Method for forming patterned conductive film

• US 9,435,032 B2
• Filed: 04/15/2014
• Issued: 09/06/2016
• Est. Priority Date: 01/28/2010
• Status: Expired due to Fees

• Current Assignee: Japan Science & Technology Trading Co. Limited
• Original Assignee: Japan Science & Technology Trading Co. Limited
• Inventors: Shimoda, Tatsuya, Matsuki, Yasuo, Shen, Zhongrong
• Primary Examiner(s): Yuan, Dah-Wei D
• Assistant Examiner(s): Hernandez-Diaz, Jose
• Application Number:
  US14/253,459
• Publication Number:
  US 20140227436A1
• Time in Patent Office: 875 Days
• Field of Search: 427/126.4, 427/123, 427/126.5, 427/125
• US Class Current: 1/1
• CPC Class Codes: C23C 18/06 Coating on selected surface areas, e.g. using masks
• CPC Class Codes: C23C 18/08 characterised by the deposition of metallic material
• CPC Class Codes: C23C 18/10 Deposition of aluminium only
• CPC Class Codes: C23C 18/1603 coating on selected surface areas
• CPC Class Codes: C23C 18/42 Coating with noble metals
• CPC Class Codes: C23C 22/73 characterised by the process
• CPC Class Codes: H05K 2203/0709 Catalytic ink or adhesive for electroless plating catalyst filler H05K2201/0236
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: H05K 3/182 characterised by the patterning method
• CPC Class Codes: Y10T 428/12028 Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
• CPC Class Codes: Y10T 428/12493 Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
• CPC Class Codes: Y10T 428/1275 Next to Group VIII or IB metal-base component
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

The present invention is directed to a method for forming a patterned conductive film, which comprises the step of bringing a substrate having a layer made of platinum microcrystal particles formed thereon in a pattern and a complex of an amine compound and an aluminum hydride into contact with each other at a temperature of 50 to 120° C.

According to the present invention, there is provided a method for forming a patterned conductive layer, which can ensure electrical bonding with a substrate and also can be suitably applied to various electronic devices, simply without requiring a massive and heavy apparatus.

Claims

1. A method for forming a patterned conductive film, the method comprising:

bringing a substrate and a complex of an amine compound and an aluminum hydride into contact with each other at a temperature of 50 to 120°

C.,

wherein the substrate has a layer made of platinum microcrystal particles formed thereon in a pattern and

the platinum microcrystal particles are crystalline platinum cubes obtained by a method comprising bringing a platinum complex compound;

an acid;

a primary alcohol having 2 to 12 carbon atoms; and

a hydrophilic polymer,

into contact with each other in a polar solvent.

2. The method according to claim 1,

wherein the platinum microcrystal particles have an average particle diameter of 15 nm or less.