Pilch, Karl, Leitner, Hans, Kalin, Michael
• Primary Examiner(s): BOOTH, RICHARD A
• Application Number:
  US14/978,507
• Publication Number:
  US 20160107183A1
• Time in Patent Office: 259 Days
• US Class Current: 1/1
• CPC Class Codes: B05B 12/02 for controlling time, or sequence, of delivery
• CPC Class Codes: B05B 13/02 Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work B05B13/06 takes precedence
• CPC Class Codes: B05C 11/02 Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means thereforB05C7/00 takes precedence; Hand tools for such purposes B05C17/10; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surfacecontrolling supply of liquid or other fluent material B05C11/10
• CPC Class Codes: B05D 1/002 the substrate being rotated
• CPC Class Codes: B05D 3/007 After-treatment
• CPC Class Codes: H01L 21/02282 liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/6715 Apparatus for applying a liquid, a resin, an ink or the like H01L21/67126 takes precedence
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.

Claims

1. An apparatus comprising:

a first device comprising;

a substrate holder;

a glue application device configured to apply a glue to one of a semiconductor substrate or a carrier on the substrate holder;

a heating mechanism configured to locally heat the glue; and

a controller configured to control the heating mechanism to apply a local heating in order to obtain a desired thickness profile having a flatness with a predetermined tolerance of the glue on the one of the semiconductor substrate or the carrier; and

a second device comprising a grinding wheel configured to grind the semiconductor substrate mounted to the carrier with the glue sandwiched between the semiconductor substrate and the carrier.

2. The apparatus of claim 1, wherein a viscosity of the glue is temperature-dependent.

3. The apparatus of claim 1, wherein the heating mechanism comprises an infrared lamp.

4. The apparatus of claim 1, wherein the substrate holder is rotatable.

5. The apparatus of claim 4, wherein the glue application device is configured to apply the glue while the substrate holder rotates.

6. The apparatus of claim 4, wherein the controller is configured to control the heating mechanism to locally heat the glue while the substrate holder rotates.

7. The apparatus of claim 1, further comprising a fluid thickness measurement device, the apparatus being further configured to determine a local heating pattern through a calibration measurement using the fluid thickness measurement device.

8. The apparatus of claim 1, wherein the substrate holder is configured to receive the semiconductor substrate.

9. The apparatus of claim 1, wherein the local heating locally changes a behavior of the glue from an essentially non-Newtonian behavior to an essentially Newtonian behavior.

10. The apparatus of claim 7, wherein the heating mechanism is configured to apply the heating based on the local heating pattern.

11. The apparatus of claim 10, wherein the local heating pattern is a spatial heat pattern to be applied across the one of the semiconductor substrate or carrier.