Sensor apparatus and method for producing a sensor apparatus

• US 9,446,944 B2
• Filed: 04/23/2015
• Issued: 09/20/2016
• Est. Priority Date: 04/25/2014
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Ernst, Georg, Theuss, Horst
• Primary Examiner(s): TAYLOR, EARL N
• Application Number:
  US14/693,902
• Publication Number:
  US 20150307344A1
• Time in Patent Office: 516 Days
• Field of Search: 257/415, 734/48, 735/140.1, 735/143.4
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2207/098 Arrangements not provided for in groups B81B2207/092 - B81B2207/097
• CPC Class Codes: B81B 7/0048 between the MEMS die and the substrate
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: G01L 1/148 using semiconductive material, e.g. silicon
• CPC Class Codes: G01L 1/16 using properties of piezoelectric devices
• CPC Class Codes: G01L 19/0069 from the sensor to its support
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

In various embodiments, a sensor apparatus is provided. The sensor apparatus includes a sensor device having a plurality of electrical contacts; a housing having a plurality of sidewalls; and a metal carrier structure, which extends into the housing in a manner passing through two mutually opposite sidewalls from the plurality of sidewalls. The metal carrier structure is embodied in a resilient fashion at least in the direction of a sidewall through which the metal carrier structure extends. The sensor device having the plurality of electrical contacts is mounted in a resilient fashion on the metal carrier structure and is electrically conductively connected to the metal carrier structure by the plurality of contacts.

Claims

1. A sensor apparatus, comprising:

a sensor device having a plurality of electrical contacts;

a housing having a plurality of sidewalls and a base;

a metal carrier structure, which extends into the plurality of sidewalls above the base and into the housing in a manner passing through two mutually opposite sidewalls from the plurality of sidewalls;

wherein the metal carrier structure is spring-like at least in a direction of a sidewall of the mutually opposite sidewalls through which the metal carrier structure extends; and

wherein the sensor device having the plurality of electrical contacts is mounted in a resilient fashion on the metal carrier structure and is electrically conductively connected to the metal carrier structure by the plurality of contacts.

2. The sensor apparatus of claim 1,

wherein the metal carrier structure is a meandering spring structure embodied in a plane of the metal carrier structure.

3. The sensor apparatus of claim 1,

wherein the metal carrier structure is a spring structure embodied as an opening in a plane of the metal carrier structure.

4. The sensor apparatus of claim 2,

wherein the spring structure is embodied between the respective sidewall and a respective contact region of the metal carrier structure with the electrical contact.

5. The sensor apparatus of claim 1,

wherein the sensor device has a pressure sensor.

6. The sensor apparatus of claim 1, further comprising:

a filling material arranged such that it encapsulates the sensor.

7. The sensor apparatus of claim 6,

wherein the filling material is elastic.

8. The sensor apparatus of claim 6,

wherein the filling material comprises silicone.

9. The sensor apparatus of claim 1,

wherein the housing is injection-molded.

10. The sensor apparatus of claim 1, further comprising:

a spacer, wherein the spacer is arranged between the metal carrier structure and the base of the housing.

11. The sensor apparatus of claim 10,

wherein the metal structure is movable relative to the spacer.

18. The sensor apparatus of claim 3,

wherein the spring structure is embodied between the respective sidewall and a respective contact region of the metal carrier structure with the electrical contact.

12. A method for producing a sensor apparatus, the method comprising:

arranging a spacer on a metal carrier structure;

forming a housing having a base below the metal carrier structure and a plurality of sidewalls around a part of the metal carrier structure and the spacer in such a way that the metal carrier structure extends into the housing in a manner passing through two mutually opposite sidewalls from the plurality of sidewalls,

wherein the spacer is between the metal carrier structure and the base of the housing;

wherein the metal carrier structure extends into the plurality of sidewalls above the base;

wherein the metal carrier structure is spring-like at least in a direction of a sidewall of the mutually opposite sidewalls through which the metal carrier structure extends;

resiliently mounting a sensor device, which has a plurality of electrical contacts, on the metal carrier structure by the electrical contacts; and

electrically conductively connecting the sensor device to the metal carrier structure by the plurality of electrical contacts.

13. The method apparatus of claim 12,

wherein forming the housing comprises injection molding.

14. The method apparatus of claim 12, further comprising:

removing the spacer.

15. The method apparatus of claim 12, further comprising:

arranging a filling material.

16. The method apparatus of claim 12,

wherein arranging the filling material comprises introducing liquid silicone by filling.

17. The method apparatus of claim 12,

wherein electrically conductively connecting the sensor device to the metal carrier structure comprises soldering the plurality of electrical contacts onto the metal carrier structure.

19. A sensor apparatus, comprising:

a sensor device having a plurality of electrical contacts;

a housing having a plurality of sidewalls and a base;

a metal carrier structure, which extends into the plurality of sidewalls above the base and into the housing in a manner passing through two mutually opposite sidewalls from the plurality of sidewalls;

wherein the metal carrier structure is independently spring-like at least in a direction of a sidewall of the mutually opposite sidewalls through which the metal carrier structure extends; and

wherein the sensor device having the plurality of electrical contacts is mounted in a resilient fashion on the metal carrier structure and is electrically conductively connected to the metal carrier structure by the plurality of contacts.