Inductor and manufacturing method thereof

• US 9,437,363 B2
• Filed: 07/01/2014
• Issued: 09/06/2016
• Est. Priority Date: 10/11/2013
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Choi, Woon Chul, Kim, Sung Hyun, Cha, Hye Yeon
• Primary Examiner(s): Lian, Mangtin
• Application Number:
  US14/321,059
• Publication Number:
  US 20150102889A1
• Time in Patent Office: 798 Days
• Field of Search: 336/200, 336/234, 336/223, 156/280
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 41/042 by thin film techniques

Abstract

An inductor may include: a body, and a first and a second external electrode formed on end surfaces of the body. The body may include a coil support layer, a conductive coil formed on at least one surface of the coil support layer, a lamination part formed in a gap of the conductive coil and on an upper surface thereof, an insulating coating part formed to enclose an overall surface of the conductive coil on which the lamination part is formed, and upper and lower cover layers covering the overall surface of the conductive coil on which the insulating coating part is formed.

Claims

1. An inductor comprising:

a body comprising a coil support layer, a conductive coil disposed on a surface of the coil support layer, and a cover layer covering the conductive coil; and

a first and a second external electrode disposed on end surfaces of the body, respectively,

wherein the coil support layer comprises insulating material, the conductive coil comprises conductive material, and the cover layer comprises magnetic material,

wherein a first insulating layer and a second insulating layer are formed on at least a portion of a surface of the conductive coil,

wherein the conductive coil comprises a plurality of conductive patterns, and the conductive patterns are connected to each other within the conductive coil,

wherein the first insulating layer is disposed between adjacent conductive patterns in the conductive coil, and the second insulating layer is formed on at least a portion of a side of the first insulating layer, and

wherein at least a portion of the side of the first insulating layer is higher than an upper side of the conductive coil.

2. The inductor of claim 1, wherein an upper side of the first insulating layer is disposed to be higher than that of the conductive coil.

3. The inductor of claim 1, wherein the width of the first insulating layer disposed between adjacent conductive patterns is smaller than that of the conductive pattern in the conductive coil.

4. The inductor of claim 1, wherein the gap interval between adjacent conductive patterns in the conductive coil is substantially filled with the first insulating layer.

5. The inductor of claim 1, wherein the first insulating layer is formed of a material different from that of the second insulating layer.

6. The inductor of claim 1, wherein the first insulating layer is formed on at least a portion of side and upper surfaces of the conductive coil, and

wherein the second insulating layer is formed on a portion of a surface of the first insulating layer, and on a portion of the surface of the conductive coil on which the first insulating layer is not formed.

7. The inductor of claim 1, wherein the conductive patterns are disposed to form a spiral shape.

8. The inductor of claim 1, wherein the conductive coil is provided in plural, and the plurality of conductive coils are disposed on both surfaces on the coil support layer to be vertically symmetrical to each other.

9. The inductor of claim 1, wherein the second insulating layer is formed of a material containing epoxy.

10. The inductor of claim 1, wherein the second insulating layer has an average thickness of about 0.5 μ

m to about 15 μ

m.

11. The inductor of claim 1, wherein the coil support layer is a substrate formed of an insulating material.

12. The inductor of claim 1, wherein the conductive coil has a thickness of about 100 μ

m or more.

13. The inductor of claim 1, wherein a gap interval of adjacent conductive patterns is about 8 μ

m to about 12 μ

m.

14. An inductor comprising:

a body comprising a coil support layer and a conductive coil disposed on a surface of the coil support layer; and

a first and a second external electrode disposed on end surfaces of the body, respectively,

wherein the coil support layer comprises insulating material and the conductive coil comprises conductive material, and

wherein a first insulating layer and a second insulating layer are formed on at least a portion of a surface of the conductive coil,

wherein the conductive coil comprises a plurality of conductive patterns, and the conductive patterns are connected to each other within the conductive coil,

wherein the first insulating layer is disposed between adjacent conductive patterns in the conductive coil,

wherein the first insulating layer is disposed between adjacent conductive patterns in the conductive coil, and the second insulating layer is formed on at least a portion of a side of the first insulating layer, and

wherein at least a portion of a side of the first insulating layer is higher than an upper side of the conductive coil.

15. The inductor of claim 14, wherein the conductive coil is provided in plural, and the plurality of conductive coils are disposed on both surfaces of the coil support layer to be vertically symmetrical to each other.

16. The inductor of claim 14, wherein the insulating layer has an average thickness of about 0.5 μ

m to about 15 μ

m.

17. The inductor of claim 14, wherein a gap interval of adjacent conductive patterns in the conductive coil is about 8 μ

m to about 12 μ

m.

18. The inductor of claim 14, wherein an upper side of the first insulating layer is disposed to be higher than that of the conductive coil.

19. The inductor of claim 14, wherein the width of the first insulating layer disposed between adjacent conductive patterns is smaller than that of the conductive patterns in the conductive coil.

20. The inductor of claim 14, wherein the first insulating layer is formed on at least a portion of side and upper surfaces of the conductive coil, and

wherein the second insulating layer is formed on a portion of a surface of the first insulating layer, and on a portion of the surface of the conductive coil on which the first insulating layer is not formed.