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Methods for plasma processing

  • US 9,443,702 B2
  • Filed: 06/09/2015
  • Issued: 09/13/2016
  • Est. Priority Date: 07/08/2009
  • Status: Active Grant
First Claim
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1. A method for plasma-based coating of thin films on a substrate, said method comprising:

  • placing a substrate on a support within a chamber such that a side of said substrate to be coated faces at least one electrode of a plurality of electrodes within said chamber, and a minimum gap between said one electrode and said substrate is less than a width of said one electrode, wherein said chamber is connected to a vacuum pump, a gas pressure in said chamber is maintained in a range of 50 Pascals to 2000 Pascals, said plurality of electrodes within said chamber have lengths greater than their widths or heights, and said at least one electrode has a front side opposite said support for said substrate;

    maintaining a part of said substrate adjacent said support at a temperature less than 200°

    C.;

    providing AC power to at least a first electrode of said plurality of electrodes to form a plasma between said first electrode and a second electrode of said plurality of electrodes, and between said first electrode and said substrate providing ion bombardment of said substrate; and

    injecting a first gas into a space between opposing faces of said first and second electrodes to flow towards said substrate in the plasma between said first and second electrodes so that said gas deposits a thin film on said substrate as it flows adjacent said front side of said at least one electrode without recirculation.

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