Methods and devices for fabricating and assembling printable semiconductor elements
First Claim
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1. A stretchable semiconductor element comprising:
- an elastic substrate having a supporting surface; and
a stretchable semiconductor structure having a curved internal surface, wherein said stretchable semiconductor structure is a single crystalline semiconductor material, wherein said curved internal surface is continuously bonded to said supporting surface while said elastic substrate is in an expanded state, wherein said curved internal surface has at least one convex region and at least one concave region, and wherein said stretchable semiconductor structure comprises a bent structure under strain resulting from application of a force arising from allowing said elastic substrate to relax from the expanded state.
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Abstract
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
401 Citations
15 Claims
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1. A stretchable semiconductor element comprising:
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an elastic substrate having a supporting surface; and a stretchable semiconductor structure having a curved internal surface, wherein said stretchable semiconductor structure is a single crystalline semiconductor material, wherein said curved internal surface is continuously bonded to said supporting surface while said elastic substrate is in an expanded state, wherein said curved internal surface has at least one convex region and at least one concave region, and wherein said stretchable semiconductor structure comprises a bent structure under strain resulting from application of a force arising from allowing said elastic substrate to relax from the expanded state. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A stretchable electrical circuit comprising:
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an elastic substrate having a supporting surface; and an electrical circuit having a curved internal surface, wherein the electrical circuit comprises at least one stretchable semiconductor structure, wherein said at least one stretchable semiconductor structure is a single crystalline semiconductor material, wherein said curved internal surface of said electrical circuit is continuously bonded to said supporting surface of said elastic substrate while said elastic substrate is in an expanded state, wherein said electrical circuit is in a bent conformation, and wherein said electrical circuit having said curved internal surface is under strain resulting from application of a force arising from allowing said elastic substrate to relax from the expanded state. - View Dependent Claims (12, 13, 14, 15)
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Specification