Substrate for semiconductor package and process for manufacturing
First Claim
Patent Images
1. A semiconductor package, comprising:
- a package substrate comprising;
a dielectric layer;
a first circuit layer disposed on or in the dielectric layer; and
a plurality of pillars disposed on the first circuit layer, wherein each of the pillars has a recess portion in the top end of the pillar;
a die; and
a plurality of solder balls disposed on the die, wherein each of the solder balls is bonded to each of the pillars and kept at the recess portion.
0 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor package substrate includes a core portion, an upper circuit layer and a plurality of pillars. The pillars are disposed on and project upward from the upper circuit layer. Top surfaces of the pillars are substantially coplanar. The pillars provide an electrical interconnect to a semiconductor die. Solder joint reliability as between the substrate and the semiconductor die is improved.
82 Citations
20 Claims
-
1. A semiconductor package, comprising:
-
a package substrate comprising; a dielectric layer; a first circuit layer disposed on or in the dielectric layer; and a plurality of pillars disposed on the first circuit layer, wherein each of the pillars has a recess portion in the top end of the pillar; a die; and a plurality of solder balls disposed on the die, wherein each of the solder balls is bonded to each of the pillars and kept at the recess portion. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A semiconductor package, comprising:
-
a dielectric layer; a first circuit layer disposed on or in the dielectric layer; a plurality of pillars disposed on the first circuit layer, wherein each of the pillars has a recess portion in the top end of the pillar; an insulation material enclosing the pillars; a die attached to the pillars; and a molding compound encapsulating the die. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
-
-
15. A process for making a package substrate, comprising:
-
(a) providing a package substrate, wherein the package substrate includes a dielectric layer and a first circuit layer disposed on or in the dielectric layer; (b) forming a photoresist pattern adjacent to the first circuit layer, wherein the photoresist pattern has a plurality of openings; (c) forming a plurality of pillars in the openings of the photoresist pattern; and (d) removing a part of each of the top ends of the pillar so that each of the pillars has a recess portion in the top end of the pillar. - View Dependent Claims (16, 17, 18, 19, 20)
-
Specification