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Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same

  • US 9,448,278 B2
  • Filed: 06/22/2015
  • Issued: 09/20/2016
  • Est. Priority Date: 11/06/2009
  • Status: Active Grant
First Claim
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1. An apparatus including a direct fluid-contact thermal block to temperature-control a semiconductive device, comprising:

  • a first laminate type including a plurality of unit block perimeters;

    a base plane second laminate type, wherein the base plane second laminate type includes at least one heat-transfer fluid unit cell, the at least one heat-transfer fluid unit cell including;

    a fluid supply structure including a supply-orifice cross-sectional area; and

    a fluid return structure including a return-orifice cross-sectional area, wherein the supply-orifice cross-sectional area is greater than the return-orifice cross-sectional area;

    a third laminate type including fluid-supply distributors coupled to the fluid supply structure, and fluid-return collectors coupled to the fluid return structure;

    a fourth laminate type including fluid supply- and return routers, respectively, that couple to the respective fluid supply- and return distributors and collectors;

    a fifth laminate type includes fluid supply- and return plenums, respectively, that couple to the respective fluid supply- and return routers; and

    a sixth laminate type including a top plane of the direct fluid-contact thermal block and including supply-fluid inlets and return-fluid outlets, respectively, that are coupled to the respective fluid supply- and return plenums;

    whereinthe first laminate type is 5 mils (thousandths of an inch) thick and is a single layer;

    the base plane second laminate type includes a fluid-flow array of 120 unit cells defined by a 24 unit-cell dimension along an X-axis and a five unit-cell dimension along a Y-axis, and wherein the base plane second laminate type is 5 mils thick and includes a total of 4 layers;

    the third laminate type is 10 mils thick and includes a total of nine layers;

    the fourth laminate type is 10 mils thick and includes a total of nine layers;

    the fifth laminate type is 10 mils thick and includes a total of five layers; and

    the sixth laminate type is 10 mils thick and includes a total of two layers.

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