System on a chip using integrated MEMS and CMOS devices
First Claim
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1. A method for forming a multiple MEMS and CMOS system, comprising:
- providing a semiconductor substrate having a surface region;
forming a CMOS IC layer overlying the surface region of the semiconductor substrate, the CMOS IC layer having at least one CMOS device being configured to provide a logic and a memory array, the CMOS IC layer having an interface region overlying the at least one CMOS device;
forming at least a first micro electrical mechanical system (MEMS) configured in a first region overlying a first portion of the interface region, wherein the first MEMS is configured to sense first physical perturbations, wherein the first MEMS includes a MEMS transducer comprising;
forming a movable base having four intermediate cavities disposed in an intermediate portion of the movable base structure, the four intermediate cavities each having a cavity surface region;
forming four intermediate anchor structures spatially disposed within the four intermediate cavities, each of the intermediate anchor structures being coupled to at least one portion of the surface region;
forming four intermediate spring structure coupled to at least one portion of each of the cavity surface region, the intermediate spring structures being coupled to the intermediate anchor structures, the spring structures being spatially oriented to be substantially 45degrees or substantially (pi/4) radians to the edges of a die; and
forming a second MEMS configured in a second region overlying a second portion of the interface region, wherein the second MEMS is configured to sense second physical perturbations, the first physical perturbations being different from the second physical perturbations.
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Abstract
An integrated MEMS system in which CMOS and MEMS devices are provided to form an integrated CMOS-MEMS system. The system can include a silicon substrate layer, a CMOS layer, MEMS and CMOS devices, and a wafer level packaging (WLP) layer. The CMOS layer can form an interface region, one which any number of CMOS MEMS devices can be configured.
46 Citations
11 Claims
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1. A method for forming a multiple MEMS and CMOS system, comprising:
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providing a semiconductor substrate having a surface region; forming a CMOS IC layer overlying the surface region of the semiconductor substrate, the CMOS IC layer having at least one CMOS device being configured to provide a logic and a memory array, the CMOS IC layer having an interface region overlying the at least one CMOS device; forming at least a first micro electrical mechanical system (MEMS) configured in a first region overlying a first portion of the interface region, wherein the first MEMS is configured to sense first physical perturbations, wherein the first MEMS includes a MEMS transducer comprising; forming a movable base having four intermediate cavities disposed in an intermediate portion of the movable base structure, the four intermediate cavities each having a cavity surface region; forming four intermediate anchor structures spatially disposed within the four intermediate cavities, each of the intermediate anchor structures being coupled to at least one portion of the surface region; forming four intermediate spring structure coupled to at least one portion of each of the cavity surface region, the intermediate spring structures being coupled to the intermediate anchor structures, the spring structures being spatially oriented to be substantially 45degrees or substantially (pi/4) radians to the edges of a die; and forming a second MEMS configured in a second region overlying a second portion of the interface region, wherein the second MEMS is configured to sense second physical perturbations, the first physical perturbations being different from the second physical perturbations. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for forming a multiple MEMS and CMOS system, comprising:
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forming a semiconductor substrate having a surface region; forming a CMOS IC layer overlying the surface region of the semiconductor substrate, the CMOS IC layer having at least one CMOS device being configured to provide a logic and a memory array, the CMOS IC layer having an interface region overlying the at least one CMOS device; forming at least a first micro electrical mechanical system (MEMS) configured in a first region overlying a first portion of the interface region, wherein the first MEMS is configured to sense first physical perturbations, wherein the first MEMS includes a MEMS differential gyroscope; wherein the gyroscope comprises; eight gyro anchor structures, the gyro anchor structures being coupled to at least one portion of the surface region; two gyro frame structure, the gyro frame structure(s) spatially disposed overlying at least one portion of the surface region; four gyro peripheral structures, the peripheral movable structures spatially disposed overlying at least one portion of the surface region; two gyro central movable structures, the central movable structures spatially disposed overlying at least one portion of the surface region; eight first gyro flexible members, the first gyro flexible members being coupled to at least one portion of the gyro anchor structures and the gyro frame structures; and eight second gyro flexible members, the second gyro flexible members being coupled to at least one portion of the gyro frame structures and the gyro peripheral movable structure(s); and eight gyro flexible structure members, the gyro flexible structure members being coupled to at least one portion of the gyro peripheral movable structures and the gyro central movable structures; wherein the gyroscope is configured to have each central movable structures coupled to two of the peripheral movable structures by four gyro flexible structure members;
wherein two peripheral movable structures are coupled to each gyro frame structure by four second gyro flexible members; and
wherein four of the gyro anchor structures are coupled to each of the gyro frame structures by four first gyro flexible members; andforming a second MEMS configured in a second region overlying a second portion of the interface region, wherein the second MEMS is configured to sense second physical perturbations, the first physical perturbations being different from the second physical perturbations.
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Specification