×

Method for manufacturing semiconductor device

  • US 9,449,852 B2
  • Filed: 06/26/2014
  • Issued: 09/20/2016
  • Est. Priority Date: 04/28/2010
  • Status: Active Grant
First Claim
Patent Images

1. A method of manufacturing a semiconductor device, comprising the steps of:

  • forming a first insulating layer;

    performing a plasma treatment using a chlorine gas to concurrently introduce chlorine and oxygen to the first insulating layer;

    forming an oxide semiconductor layer over the first insulating layer;

    forming a second insulating layer over the oxide semiconductor layer;

    introducing oxygen to the oxide semiconductor layer through the second insulating layer;

    performing a heat treatment on the oxide semiconductor layer;

    etching a part of the second insulating layer after performing the heat treatment; and

    forming a source electrode and a drain electrode electrically connected to the oxide semiconductor layer after introducing the oxygen to the oxide semiconductor layer.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×