Damage index predicting system and method for predicting damage-related index

• US 9,451,709 B2
• Filed: 07/20/2009
• Issued: 09/20/2016
• Est. Priority Date: 09/17/2008
• Status: Active Grant

• Current Assignee: Toshiba Memory Corporation (Kioxia Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Monda, Tomoko, Mukai, Minoru, Hirohata, Kenji
• Primary Examiner(s): Toatley, Gregory J
• Assistant Examiner(s): DALBO, MICHAEL J
• Application Number:
  US12/505,758
• Publication Number:
  US 20100070204A1
• Time in Patent Office: 2,619 Days
• Field of Search: 702/35, 702/184
• US Class Current: 1/1
• CPC Class Codes: H05K 1/0268 for electrical inspection or testing
• CPC Class Codes: H05K 2201/10204 Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
• CPC Class Codes: H05K 2201/10522 Adjacent components
• CPC Class Codes: H05K 2201/10545 Related components mounted on both sides of the PCB
• CPC Class Codes: H05K 2203/163 Monitoring a manufacturing process
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A damage index predicting system is for predicting a damage-related index of solder joints of an electronic device having the solder joints that electrically connect an electronic component to a mounting circuit board and one or more detection solder joints that are designed so as to have a shorter life than the solder joints. The system includes: a database configured to store a fracture relationship between the detection solder joints and the solder joints; a fracture detector configured to detect fracture of the detection solder joints; and a processor configured to calculate a prediction value of the damage-related index of the solder joints based on information relating to the fracture of the detection solder joints obtained by the fracture detector and the fracture relationship stored in the database.

Claims

1. A fracture life predicting system for predicting a fracture life of solder joints of an electronic device having the solder joints that electrically connect an electronic component to a mounting circuit board, the system comprising:

a fracture detector comprising a plurality of detection solder joints that are designed so as to have a shorter life than the solder joints, the plurality of detection solder joints mounted on a surface of the mounting circuit board so that no electrical signals for functioning of the electronic component pass through the plurality of detection solder joints, the surface being between the mounting circuit board and the electronic component, the fracture detector configured to detect fracture of each of the plurality of detection solder joints and obtain a fracture life of each detection solder joint at a time point when the detection solder joint is fractured;

a state parameter database configured to store data of a state parameter of the solder joints and each of the plurality of detection solder joints;

a fatigue characteristic database configured to store fatigue characteristic data indicating a relationship between the state parameter of the solder joints and the fracture life of the solder joints;

a correction processor configured to receive fracture detection information of each of the plurality of detection solder joints from the fracture detector and to correct the fatigue characteristic data of the solder joints stored in the fatigue characteristic database by shifting a line representing a relationship between a value of the fracture life and a value of the state parameter of each of the plurality of detection solder joints with a constant slope; and

a processor configured to receive the data of the state parameter of the solder joints and the plurality of detection solder joints from the state parameter database and the corrected fatigue characteristic data from the fatigue characteristic database and to calculate a prediction value of the fracture life of each of the solder joints,

wherein the detection solder joints are disposed in a position more towards a corner of the mounting circuit board than the solder joints, and

wherein the detection solder joints are arranged so as to have different distances from the corner.

2. The system of claim 1 further comprising a display output unit configured to display the prediction value of the damage-related index of the solder joints calculated by the processor.

3. The system of claim 1, wherein the state parameter database is configured to store data of at least one of temperature, load, stress, displacement, and strain.

4. The system of claim 1 further comprising a design-information and material database configured to store design information and material information relating to the electronic component,

wherein the state parameter of the solder joints comprises a strain range value of the solder joints, and

wherein the state parameter database is configured to store data of the strain range of the solder joints obtained by receiving necessary information from the design-information and material database and performing a phenomenological analysis.

5. The system of claim 1, wherein the state parameter comprises a strain range value, and wherein the correction processor is configured to correct the fatigue characteristic data in accordance with the strain range value of the solder joints predicted from a result of a phenomenological analysis and information relating to a state of the circuit board and an actually obtained value of the fracture life of the solder joints.

6. The system of claim 1 further comprising:

a measuring module configured to measure information relating to a state of the circuit board;

a design information database configured to store design information relating to the electronic component;

a response curved surface database configured to store response curved surface data to be used for calculating a strain range value of the solder joints based on the information relating to the circuit board measured by the measuring module and the design information relating to the electronic component; and

a strain range processor configured to retrieve the information relating to the circuit board, the design information, and the response curved surface data from the measuring module, the design information database, and the response curved surface database, respectively, and calculate strain range values of the solder joints and the detection solder joints,

wherein the state parameter database is configured to store data of strain range values calculated by the strain range processor in real time during use of the electronic device.

7. The system of claim 6, wherein the information relating to the state of the circuit board comprises at least one of temperature, strain, stress, acceleration, and electrical resistance.

8. The system of claim 7, wherein materials of the circuit board, and a package substrate of the electronic component are selected so that linear expansion coefficients of the circuit board and the package substrate of the electronic component increase in this order.

9. The system of claim 1, wherein the detection solder joints are smaller in diameter than the solder joints.

10. The system of claim 1, wherein the detection solder joints are disposed in a set and are incorporated in a single circuit.

11. The system of claim 1, wherein the correction processor is configured to calculate an average of values of the fracture life and to correct the fatigue characteristic data with the average every time one of the detection solder joints is fractured.

12. The system of claim 1, wherein the correction processor is configured to employ, as a life prediction value of the solder joints, a smallest one of life prediction values every time one of the detection solder joints is fractured.

13. The system of claim 1, wherein the fatigue characteristic database stores a life ratio between a fracture life of the detection solder joints and a fracture life of the solder joints, and

wherein the processor calculate the prediction value based on the fracture life of each of the detection solder joints obtained by the fracture detector at the time point when the detection solder joint is fractured and the life ratio stored in the fatigue characteristic database.

14. A method for predicting a of solder joints of an electronic device having the solder joints that electrically connect an electronic component to a mounting circuit board, the method comprising:

storing, in a state parameter database, data of a state parameter of the solder joints and each of a plurality of detection solder joints;

storing, in a fatigue characteristic database, fatigue characteristics data indicating a relationship between the state parameter of the solder points and the fracture life of the solder joints;

detecting, via a fracture detector comprising detection solder joints that are designed so as to have a shorter life than the solder joints, and are mounted on a surface of the mounting circuit board, the surface being between the mounting circuit board and the electronic component, fracture of the detection solder joints, and obtaining a fracture life of each detection solder joint at a time point when the detection solder joint is fractured;

receiving, at a correction processor, fracture detection information of each of the plurality of detection solder joints from the fracture detector;

correcting, by the correction processor, the fatigue characteristic data of the solder joints stored in the fatigue characteristic database by shifting a line representing a relationship between a value of the fracture life and a value of the state parameter of each of the plurality of detection solder joints with a constant slope;

receiving, at a processor, the data of the state parameter of the solder joints and the plurality of detection solder joints from the state parameter database and the corrected fatigue characteristics data from the fatigue characteristic database; and

calculating, by the processor, a prediction value of the fracture life of each one of the solder joints,

wherein the detecting step further comprises detecting, via the fracture detector that further comprises the detection solder joints that are disposed in a position more towards a corner of the mounting circuit board than the solder joints and that are arranged so as to have different distances from the corner.

15. The method of claim 14, wherein the detecting step further comprises detecting, via the fracture detector comprising detection solder joints that are smaller in diameter than the solder joints.

16. The method of claim 14, wherein the detecting step further comprises detecting, via the fracture detector that further comprises the detection solder joints that are disposed in a set and are incorporated in a single circuit.

17. A fracture life predicting system for predicting a fracture life of solder joints of an electronic device having the solder joints that electrically connect an electronic component to a mounting circuit board, the system comprising:

a fracture detector comprising a detection solder joint that is designed so as to have a shorter life than the solder joints, the detection solder joint mounted on a surface of the mounting circuit board, the surface being between the mounting circuit board and the electronic component, the fracture detector configured to detect fracture of the detection solder joint and obtain a fracture life of the detection solder joint at a time point when the detection solder joint is fractured;

a state parameter database configured to store data of a state parameter of the solder joints and the detection solder joint;

a fatigue characteristic database configured to store fatigue characteristic data indicating a relationship between the state parameter of the solder joints and the fracture life of the solder joints;

a correction processor configured to receive fracture detection information of the detection solder joint from the fracture detector and to correct the fatigue characteristic data of the solder joints stored in the fatigue characteristic database by shifting a line representing a relationship between a value of the fracture life of the detection solder joint and a value of the state parameter of the detection solder joint with a constant slope; and

a processor configured to receive the data of the state parameter of the solder joints and the detection solder joint from the state parameter database and the corrected fatigue characteristic data from the fatigue characteristic database and to calculate a prediction value of the fracture life of each of the solder joints.