Method for manufacturing semiconductor device
First Claim
1. A method of manufacturing a semiconductor device, comprising the steps of:
- forming a first insulating layer;
performing a plasma treatment using a chlorine gas to concurrently introduce chlorine and oxygen to the first insulating layer;
forming an oxide semiconductor layer over the first insulating layer;
forming a second insulating layer over the oxide semiconductor layer;
introducing oxygen to the oxide semiconductor layer through the second insulating layer;
performing a heat treatment on the oxide semiconductor layer;
etching a part of the second insulating layer after performing the heat treatment; and
forming a source electrode and a drain electrode electrically connected to the oxide semiconductor layer after introducing the oxygen to the oxide semiconductor layer.
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Abstract
A semiconductor device including an oxide semiconductor with stable electric characteristics and high reliability is provided. An island-shaped oxide semiconductor layer is formed by using a resist mask, the resist mask is removed, oxygen is introduced (added) to the oxide semiconductor layer, and heat treatment is performed. The removal of the resist mask, introduction of the oxygen, and heat treatment are performed successively without exposure to the air. Through the oxygen introduction and heat treatment, impurities such as hydrogen, moisture, a hydroxyl group, or hydride are intentionally removed from the oxide semiconductor layer, whereby the oxide semiconductor layer is highly purified. Chlorine may be introduced to an insulating layer over which the oxide semiconductor layer is formed before formation of the oxide semiconductor layer. By introducing chlorine, hydrogen in the insulating layer can be fixed, thereby preventing diffusion of hydrogen from the insulating layer into the oxide semiconductor layer.
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Citations
14 Claims
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1. A method of manufacturing a semiconductor device, comprising the steps of:
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forming a first insulating layer; performing a plasma treatment using a chlorine gas to concurrently introduce chlorine and oxygen to the first insulating layer; forming an oxide semiconductor layer over the first insulating layer; forming a second insulating layer over the oxide semiconductor layer; introducing oxygen to the oxide semiconductor layer through the second insulating layer; performing a heat treatment on the oxide semiconductor layer; etching a part of the second insulating layer after performing the heat treatment; and forming a source electrode and a drain electrode electrically connected to the oxide semiconductor layer after introducing the oxygen to the oxide semiconductor layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of manufacturing a semiconductor device, comprising the steps of:
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forming a gate electrode over a substrate; forming a gate insulating layer over the gate electrode; performing a plasma treatment using a chlorine gas to concurrently introduce chlorine and oxygen to the gate insulating layer; forming an oxide semiconductor layer over the gate insulating layer; forming an insulating layer over the oxide semiconductor layer; introducing oxygen to the oxide semiconductor layer through the insulating layer; performing a heat treatment on the oxide semiconductor layer; etching a part of the insulating layer after performing the heat treatment; and forming a source electrode and a drain electrode electrically connected to the oxide semiconductor layer after introducing the oxygen to the oxide semiconductor layer. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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Specification