Method for manufacture of multi-layer wire structure for high efficiency wireless communication
First Claim
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1. A method of manufacturing a wire structure, the method comprising:
- a) forming a plurality of first insulators;
b) forming a plurality of first conductors, each first conductor having a conductor thickness and a conductor skin depth residing within the conductor thickness, wherein the first conductor thickness is about the same or greater than a skin depth thickness; and
c) positioning each first conductor between each of the plurality of first insulators, thereby forming the wire structure having a plurality of alternating first conductors and first insulators so that the wire structure is capable of propagating an electrical signal through the skin depth within the first conductor.
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Abstract
A structure for wireless communication having a plurality of insulator layers, a conductor layer separating each of the insulator layers, and at least one connector connecting two conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
81 Citations
20 Claims
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1. A method of manufacturing a wire structure, the method comprising:
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a) forming a plurality of first insulators; b) forming a plurality of first conductors, each first conductor having a conductor thickness and a conductor skin depth residing within the conductor thickness, wherein the first conductor thickness is about the same or greater than a skin depth thickness; and c) positioning each first conductor between each of the plurality of first insulators, thereby forming the wire structure having a plurality of alternating first conductors and first insulators so that the wire structure is capable of propagating an electrical signal through the skin depth within the first conductor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification