Methods to form and to dismantle hermetically sealed chambers
First Claim
1. A method for forming a hermetically sealed chamber, the method comprising:
- using room temperature laser bonding to create a hermetic seal between a first element and a second element to form the chamber;
wherein a bond interface of the hermetic seal is configured to allow the hermetic seal to be broken open under controlled conditions using a release technique;
wherein the chamber is formed within is a microfluidic chip comprising a via connected to the chamber; and
wherein the chamber is configured to hold a fluid.
2 Assignments
0 Petitions
Accused Products
Abstract
Embodiments generally relate to methods for forming and dismantling a hermetically sealed chamber. In one embodiment, the method comprises using room temperature laser bonding to create a hermetic seal between a first element and a second element to form a chamber. A bond interface of the hermetic seal is configured to allow the hermetic seal to be opened under controlled conditions using a release technique. In one embodiment, the chamber is formed within a microfluidic chip and the chamber is configured to hold a fluid. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.
8 Citations
13 Claims
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1. A method for forming a hermetically sealed chamber, the method comprising:
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using room temperature laser bonding to create a hermetic seal between a first element and a second element to form the chamber; wherein a bond interface of the hermetic seal is configured to allow the hermetic seal to be broken open under controlled conditions using a release technique; wherein the chamber is formed within is a microfluidic chip comprising a via connected to the chamber; and wherein the chamber is configured to hold a fluid.
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2. A method for forming a hermetically sealed chamber on a chip, the method comprising:
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using room temperature laser bonding to create a hermetic seal between a first element and a second element to form the chamber;
wherein a bond interface of the hermetic seal is configured to allow the hermetic seal to be broken open under controlled conditions using a release technique;wherein the release technique comprises a mechanical technique that creates sufficient tensile or shear stress at the bond interface to open the hermetic seal. - View Dependent Claims (3, 4, 5, 6, 7, 8)
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9. A method for forming a hermetically sealed chamber, the method comprising:
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using room temperature laser bonding to create a hermetic seal between a first element and a second element to form the chamber; wherein a bond interface of the hermetic seal is configured to allow the hermetic seal to be broken open under controlled conditions using a release technique; and wherein the release technique comprises a thermal technique, the first element comprising a first material having a first coefficient of expansion, and the second element comprising a second material having a second coefficient of expansion, different from the first coefficient of expansion. - View Dependent Claims (10, 11)
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12. A method for encapsulating materials on a flow cell chip, the method comprising:
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using room temperature laser bonding to create a first hermetic seal between a first element and a second element encapsulating a first material within a first chamber of the flow cell chip, wherein a first bond interface of the first hermetic seal is configured to allow the first hermetic seal to be broken open under controlled conditions using a release technique; and using room temperature laser bonding to create a second hermetic seal between a third element and a fourth element encapsulating a second material within a second chamber of the flow cell chip, wherein a second bond interface of the second hermetic seal is configured to allow the second hermetic seal to be broken open under controlled conditions using a release technique. - View Dependent Claims (13)
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Specification