Radio frequency devices having reduced intermodulation distortion
DCFirst Claim
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1. A semiconductor die comprising:
- a semiconductor substrate;
a first switch circuit formed on the semiconductor substrate connected between an antenna node and a transmit node;
a second switch circuit formed on the semiconductor substrate and connected between the antenna node and a receive node;
a first capacitor formed on the semiconductor substrate and connected in series with the first switch circuit between the first switch circuit and the antenna node;
a second capacitor formed on the semiconductor substrate and connected in series with the second switch circuit between the second switch circuit and the antenna node; and
a first shunt arm formed on the semiconductor substrate and connected to the first switch circuit and the transmit node, the first shunt arm including a third switch circuit connected to ground.
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Abstract
Radio-frequency (RF) devices are disclosed providing reduced intermodulation distortion. Disclosed RF and semiconductor devices can include a semiconductor substrate, a switch formed on the semiconductor substrate having a stack of field-effect transistors (FETs) connected in series, and a capacitor formed on the semiconductor substrate and connected in series with the switch, the capacitor configured to inhibit a low-frequency blocker signal from mixing with a fundamental-frequency signal in the switch.
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Citations
18 Claims
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1. A semiconductor die comprising:
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a semiconductor substrate; a first switch circuit formed on the semiconductor substrate connected between an antenna node and a transmit node; a second switch circuit formed on the semiconductor substrate and connected between the antenna node and a receive node; a first capacitor formed on the semiconductor substrate and connected in series with the first switch circuit between the first switch circuit and the antenna node; a second capacitor formed on the semiconductor substrate and connected in series with the second switch circuit between the second switch circuit and the antenna node; and a first shunt arm formed on the semiconductor substrate and connected to the first switch circuit and the transmit node, the first shunt arm including a third switch circuit connected to ground. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for operating a radio-frequency (RF) device, the method comprising:
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providing an RF device including a first switch circuit connected between an antenna node and a transmit node, a second switch circuit connected between the antenna node and a receiver node, a first capacitor connected in series with the first switch circuity between the first switch circuit and the antenna node, a second capacitor connected in series with the second switch circuit between the second switch circuit and the antenna node, and a first shunt arm connected to the first switch circuit and the transmit node, the first shunt arm including a third switch circuit connected to ground; controlling an RF switch of the RF device by placing the first switch circuit in an ON state and placing the third switch circuit in an OFF state; and inhibiting a low-frequency blocker signal from mixing with a fundamental-frequency signal in the RF switch using the first capacitor. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A wireless device comprising:
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a transceiver configured to process RF signals; an antenna in communication with the transceiver; and a switch module interconnected to the antenna and the transceiver and configured to selectively route RF signals to and from the antenna, the switch module including a first switch connected between the antenna and a transmit node, a second switch connected between the antenna and a receive node, a first capacitor connected in series with the first switch between the first switch and the antenna, a second capacitor connected in series with the second switch between the second switch and the antenna, and a first shunt arm connected to the first switch and the transmit node, the first shunt arm including a third switch connected to ground. - View Dependent Claims (14, 15, 16, 17, 18)
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Specification