Control and driver circuits on a power quad flat no-lead (PQFN) leadframe

• US 9,449,957 B2
• Filed: 01/08/2014
• Issued: 09/20/2016
• Est. Priority Date: 12/13/2010
• Status: Active Grant

• Current Assignee: Infineon Technologies Americas Corp. (Infineon Technologies AG)
• Original Assignee: Infineon Technologies Americas Corp. (Infineon Technologies AG)
• Inventors: Fernando, Dean, Barbosa, Roel, Takahashi, Toshio
• Primary Examiner(s): Gumedzoe, Peniel M
• Application Number:
  US14/150,469
• Publication Number:
  US 20140117518A1
• Time in Patent Office: 986 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4903 Connectors having different sizes, e.g. different diameters
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49513 having bonding material between chip and die pad
• CPC Class Codes: H01L 23/4952 the additional leads being a bump or a wire
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49548 : Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/49562 : for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/49575 : Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/18 : the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13064 : High Electron Mobility Transistor [HEMT, HFET [heterostructure FET], MODFET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

According to an exemplary implementation, a power quad flat no-lead (PQFN) leadframe includes U-phase and W-phase power switches situated on the PQFN leadframe and respectively connected to a U-phase output strip and a W-phase output pad of the PQFN leadframe. The PQFN leadframe further includes a common integrated circuit (IC) including a driver circuit and a control circuit where the common IC is connected to the U-phase output strip and to the W-phase output pad of the PQFN leadframe. The PQFN leadframe can also include a V-phase power switch situated on the PQFN leadframe where the V-phase power switch is connected to a V-phase output strip of the PQFN leadframe.

Claims

1. A power quad flat no-lead (PQFN) package comprising:

U-phase and W-phase power switches situated on a leadframe and respectively connected to a U-phase output strip and a W-phase output pad of said leadframe;

a common integrated circuit (IC) comprising a driver circuit and a control circuit, said common IC being connected to said U-phase output strip and to said W-phase output pad of said leadframe;

wherein said U-phase output strip extends from a U-phase output pad at a first edge of said PQFN package to a second edge on an opposite side of said PQFN package.

2. The PQFN package of claim 1, further comprising a V-phase power switch situated on said leadframe, said V-phase power switch connected to a V-phase output strip of said leadframe.

3. The PQFN package of claim 1, further comprising at least one wirebond connecting said common IC to said U-phase output strip.

4. The PQFN package of claim 1 wherein said W-phase power switch is situated on said W-phase output pad.

5. The PQFN package of claim 1, wherein said W-phase output pad is connected to a W-phase output strip of said leadframe.

6. The PQFN package of claim 1, further comprising a common supply voltage terminal for said driver circuit and said control circuit.

7. The PQFN package of claim 5, further comprising a leadframe island situated on said W-phase output strip.

8. The PQFN package of claim 7 wherein said leadframe island is exposed on a bottom-side of said PQFN package.

9. The PQFN package of claim 1, further comprising at least one wirebond connected between said common IC and a source of said U-phase power switch.

10. The PQFN package of claim 1, wherein said U-phase and W-phase power switches comprise group III-V transistors.

11. The PQFN package of claim 1, wherein said PQFN package has a footprint of greater than 12 mm by 12 mm.

12. The PQFN package of claim 1, wherein said PQFN package has a footprint of less than 12 mm by 12 mm.

13. A power quad flat no-lead (PQFN) package comprising:

a multi-phase power inverter situated on a leadframe, said multi-phase power inverter including a U-phase output connected to a U-phase output strip of said leadframe and a W-phase output connected to a W-phase output pad of said leadframe;

a common integrated circuit (IC) comprising a driver circuit and a control circuit, said common IC being connected to said U-phase output strip and to said W-phase output pad of said leadframe;

wherein said U-phase output strip extends from a U-phase output pad at a first edge of said PQFN package to a second edge on an opposite side of said PQFN package.

14. The PQFN package of claim 13, wherein said multi-phase power inverter further includes a V-phase output connected to a V-phase output strip of said leadframe.

15. The PQFN package of claim 13, further comprising at least one wirebond connecting said common IC to said U-phase output strip.

16. The PQFN package of claim 13, wherein said W-phase output pad is connected to a W-phase output strip of said leadframe.

17. The PQFN package of claim 13, further comprising a common supply voltage terminal for said driver circuit and said control circuit.

18. The PQFN package of claim 13, further comprising at least one wirebond connected between said common IC and a source of said multi-phase power inverter.

19. A power quad flat no-lead (PQFN) package comprising:

U-phase and V-phase power switches situated on a leadframe and respectively connected to a U-phase output strip and a V-phase output strip of said leadframe;

a common integrated circuit (IC) comprising a driver circuit and a control circuit, said common IC being connected to said U-phase output strip and to said V-phase output strip of said leadframe;

wherein said U-phase output strip extends from a U-phase output pad at a first edge of said PQFN package to a second edge on an opposite side of said PQFN package.

20. The PQFN package of claim 19, further comprising at least one wirebond connecting said common IC to said U-phase output strip.

21. The PQFN package of claim 19, further comprising at least one wirebond connecting said common IC to said V-phase output strip.

22. The PQFN package of claim 19, further comprising a W-phase power switch situated on a W-phase output pad of said leadframe.

23. The PQFN package of claim 19, further comprising a W-phase power switch situated on said leadframe, said W-phase power switch connected to a W-phase output strip of said leadframe.