Stacked photonic chip coupler for SOI chip-fiber coupling

• US 9,435,961 B2
• Filed: 10/15/2014
• Issued: 09/06/2016
• Est. Priority Date: 10/15/2014
• Status: Active Grant

• Current Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Original Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Inventors: Jiang, Jia
• Primary Examiner(s): PAK, SUNG H
• Application Number:
  US14/515,211
• Publication Number:
  US 20160109659A1
• Time in Patent Office: 692 Days
• Field of Search: 385/49
• US Class Current: 1/1
• CPC Class Codes: G02B 2006/12061 Silicon
• CPC Class Codes: G02B 2006/12164 Multiplexing; Demultiplexing
• CPC Class Codes: G02B 6/1223 high refractive index type, i.e. high-contrast waveguides
• CPC Class Codes: G02B 6/124 Geodesic lenses or integrated gratings
• CPC Class Codes: G02B 6/305 and having an integrated mode-size expanding section, e.g. tapered waveguide
• CPC Class Codes: G02B 6/34 utilising prism or grating G02B6/293 takes precedence
• CPC Class Codes: G02B 6/356 in an optical cross-connect device, e.g. routing and switching aspects of interconnecting different paths propagating different wavelengths to (re)configure the various input and output links switching polarized beams G02B6/3594; power equalizers G02B6/356 and G02B6/3594; path selecting means H04Q11/0001
• CPC Class Codes: H01L 31/167 the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers

Abstract

Embodiments are provided for an optical coupler created by bonded photonic chip coupler for Silicon-on-Insulator (SOI) chip-fiber coupling. System and apparatus embodiments for a bonded photonic chip coupler for SOI chip-fiber coupling provide for reduced mismatch between fiber and chip, increased coupling efficiency, and lower photonics device insertion loss. In an embodiment, an optical coupler for coupling a photonics chip to an optical fiber includes a photonic chip comprising a nano-sized photonic waveguide, photonic optical diffraction surface grating, and a first cladding covering the photonic waveguide and the photonic grating; and an optical coupling chip comprising a micron-sized coupling waveguide and a coupling optical diffraction surface grating embedded in a first coupling cladding and on a second coupling cladding, wherein the first coupling cladding is connected to the first cladding, wherein the optical coupling chip is configured to couple to light transmitted between the photonic chip and an optical fiber.

Claims

1. An optical coupler for coupling a photonics chip to an optical fiber, comprising:

a photonic chip comprising a nano-sized photonic waveguide having a width of less than one micrometer, a photonic optical diffraction surface grating in a plane of the photonic chip, and a first cladding covering the photonic waveguide and the photonic optical diffraction surface grating; and

an optical coupling chip comprising a micron-sized coupling waveguide and a coupling optical diffraction surface grating embedded in a first coupling cladding and on a second coupling cladding, wherein the first coupling cladding of the optical coupling chip is connected to the first cladding of the photonic chip, wherein the optical coupling chip is configured to couple to light transmitted between the photonic chip and an optical fiber,

wherein the photonic chip and the optical coupling chip are configured such that a direction of propagation of light traveling between the coupling optical diffraction surface grating and the optical fiber is in a plane of the optical coupling chip.

2. The optical coupler of claim 1, wherein the photonic chip comprises silicon-on-insulator (SOI) and wherein the optical coupling chip comprises silica on silicon, wherein the photonic waveguide comprises one of silicon-rich oxide, SiO₂, Si₃N₄, or SiON.

3. The optical coupler of claim 1, wherein the photonic optical diffraction surface grating and the coupling optical diffraction surface grating couple light between the photonic chip and the optical coupling chip at an acute incident angle.

4. The optical coupler of claim 1, further comprising a plurality of photonic optical diffraction surface gratings, a plurality of nano-sized photonic waveguides, a plurality of coupling optical diffraction surface gratings, and a plurality of micron-sized coupling waveguides configured as an array coupler.

5. The optical coupler of claim 1, wherein the photonic optical diffraction surface grating or the coupling optical diffraction surface grating is configured to split light into two directions.

6. The optical coupler of claim 1, wherein the photonic optical diffraction surface grating or the coupling optical diffraction surface grating is configured to combine light received from two different sources.

7. The optical coupler of claim 1, wherein the optical coupling chip further comprises an optical signal processing component.

8. The optical coupler of claim 7, wherein the optical signal processing component comprises at least one of a power splitter, a power combiner, a wavelength filter, and a light path converter, according to an optical structure, wherein the optical structure comprises one of a multimode interference (MMI) coupler, a directional coupler, a ring resonator, a Bragg grating, a waveguide bender, a Mach-Zehnder interferometer, and an arrayed waveguide grating (AWG).

9. The optical coupler of claim 1, wherein the optical coupling chip comprises a silica waveguide and silica grating.

10. The optical coupler of claim 1, wherein the photonic waveguide and the photonic optical diffraction surface grating comprise one of Si, InP, GaInAs, GaInAsP, SiON, and Si₃N₄.

11. The optical coupler of claim 1, further comprising multiple gratings configured to form an array coupler.

12. The optical coupler of claim 1, wherein the coupling optical diffraction surface grating comprises a distributed Bragg reflector (DBR) assisted waveguide grating coupling structure.

13. The optical coupler of claim 1, wherein the first coupling cladding comprises an anti-reflective coating at an interface with the first cladding.

14. A network component configured for transmitting, receiving, and switching optical signals, the network component comprising:

an input/output (I/O) component for receiving and transmitting signals to other network components; and

an optical processing element coupled to the I/O component, wherein the optical processing element comprises;

a photonic chip comprising a nano-sized photonic waveguide having a width of less than one micrometer, photonic optical diffraction surface grating in a plane of the photonic chip, and a first cladding covering the nano-sized photonic waveguide and the photonic optical diffraction surface grating; and

an optical coupling chip comprising a micron-sized coupling waveguide and coupling optical diffraction surface grating embedded in a first coupling cladding and on a second coupling cladding, wherein the first coupling cladding is connected to the first cladding, wherein the optical coupling chip is configured to couple to light transmitted between the photonic chip and an optical fiber,

wherein the photonic chip and the optical coupling chip are configured such that a direction of propagation of light traveling between the coupling optical diffraction surface grating and the optical fiber is in a plane of the optical coupling chip.

15. The network component of claim 14, wherein photonic chip comprises silicon-on-insulator (SOI) and wherein the optical coupling chip comprises silica on silicon.

16. The network component of claim 14, wherein the photonic optical diffraction surface grating and the coupling optical diffraction surface grating couple light between the photonic chip and the optical coupling chip at an acute incident angle.

17. The network component of claim 14, further comprising a plurality of nano-sized photonic optical diffraction surface gratings, a plurality of photonic waveguides, a plurality of coupling optical diffraction surface gratings, and a plurality of micron-sized coupling waveguides configured as an array coupler.

18. The network component of claim 14, wherein the photonic optical diffraction surface grating or the coupling optical diffraction surface grating is configured to split light into two directions.

19. The network component of claim 14, wherein the photonic optical diffraction surface grating or the coupling optical diffraction surface grating is configured to combine light received from two different sources.

20. The network component of claim 14, wherein the optical coupling chip further comprises an optical signal processing component.

21. The network component of claim 20, wherein the optical signal processing component comprises at least one of a power splitter, a power combiner, a wavelength filter, and a light path converter, according to an optical structure, wherein the optical structure comprises one of a multimode interference (MMI) coupler, a directional coupler, a ring resonator, a Bragg grating, a waveguide bender, a Mach-Zehnder interferometer, and an arrayed waveguide grating (AWG).

22. The network component of claim 14, wherein the optical coupling chip comprises a silica waveguide and silica grating.

23. The network component of claim 14, wherein the photonic waveguide and the photonic optical diffraction surface grating comprise one of Si, InP, GaInAs, GaInAsP, SiON, and Si₃N₄.

24. The network component of claim 14, further comprising multiple optical diffraction surface gratings configured to form an array coupler.

25. The network component of claim 14, wherein the coupling optical diffraction surface grating comprises a distributed Bragg reflector (DBR) assisted waveguide grating coupling structure.

26. The network component of claim 14, wherein the first coupling cladding comprises an anti-reflective coating at an interface with the first cladding.

27. A method for fabricating a photonic chip coupler for silicon-on-insulator (SOI) chip-fiber coupling, comprising:

fabricating a silica chip comprising a first cladding, a micron-sized silica waveguide, a silica grating, and a second cladding, wherein the silica chip comprises a silica on silicon chip, and wherein the micron-sized silica waveguide comprises an interface to connect to an optical fiber;

fabricating a photonic integrated circuit (PIC), wherein the PIC comprises a nano-sized PIC waveguide having a width of less than one micron and a PIC optical diffraction surface grating covered by a top cladding, wherein the PIC comprises a silicon on insulator (SOI) chip; and

connecting the first cladding of the silica chip to the top cladding of the PIC to produce a photonic chip coupler, wherein the silica chip and the PIC are configured such that a direction of propagation of light traveling between the micron-sized silica waveguide and the optical fiber is in a plane of the silica chip.

28. The method of claim 27, wherein fabricating the silica chip comprises forming a distributed Bragg reflector (DBR) assisted waveguide grating coupling structure.

29. The method of claim 27, wherein fabricating the silica chip comprises forming an anti-reflective coating on the first cladding such that after bonding the first cladding of the silica chip to the top cladding of the PIC, the anti-reflective coating resides at an interface with the between the first cladding and the top cladding of the PIC.

30. The method of claim 27, wherein the PIC waveguide and the PIC grating comprise one of SiO₂, InP, SiON, and Si₃N₄.

31. The method of claim 27, wherein fabricating the silica chip further comprises forming at least one of a power splitter, a power combiner, an multimode interference (MMI) coupler, a directional coupler, a ring resonator, Bragg grating, waveguide bender, a wavelength filter, and an arrayed waveguide grating (AWG).

32. The method of claim 27, wherein the silica waveguide is larger than the PIC waveguide.

33. The method of claim 27, wherein the silica waveguide is configured to substantially match geometric characteristics of an optical fiber.