Electromagnetic connectors

• US 9,449,756 B2
• Filed: 05/02/2013
• Issued: 09/20/2016
• Est. Priority Date: 05/02/2013
• Status: Active Grant

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Bedrock Automation Platforms, Inc. (Analog Devices, Inc.)
• Inventors: Calvin, James, Rooyakkers, Albert
• Primary Examiner(s): Barnie, Rexford
• Assistant Examiner(s): Parries, Dru
• Application Number:
  US13/875,858
• Publication Number:
  US 20140327318A1
• Time in Patent Office: 1,237 Days
• Field of Search: 307/104
• US Class Current: 1/1
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01F 41/02 for manufacturing cores, coils, or magnets H01F41/14 takes precedence; for dynamo-electric machines H02K15/00
• CPC Class Codes: Y10T 29/49071 by winding or coiling

Abstract

An electromagnetic connector well suited for use in harsh environments. The connector used an E-core or C-core magnetic members for coupling power such as from a backplane to a module mounted on the backplane and using I-cores for coupling signals to and from the module. Separation of the power and signaling allows optimization of each coupling without compromise in performance of each function. Use of I-cores for signal coupling provides efficient use of space, with the use of E-cores or C-cores providing maximum power coupling to the module in a minimum space. Various aspects of exemplary embodiments are disclosed.

Claims

1. A module to be mounted on a backplane for transferring power and furnishing communications between the module and the backplane, the module comprising:

a first magnetic E-core for transferring power between the module and the backplane, the first magnetic E-core having a center leg and first and second outer legs, the center leg and the first and second outer legs of the first magnetic E-core being joined at a first end thereof and being mounted with a second end thereof adjacent an end of the module, the module having at least one wound coil encircling at least one of the center leg and the first and second outer legs of the first magnetic E-core, the second end of the first magnetic E-core having a protective sheet or layer thereover, the first magnetic E-core to meet with a second magnetic E-core having a center leg and first and second outer legs, the center leg and the first and second outer legs of the second magnetic E-core being joined at one end thereof and being mounted with a second end thereof extending into openings in the backplane, the backplane having a printed coil encircling at least one of the center leg and the first and second outer legs of the second magnetic E-core; and

a first magnetic I-core for furnishing communication between the module and the backplane, the first magnetic I-core having an end thereof mounted adjacent the end of the module, the module having at least one wound coil encircling the first magnetic I-core, the first magnetic I-core to meet with a second magnetic I-core mounted with an end thereof extending into an opening in the backplane, the backplane having a printed coil encircling the second magnetic I-core;

the module being configured so that the second end of each leg of the first magnetic E-core is aligned with the corresponding leg of the second magnetic E-core and the end of the first magnetic I-core is adjacent the end of the second magnetic I-core when the module is mounted to the backplane, wherein the first magnetic E-core is loaded to protrude from a mounting plane of the module, and the first magnetic I-core is positively mounted to a circuit board in the module.

2. The module of claim 1 wherein the at least one wound coil in the module is a coil with multiple taps.

3. The module of claim 1 wherein the second end of the second magnetic E-core in the backplane does not protrude from a module side of the backplane.

4. The module of claim 3 wherein the first magnetic E-core in the module is spring mounted to provide a spring force between the first magnetic E-core in the module and the second magnetic E-core in the backplane when the module is mounted to the backplane.

5. The module of claim 1 wherein the first and second magnetic E-cores are ferrite E-cores.

6. The module of claim 1 further comprising:

at least a third magnetic E-core, the third magnetic E-core mounted adjacent the end of the module like the first magnetic E-core to meet with a fourth magnetic E-core on the backplane like the second magnetic E-core;

at least a third magnetic I-core, the third magnetic I-core mounted adjacent the end of the module like the first magnetic I-core to meet with a fourth magnetic I-core on the backplane like the second magnetic I-core;

the first and second magnetic E-cores being mounted symmetrically with the third and fourth magnetic E-cores about a center of the module; and

the first and second magnetic I-cores being mounted symmetrically with the third and fourth magnetic I-cores about a center of the module;

wherein the module will be functional when mounted to the backplane in a first relative orientation, or a second relative orientation reversed from the first relative orientation.

7. The module of claim 1 wherein the module contains two identical circuits.

8. The module of claim 1 further comprising circuitry for sensing the relative orientation of the module and rerouting power and/or signals.

9. The module of claim 1 wherein the end of the second magnetic I-core in the backplane does not protrude from the module side of the backplane.

10. The module of claim 1 wherein the end of the first magnetic I-core has a protective sheet or layer thereover.

11. The module of claim 1 wherein the second magnetic I-core in the backplane is positively mounted in the backplane.

12. The module of claim 11 wherein the second magnetic I-core in the backplane is mounted in the backplane with an axis of the second magnetic I-core perpendicular to the backplane, and wherein the first magnetic I-core in the module is mounted with an axis substantially collinear with the axis of the second magnetic I-core in the backplane when the module is mounted to the backplane.

13. The module of claim 12 wherein the first and second magnetic I-cores are mounted so that when the module is mounted to the backplane, the ends of the first and second magnetic I-cores are in close proximity without subjecting each other to a mechanical force along their axes.

14. The module of claim 1 wherein the first and second magnetic I-cores are ferrite I-cores.

15. The module of claim 1 wherein both the first and second magnetic E-cores and the first and second magnetic I-cores are ferrite cores, the first and second magnetic E-cores being of one grade of ferrite and the first and second magnetic I-cores being of a second grade of ferrite different from the first grade.

16. A module to be mounted on a backplane for transferring power and furnishing communications between the module and the backplane, the module comprising:

a first magnetic C-core for transferring power between the module and the backplane, the first magnetic C-core having first and second legs, the first and second legs of the first magnetic C-core being joined at a first end thereof and being mounted with a second end thereof adjacent an end of the module, the module having at least one wound coil encircling at least one of the first and second legs of the first magnetic C-core, the second end of the first magnetic C-core having a protective sheet or layer thereover, the first magnetic C-core to meet with a second magnetic C-core having first and second legs, the first and second legs of the second magnetic C-core being joined at one end thereof and being mounted with a second end thereof extending into openings in the backplane, the backplane having a printed coil encircling at least one of the first and second legs of the second magnetic C-core; and

a first magnetic I-core for furnishing communication between the module and the backplane, the first magnetic I-core having an end thereof mounted adjacent the end of the module, the module having at least one wound coil encircling the first magnetic I-core, the first magnetic I-core to meet with a second magnetic I-core mounted with an end thereof extending into an opening in the backplane, the backplane having a printed coil encircling the second magnetic I-core;

the module being configured so that the second end of each leg of the first magnetic C-core is aligned with the corresponding leg of the second magnetic C-core and the end of the first magnetic I-core is adjacent the end of the second magnetic I-core when the module is mounted to the backplane, wherein the first magnetic C-core is loaded to protrude from a mounting plane of the module, and the first magnetic I-core is positively mounted to a circuit board in the module.

17. The module of claim 16 wherein the at least one wound coil in the module is a coil with multiple taps.

18. The module of claim 16 wherein the second end of the second magnetic C-core in the backplane does not protrude from a module side of the backplane.

19. The module of claim 18 wherein the first magnetic C-core in the module is spring mounted to provide a spring force between the first magnetic C-core in the module and the second magnetic C-core in the backplane when the module is mounted to the backplane.

20. The module of claim 16 wherein the first and second magnetic C-cores are ferrite C-cores.

21. The module of claim 16 further comprising:

at least a third magnetic C-core, the third magnetic C-core mounted adjacent the end of the module like the first magnetic C-core to meet with a fourth magnetic C-core on the backplane like the second magnetic C-core;

at least a third magnetic I-core, the third magnetic I-core mounted adjacent the end of the module like the first magnetic I-core to meet with a fourth magnetic I-core on the backplane like the second magnetic I-core;

the first and second magnetic C-cores being mounted symmetrically with the third and fourth magnetic C-cores about a center of the module; and

the first and second magnetic I-cores being mounted symmetrically with the third and fourth magnetic I-cores about a center of the module;

wherein the module will be functional when mounted to the backplane in a first relative orientation, or a second relative orientation reversed from the first relative orientation.

22. The module of claim 21 wherein the module contains two identical circuits.

23. The module of claim 21 further comprising circuitry for sensing the relative orientation of the module and rerouting power and/or signals.

24. The module of claim 16 wherein the end of the second magnetic I-core in the backplane does not protrude from the module side of the backplane.

25. The module of claim 16 wherein the end of the first magnetic I-core has a protective sheet or layer thereover.

26. The module of claim 16 wherein the second magnetic I-core in the backplane is positively mounted in the backplane.

27. The module of claim 26 wherein the second magnetic I-core in the backplane is mounted in the backplane with an axis of the second magnetic I-core perpendicular to the backplane, and wherein the first magnetic I-core in the module is mounted with an axis substantially collinear with the axis of the second magnetic I-core in the backplane when the module is mounted to the backplane.

28. The module of claim 27 wherein the first and second magnetic I-cores are mounted so that when the module is mounted to the backplane, the ends of the first and second magnetic I-cores are in close proximity without subjecting each other to a mechanical force along their axes.

29. The module of claim 16 wherein the first and second magnetic I-cores are ferrite I-cores.

30. The module of claim 16 wherein both the first and second magnetic C-cores and the first and second magnetic I-cores are ferrite cores, the first and second magnetic C-cores being of one grade of ferrite and the first and second magnetic I-cores being of a second grade of ferrite different from the first grade.

31. A method of coupling power from a backplane to a module to be coupled to the backplane and furnishing communications between the module and the backplane, the method comprising:

mounting at least one of a first magnetic C-core or E-core on a backplane circuit board for transferring power between the module and the backplane, the first magnetic C-core or E-core with faces thereof extending into openings in the backplane circuit board, the backplane circuit board having at least one planar coil encircling at least one leg of the at least one of the first magnetic C-core or E-core;

providing at least one of a second magnetic C-core or E-core mounted in a module for transferring power between the module and the backplane, the second magnetic C-core or E-core with faces thereof adjacent a module surface, the module having a wire wound coil encircling at least one leg of the at least one of the second magnetic C-core or E-core, an end of the at least one of the second magnetic C-core or E-core adjacent an end of the module having a protective sheet or layer thereover, the at least one of the second magnetic C-core or E-core loaded to protrude from a mounting plane of the module;

mounting a first magnetic I-core for furnishing communication between the module and the backplane, the first magnetic I-core with an end thereof passing through an opening in the backplane circuit board, the backplane circuit board having a printed coil encircling the first magnetic I-core; and

providing a second magnetic I-core for furnishing communication between the module and the backplane, the second magnetic I-core with an end thereof adjacent the end of the module, the module having at least one wound coil encircling the second magnetic I-core, the second magnetic I-core positively mounted to a circuit board in the module;

wherein when the module is coupled to the backplane, the faces of the at least one of the second magnetic C-core or E-core on the module will be adjacent to the faces of the at least one of the first magnetic C-core or E-core, and the end of the second magnetic I-core will be adjacent to the end of the first magnetic I-core.

32. The method of claim 31 wherein the wire wound coil on the at least one of the second magnetic C-core or E-core is provided with multiple taps.

33. The method of claim 31 wherein the at least one of the first magnetic C-core or E-core in the backplane does not protrude from a module side of the backplane.

34. The method of claim 33 further comprising spring mounting the at least one of the second magnetic C-core or E-core in the module to provide a spring force between the at least one of the first magnetic C-core or E-core in the module and the at least one of the second magnetic C-core or E-core in the backplane when the module is mounted to the backplane.

35. The method of claim 31 wherein the at least one of the first magnetic C-core or E-core and the at least one of the second magnetic C-core or E-core are ferrite cores.

36. The method of claim 31 further comprising:

providing at least one of a third magnetic C-core or E-core;

providing at least one of a fourth magnetic C-core or E-core;

configuring the at least one of the third magnetic C-core or E-core like the at least one of the first magnetic C-core or E-core and the at least one of the fourth magnetic C-core or E-core like the at least one of the second magnetic C-core or E-core;

providing at least third and fourth magnetic I-cores;

configuring the third magnetic I-core like the first magnetic I-core and the fourth magnetic I-core like the second magnetic I-core;

mounting the at least one of the third magnetic C-core or E-core symmetrically with the at least one of the first magnetic C-core or E-core and the at least one of the fourth magnetic C-core or E-core symmetrically with the at least one of the third magnetic C-core or E-core about a center of the module; and

mounting the third and fourth magnetic I-cores symmetrically with the first and second magnetic I-cores about the center of the module;

wherein the module will be functional when mounted to the backplane in a first relative orientation, or a second relative orientation reversed from the first relative orientation.

37. The method of claim 36 wherein the module contains two identical circuits.

38. The method of claim 36 wherein the module includes circuitry for sensing the relative orientation of the module and rerouting power and/or signals.

39. The method of claim 31 wherein the first magnetic I-core is mounted so that the end of the first magnetic I-core in the backplane does not protrude from a module side of the backplane.

40. The method of claim 31 further comprising providing a protective sheet or layer over the ends of each of the first and second magnetic I-cores.

41. The method of claim 31 wherein the first magnetic I-core in the backplane is positively mounted in the backplane.

42. The method of claim 41 wherein the first magnetic I-core in the backplane is mounted in the backplane with an axis of the first magnetic I-core perpendicular to the backplane, and wherein the second magnetic I-core in the module is mounted with an axis substantially collinear with the axis of the first magnetic I-core in the backplane when the module is mounted to the backplane.

43. The method of claim 42 wherein the first and second magnetic I-cores are mounted so that when the module is mounted to the backplane, the ends of the first and second magnetic I-cores are in close proximity without subjecting each other to a mechanical force along their axes.

44. The method of claim 31 wherein the first and second magnetic I-cores are ferrite I-cores.

45. The method of claim 31 wherein both the at least one of the first magnetic C-core or E-core and the at least one of the second magnetic C-core or E-core, and the first and second magnetic I-cores are ferrite cores, the at least one of the first magnetic C-core or E-core and the at least one of the second magnetic C-core or E-core being of one grade of ferrite and the first and second magnetic I-cores being of a second grade of ferrite different from the first grade of ferrite.

46. A connector for signal transmission for at least one of a backplane to a module mounted on the backplane, and a module to a backplane to which the module is mounted, and for transferring power between the module and the backplane, the connector comprising:

at least one of a first magnetic C-core or E-core and at least one of a second magnetic C-core or E-core for transferring power between the module and the backplane;

the at least one of the first magnetic C-core or E-core being mounted on a backplane with faces thereof extending into openings in the backplane, the backplane having at least one planar coil encircling at least one leg of the at least one of the first magnetic C-core or E-core;

the at least one of the second magnetic C-core or E-core being mounted in a module with faces thereof adjacent a module surface, the module having a wire wound coil encircling at least one leg of the at least one of the second magnetic C-core or E-core, an end of the at least one of the second magnetic C-core or E-core adjacent an end of the module having a protective sheet or layer thereover, the at least one of the second magnetic C-core or E-core loaded to protrude from a mounting plane of the module;

first and second magnetic I-cores for furnishing communication between the module and the backplane;

the first magnetic I-core being mounted with an end thereof passing into an opening in the backplane, the backplane having a printed coil encircling the first magnetic I-core;

the second magnetic I-core having an end thereof adjacent the end of the module, the module having at least one wound coil encircling the second magnetic I-core, the second magnetic I-core positively mounted in the module;

the backplane and the module also being configured so that the faces of the at least one of the first magnetic C-core or E-core are adjacent the faces of the at least one of the second magnetic C-core or E-core and the end of the first magnetic I-core is adjacent the end of the second magnetic I-core when the module is mounted to the backplane.

47. The connector of claim 46 further comprising:

at least third and fourth magnetic I-cores, the third magnetic I-core on the backplane like the first magnetic I-core and the fourth magnetic I-core mounted adjacent the end of the module like the second magnetic I-core;

the first and second magnetic I-cores being mounted symmetrically with the third and fourth magnetic I-cores about a center of the module;

wherein the connector will be functional when the module is mounted to the backplane in a first relative orientation, or a second relative orientation reversed from the first relative orientation.

48. The connector of claim 47 wherein the module contains two identical circuits.

49. The connector of claim 47 wherein the module includes circuitry for sensing the relative orientation of the module and rerouting signals.

50. The connector of claim 46 wherein the end of the first magnetic I-core in the backplane does not protrude from a module side of the backplane.

51. The connector of claim 46 wherein the ends of each of the first and second magnetic I-cores have a protective sheet or layer thereover.

52. The connector of claim 46 wherein the first magnetic I-core in the backplane is mounted in the backplane with an axis of the first magnetic I-core perpendicular to the backplane, and wherein the second magnetic I-core in the module is mounted with an axis substantially collinear with the axis of the first magnetic I-core in the backplane when the module is mounted to the backplane.

53. The connector of claim 52 wherein the first and second magnetic I-cores are mounted so that when the module is mounted to the backplane, the first and second magnetic I-cores are in close proximity without subjecting each other to a mechanical force along their axes.

54. The connector of claim 46 wherein the first and second magnetic I-cores are ferrite I-cores.