Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same
First Claim
Patent Images
1. A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—
- Ag) core-shell particles, a mechanical thixotropic filler that is carbon nanotubes, and hydrocarbon vehicle;
the curable silicone composition being characterized by;
a concentration of the Cu—
Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7 to 14 weight percent, all based on weight of the curable silicone composition;
wherein the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method; and
wherein the curable silicone composition is characterized by a Thixotropic Index (η
1/η
10) of from 3 to 10.
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Abstract
A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu—Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7.0 to 14 weight percent, all based on weight of the curable silicone composition; wherein the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method.
55 Citations
11 Claims
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1. A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—
- Ag) core-shell particles, a mechanical thixotropic filler that is carbon nanotubes, and hydrocarbon vehicle;
the curable silicone composition being characterized by;
a concentration of the Cu—
Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7 to 14 weight percent, all based on weight of the curable silicone composition;
wherein the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method; and
wherein the curable silicone composition is characterized by a Thixotropic Index (η
1/η
10) of from 3 to 10.
- Ag) core-shell particles, a mechanical thixotropic filler that is carbon nanotubes, and hydrocarbon vehicle;
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2. A curable silicone composition comprising a blend of the following ingredients:
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a hydrocarbon vehicle at a concentration of from 4 to 20 weight percent based on weight of the curable silicone composition, wherein the hydrocarbon vehicle is characterized by a boiling point from 100 to 360 degrees Celsius; a curable organosiloxane composition at a concentration of from 7 to 10 weight percent based on weight of the curable silicone composition; Cu—
Ag core-shell particles at a concentration of from 70 to 89 weight percent based on weight of the curable silicone composition; anda mechanical thixotropic filler; wherein the total concentration of silver is from 7 to 14 weight percent based on weight of the curable silicone composition;
wherein the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method; andwherein the curable silicone composition is characterized by a Thixotropic Index(η
1/η
10) of from 3 to 10. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9)
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10. A curable silicone composition comprising a blend of the following ingredients:
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an isoalkanes mixture comprising at least three of (C12-C16)isoalkanes of different molecules wherein the lowest boiling molecules have an initial boiling point of greater than 210 degrees Celsius and the highest boiling molecules have an end boiling point of less than 270 degrees Celsius and the hydrocarbon vehicle is at a concentration of from 4.5 to 12 weight percent based on weight of the curable silicone composition; a hydrosilylation-curable polydimethylsiloxane composition comprising at least one vinyl-functional polydimethylsiloxane compound having on average per molecule at least 1 vinyl moieties, at least one trimethylsiloxy-terminated dimethyl methylhydrogensilicon compound having on average per molecule at least 1.1 Si—
H moieties, a microencapsulated platinum hydrosilylation catalyst, and bis(alpha,omega-glycidoxyalkyl)-dialkyl/(alkyl,alkenyl)siloxane, and bis(alpha,omega-glycidoxyalkyl-D3 to D6 alkyl,hydrogencyclosiloxane; and
wherein the vinyl-functional polydimethylsiloxane compound is from 70 to 75 weight percent, the trimethylsiloxy-terminated dimethyl methylhydrogensilicon compound is from 1 to 5 weight percent, the microencapsulated hydrosilylation catalyst is from 10 to 15 weight percent, the bis(alpha,omega-glycidoxyalkyl)-dialkyl/(alkyl,alkenyl)siloxane is from 1 to 10 weight percent, and the bis(alpha,omega-glycidoxyalkyl-D3 to D6 alkyl,hydrogencyclosiloxane is from 0 to 7 weight percent, all of the curable polydimethylsiloxane composition; and
wherein together the trimethylsiloxy-terminated dimethyl methylhydrogensilicon compound, microencapsulated hydrosilylation catalyst, and the bis(alpha,omega-glycidoxyalkyl)-dialkyl/(alkyl,alkenyl)siloxane, and bis(alpha,omega-glycidoxyalkyl-D3 to D6 alkyl,hydrogencyclosiloxane are from 20 to 30 wt % of the curable organosiloxane composition;Cu—
Ag core-shell particles are at a concentration of from 79.9 to 86.0 weight percent based on weight of the curable silicone composition;wherein the total concentration of silver is from 7.5 to 12 weight percent based on weight of the curable silicone composition; and Carbon nanotubes at a concentration of from 0.50 to 1.2 weight percent based on weight of the curable silicone composition; and wherein the curable silicone composition is characterized by a volume resistivity less than 0.00090 Ohm-centimeter measured according to Volume Resistivity Test Method. - View Dependent Claims (11)
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Specification