Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same
First Claim
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1. An apparatus including a direct fluid-contact thermal block to temperature-control a semiconductive device, comprising:
- a first laminate type including a plurality of unit block perimeters;
a base plane second laminate type, wherein the base plane second laminate type includes at least one heat-transfer fluid unit cell, the at least one heat-transfer fluid unit cell including;
a fluid supply structure including a supply-orifice cross-sectional area; and
a fluid return structure including a return-orifice cross-sectional area, wherein the supply-orifice cross-sectional area is greater than the return-orifice cross-sectional area;
a third laminate type including fluid-supply distributors coupled to the fluid supply structure, and fluid-return collectors coupled to the fluid return structure;
a fourth laminate type including fluid supply- and return routers, respectively, that couple to the respective fluid supply- and return distributors and collectors;
a fifth laminate type includes fluid supply- and return plenums, respectively, that couple to the respective fluid supply- and return routers; and
a sixth laminate type including a top plane of the direct fluid-contact thermal block and including supply-fluid inlets and return-fluid outlets, respectively, that are coupled to the respective fluid supply- and return plenums;
whereinthe first laminate type is 5 mils (thousandths of an inch) thick and is a single layer;
the base plane second laminate type includes a fluid-flow array of 120 unit cells defined by a 24 unit-cell dimension along an X-axis and a five unit-cell dimension along a Y-axis, and wherein the base plane second laminate type is 5 mils thick and includes a total of 4 layers;
the third laminate type is 10 mils thick and includes a total of nine layers;
the fourth laminate type is 10 mils thick and includes a total of nine layers;
the fifth laminate type is 10 mils thick and includes a total of five layers; and
the sixth laminate type is 10 mils thick and includes a total of two layers.
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Abstract
An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.
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Citations
18 Claims
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1. An apparatus including a direct fluid-contact thermal block to temperature-control a semiconductive device, comprising:
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a first laminate type including a plurality of unit block perimeters; a base plane second laminate type, wherein the base plane second laminate type includes at least one heat-transfer fluid unit cell, the at least one heat-transfer fluid unit cell including; a fluid supply structure including a supply-orifice cross-sectional area; and a fluid return structure including a return-orifice cross-sectional area, wherein the supply-orifice cross-sectional area is greater than the return-orifice cross-sectional area; a third laminate type including fluid-supply distributors coupled to the fluid supply structure, and fluid-return collectors coupled to the fluid return structure; a fourth laminate type including fluid supply- and return routers, respectively, that couple to the respective fluid supply- and return distributors and collectors; a fifth laminate type includes fluid supply- and return plenums, respectively, that couple to the respective fluid supply- and return routers; and a sixth laminate type including a top plane of the direct fluid-contact thermal block and including supply-fluid inlets and return-fluid outlets, respectively, that are coupled to the respective fluid supply- and return plenums;
whereinthe first laminate type is 5 mils (thousandths of an inch) thick and is a single layer; the base plane second laminate type includes a fluid-flow array of 120 unit cells defined by a 24 unit-cell dimension along an X-axis and a five unit-cell dimension along a Y-axis, and wherein the base plane second laminate type is 5 mils thick and includes a total of 4 layers; the third laminate type is 10 mils thick and includes a total of nine layers; the fourth laminate type is 10 mils thick and includes a total of nine layers; the fifth laminate type is 10 mils thick and includes a total of five layers; and the sixth laminate type is 10 mils thick and includes a total of two layers. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An apparatus including a direct fluid-contact thermal block to temperature-control a semiconductive device, comprising:
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a first laminate type including a plurality of unit block perimeters; a second laminate type includes a fluid supply structure comprising a plurality of fluid supply-orifices and a fluid return structure comprising a plurality of fluid return-orifices, the fluid supply structure and the fluid return structure configured to include a greater number of fluid supply-orifices than fluid return-orifices; a third laminate type including fluid-supply distributors coupled to the fluid supply structure, and fluid-return collectors coupled to the fluid return structure; a fourth laminate type including fluid supply- and return routers, respectively, that couple to the respective fluid supply- and return distributors and collectors; a fifth laminate type includes fluid supply- and return plenums, respectively, that couple to the respective fluid supply- and return routers; and a sixth laminate type including an upper layer of the direct fluid-contact thermal contact block and including supply-fluid inlets and return-fluid outlets, respectively, that are coupled to the respective fluid supply- and return plenums; wherein the first laminate type is 5 mils thick and is a single layer; wherein the second laminate type is 5 mils thick and includes a total of four layers; wherein the third laminate type is 10 mils thick and includes a total of nine layers; wherein the fourth laminate type is 10 mils thick and includes a total of nine layers; wherein the fifth laminate type is 10 mils thick and includes a total of five layers; and wherein the sixth laminate type is 10 mils thick and includes a total of two layers. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
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15. An apparatus including a plurality of layers laminated together to form a direct fluid-contact thermal block configured to temperature-control a semiconductive device, comprising:
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a first laminate type including a first surface; a second laminate type including fluid-supply orifices and fluid-return orifices arranged in a fluid-flow array of unit cells, the unit cells each including two fluid-supply orifices and a single fluid-return orifice positioned between the two fluid-supply orifices; a third laminate type including fluid-supply distributors in communication with the fluid-supply orifices, and fluid-return distributors in communication with the fluid-return orifices; a fourth laminate type including fluid-supply routers in communication with the fluid-supply distributors, and fluid-return routers in communication with the fluid-return distributors; a fifth laminate type including fluid-supply plenums in communication with the fluid-supply routers, and fluid-return plenums in communication with the fluid-return routers; and a sixth laminate type including supply-fluid inlets in communication with the fluid-supply plenums, and return-fluid outlets in communication with the fluid-return plenums; wherein the first laminate type is 5 mils thick and is a single layer; wherein the second laminate type is 5 mils thick and includes a total of four layers; wherein the third laminate type is 10 mils thick and includes a total of nine layers; wherein the fourth laminate type is 10 mils thick and includes a total of nine layers; wherein the fifth laminate type is 10 mils thick and includes a total of five layers; and wherein the sixth laminate type is 10 mils thick and includes a total of two layers. - View Dependent Claims (16, 17, 18)
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Specification