Conductive connections, structures with such connections, and methods of manufacture

• US 9,437,566 B2
• Filed: 05/12/2014
• Issued: 09/06/2016
• Est. Priority Date: 05/12/2014
• Status: Active Grant

• Current Assignee: Invensas Corporation
• Original Assignee: Invensas Corporation
• Inventors: Katkar, Rajesh, Uzoh, Cyprian Emeka
• Primary Examiner(s): Tsai, H
• Application Number:
  US14/275,514
• Publication Number:
  US 20150325543A1
• Time in Patent Office: 848 Days
• Field of Search: 438613-617, 4613-617
• US Class Current: 1/1
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 3/0623 for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B23K 35/0266 flux-cored
• CPC Class Codes: H01L 21/02225 characterised by the process for the formation of the insulating layer
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/03318 by dispensing droplets
• CPC Class Codes: H01L 2224/0332 Screen printing, i.e. using a stencil
• CPC Class Codes: H01L 2224/0333 in solid form
• CPC Class Codes: H01L 2224/0391 Forming a passivation layer after forming the bonding area
• CPC Class Codes: H01L 2224/05022 the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05073 Single internal layer
• CPC Class Codes: H01L 2224/0508 being stacked
• CPC Class Codes: H01L 2224/051 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/05567 the external layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/056 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/06102 : the bonding areas being at different heights
• CPC Class Codes: H01L 2224/10145 : Flow barriers
• CPC Class Codes: H01L 2224/11001 : Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/11005 : for aligning the bump connector, e.g. marks, spacers
• CPC Class Codes: H01L 2224/11009 : for protecting parts during manufacture
• CPC Class Codes: H01L 2224/111 : Manufacture and pre-treatment of the bump connector preform
• CPC Class Codes: H01L 2224/11318 : by dispensing droplets
• CPC Class Codes: H01L 2224/11334 : using preformed bumps
• CPC Class Codes: H01L 2224/1134 : Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/11849 : Reflowing
• CPC Class Codes: H01L 2224/11901 : with repetition of the same manufacturing step
• CPC Class Codes: H01L 2224/1191 : Forming a passivation layer after forming the bump connector
• CPC Class Codes: H01L 2224/13005 : Structure
• CPC Class Codes: H01L 2224/13017 : being non uniform along the bump connector
• CPC Class Codes: H01L 2224/13018 : comprising protrusions or indentations
• CPC Class Codes: H01L 2224/13021 : the bump connector being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/13022 : the bump connector being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/13078 : being disposed next to each other, e.g. side-to-side arrangements
• CPC Class Codes: H01L 2224/1308 : being stacked
• CPC Class Codes: H01L 2224/13082 : Two-layer arrangements
• CPC Class Codes: H01L 2224/13084 : Four-layer arrangements
• CPC Class Codes: H01L 2224/131 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13116 : Lead [Pb] as principal constituent
• CPC Class Codes: H01L 2224/13139 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13155 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13169 : Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/1319 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/13561 : On the entire surface of the core, i.e. integral coating
• CPC Class Codes: H01L 2224/13562 : On the entire exposed surface of the core
• CPC Class Codes: H01L 2224/136 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13609 : Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/13611 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/1405 : Shape
• CPC Class Codes: H01L 2224/16058 : being non uniform along the bump connector
• CPC Class Codes: H01L 2224/16059 : comprising protrusions or indentations
• CPC Class Codes: H01L 2224/16145 : the bodies being stacked
• CPC Class Codes: H01L 2224/16147 : the bump connector connecting to a bonding area disposed in a recess of the surface
• CPC Class Codes: H01L 2224/16148 : the bump connector connecting to a bonding area protruding from the surface
• CPC Class Codes: H01L 2224/16227 : the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16238 : the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/1701 : Structure
• CPC Class Codes: H01L 2224/1703 : Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/17181 : On opposite sides of the body
• CPC Class Codes: H01L 2224/17505 : Bump connectors having different materials
• CPC Class Codes: H01L 2224/2919 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/73104 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/75253 : adapted for localised heating
• CPC Class Codes: H01L 2224/81 : using a bump connector
• CPC Class Codes: H01L 2224/81138 : the guiding structures being at least partially left in the finished device
• CPC Class Codes: H01L 2224/81141 : Guiding structures both on and outside the body
• CPC Class Codes: H01L 2224/81193 : wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/8121 : using a reflow oven
• CPC Class Codes: H01L 2224/8122 : with energy being in the form of electromagnetic radiation
• CPC Class Codes: H01L 2224/81224 : using a laser
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/81825 : Solid-liquid interdiffusion
• CPC Class Codes: H01L 2224/83 : using a layer connector
• CPC Class Codes: H01L 2224/8385 : using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 2224/9211 : Parallel connecting processes
• CPC Class Codes: H01L 2225/06513 : Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 23/3114 : the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/3135 : Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/08 : of an individual bonding area
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/742 : Apparatus for manufacturing bump connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/98 : Methods for disconnecting semiconductor or solid-state bodies
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/07025 : Polyimide
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15321 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: H01L 2924/381 : Pitch distance
• CPC Class Codes: H01L 2924/3841 : Solder bridging
• CPC Class Codes: H05K 1/115 : Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/144 : Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/09572 : Solder filled plated through-hole in the final product soldering lead-in-hole components H05K3/3447
• CPC Class Codes: H05K 3/341 : Surface mounted components

Abstract

In some embodiments, to increase the height-to-pitch ratio of a solder connection that connects different structures with one or more solder balls, only a portion of a solder ball'"'"'s surface is melted when the connection is formed on one structure and/or when the connection is being attached to another structure. In some embodiments, non-solder balls are joined by an intermediate solder ball (140i). A solder connection may be surrounded by a solder locking layer (1210) and may be recessed in a hole (1230) in that layer. Other features are also provided.

Claims

1. A method for attaching a first conductive component to a second conductive component, the method comprising:

(1) melting a first portion of a surface of the first conductive component without melting a second portion of the surface of the first conductive component even though the second portion'"'"'s melting temperature is no higher than the first portion'"'"'s melting temperature, wherein the second portion is continuous with the first portion;

(2) bringing the melted first portion into physical contact with the second conductive component and cooling the first portion to form a conductive attachment between the first and second conductive components;

wherein the second portion is not melted in operations (1) and (2); and

wherein the first conductive component comprises a core having a higher melting temperature than the first portion of the surface of the first conductive component.

2. The method of claim 1 wherein in operation (2), the melted first portion is brought into physical contact with the second conductive component when the second conductive component is unmelted.

3. The method of claim 1 wherein a maximum pre-melted dimension of the first portion does not exceed 700 μ

m.

4. The method of claim 1 wherein the first portion is melted to a depth not exceeding 500 μ

m.

5. The method of claim 1 wherein the pre-melted volume of a melted portion of the first conductive component does not exceed 50% of the first conductive component.

6. The method of claim 1 wherein the second conductive component is a contact pad of a semiconductor integrated circuit or of a substrate attachable to a semiconductor integrated circuit, or the second conductive component is a connection component that has been attached to such contact pad before operation (1).

7. The method of claim 1 wherein the melting is performed by a beam of electromagnetic radiation.

16. The method of claim 1 wherein the first conductive component does not physically contact the second conductive component during operation (1).

17. The method of claim 1 wherein the entire surface of the first component is the same material.

18. The method of claim 7 wherein the beam of electromagnetic radiation arrives at the first portion without first passing through the second portion.

19. The method of claim 7 wherein the beam of electromagnetic radiation arrives at the first portion without first passing through the first conductive component.

8. A method for fabricating an electrical connection, the method comprising:

providing a first structure which comprises a first contact pad;

forming a first portion of the electrical connection on the first contact pad, the first portion comprising a first component comprising a first surface;

providing a second component of the electrical connection, the second component comprising a second surface comprising solder;

providing a third component of the electrical connection, the third component comprising a third surface;

attaching the second component to the first and third surfaces, wherein said attaching comprises melting the solder to obtain melted solder in physical contact with the first and third surfaces, and re-solidifying the solder to attach the solder to the first and third surfaces, wherein at least one of the first and third surfaces has an unmelted area which is not melted in said attaching even though a melting temperature of the unmelted area is not higher than a highest temperature of the solder in said attaching.

9. The method of claim 8 wherein the first and third surfaces are not melted in said attaching.

10. The method of claim 8 wherein at least one of the first and third surfaces has the same melting temperature as the solder.

11. The method of claim 8 wherein the third component is a solder ball which has the same melting temperature as the second component'"'"'s solder but which is not melted in said attaching.

12. The method of claim 8 wherein the first structure comprises at least one of a semiconductor integrated circuit or a substrate attachable to a semiconductor integrated circuit.

13. The method of claim 8 wherein the melting is performed by a beam of electromagnetic radiation.

14. The method of claim 8 wherein the solder surrounds a core that does not melt in said attaching.

15. The method of claim 8 wherein the melting is performed only once during said attaching.

20. The method of claim 8 wherein the unmelted area physically contacts the melted solder in said attaching.