Testing of thru-silicon vias
First Claim
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1. A method for testing thru-silicon vias (TSVs) in a silicon die, the TSVs for providing interconnection between opposite sides of the silicon die, the method comprising:
- mounting the silicon die on wafer tape, the wafer tape having a resistivity that is sufficiently low to form a conductive path between TSVs;
for different sets of two probe points, contacting the two probe points on the exposed side of the silicon die, each probe point electrically connected to one of two different TSVs, wherein the different sets of two probe points are a same pair of probe points on different dies;
measuring a resistance between the two probe points; and
determining an electrical integrity of the two TSVs based on the measured resistance.
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Abstract
A system and a method for testing thru silicon vias (TSVs) in a silicon die. A silicon die containing multiple TSVs is mounted on a wafer tape. Two probe points are probed on the exposed side of the silicon die. A resistance is measured between the two probe points and an electrical integrity is determined based on the measured resistance.
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Citations
18 Claims
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1. A method for testing thru-silicon vias (TSVs) in a silicon die, the TSVs for providing interconnection between opposite sides of the silicon die, the method comprising:
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mounting the silicon die on wafer tape, the wafer tape having a resistivity that is sufficiently low to form a conductive path between TSVs; for different sets of two probe points, contacting the two probe points on the exposed side of the silicon die, each probe point electrically connected to one of two different TSVs, wherein the different sets of two probe points are a same pair of probe points on different dies; measuring a resistance between the two probe points; and determining an electrical integrity of the two TSVs based on the measured resistance. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A non-transitory computer readable medium storing instructions for testing thru-silicon vias (TSVs) in a silicon die, the TSVs for providing interconnection between opposite sides of the silicon die, the instructions when executed by a processor cause the processor to:
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receive a resistance measurement between different sets of two probe points of the silicon die, the silicon die mounted on a wafer tape, the wafer tape having a resistivity that is sufficiently low to form a conductive path between TSVs, each probe point electrically connected to one of two different TSVs, wherein the different sets of two probe points are a same pair of probe points on different dies; and determine an electrical integrity of the two TSVs based on the received resistance measurement. - View Dependent Claims (18)
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Specification