Method for testing a photonic integrated circuit including a device under test

• US 9,453,723 B1
• Filed: 06/30/2015
• Issued: 09/27/2016
• Est. Priority Date: 06/30/2015
• Status: Active Grant

• Current Assignee: Stmicroelectronics Crolles 2 SAS (STMicroelectronics NV)
• Original Assignee: Stmicroelectronics Crolles 2 SAS (STMicroelectronics NV)
• Inventors: LeMaitre, Patrick, Carpentier, Jean-Francois
• Primary Examiner(s): Chowdhury, Tarifur
• Assistant Examiner(s): Akanbi, Isiaka
• Application Number:
  US14/754,747
• Time in Patent Office: 455 Days
• Field of Search: 3562372-2376, 356/399, 356/479, 356/153, 385/137, 385/37, 385/33
• US Class Current: 1/1
• CPC Class Codes: G01B 11/27 for testing the alignment of axes means for centering or aligning a light guide within a ferrule G02B6/3834
• CPC Class Codes: G01R 31/31728 Optical aspects, e.g. opto-electronics used for testing, optical signal transmission for testing electronic circuits, electro-optic components to be tested in combination with electronic circuits, measuring light emission of digital circuits probes having electro-optic elements G01R1/071; electro-optic sampling for oscilloscopes G01R13/347; contactless testing of individual semiconductor devices by optical means G01R31/2656
• CPC Class Codes: G02B 6/12019 characterised by the optical interconnection to or from the AWG devices, e.g. integration or coupling with lasers or photodiodes coupling integrated waveguide to fibre G02B6/30, to optoelectronic element G02B6/42; monolithic integration of integrated waveguides with other optical elements G02B6/12004

Abstract

A method is for testing a photonic integrated circuit (IC) that includes a test structure having a test optical splitter, a test optical input, and first and second test optical outputs. A device under test (DUT) is coupled between the first test optical output and the first output of the test optical splitter. The deembedding structure includes a deembedding optical splitter, a deembedding optical input and first and second deembedding optical outputs. The method includes coupling a test probe device to the test optical inputs and outputs and the deembedding optical inputs and outputs and operating the test probe device to make at least one test measurement related to the DUT and at least one deembedding measurement. The at least one test measurement is processed with the at least one deembedding measurement to determine whether the DUT is acceptable and independent of alignment error.

Claims

1. A method of testing a photonic integrated circuit (IC) comprising a test structure and a deembedding structure, the test structure comprising a test optical splitter, a test optical input coupled to an input of the test optical splitter, first and second test optical outputs coupled to respective first and second outputs of the test optical splitter, and a device under test (DUT) coupled between the first test optical output and the first output of the test optical splitter;

the deembedding structure comprising a deembedding optical splitter, a deembedding optical input coupled to an input of the deembedding optical splitter, and first and second deembedding optical outputs coupled to respective first and second outputs of the deembedding optical splitter;

the method comprising;

coupling a test probe device to the test optical input, first and second test optical outputs, the deembedding optical input, and first and second deembedding optical outputs;

operating the test probe device to make at least one test measurement related to the DUT, and at least one deembedding measurement; and

processing the at least one test measurement and the at least one deembedding measurement to thereby determine whether the DUT is acceptable and independent of alignment error.

2. The method according to claim 1, wherein the photonic IC is among a plurality of photonic IC'"'"'s contained on a semiconductor wafer.

3. The method according to claim 1, wherein operating the test probe device comprises transmitting an optical signal to the test optical input and the deembedding optical input.

4. The method according to claim 1, wherein operating the test probe device comprises receiving optical signals from the first and second test optical outputs and first and second deembedding optical outputs.

5. The method according to claim 1, wherein coupling the test probe device comprises coupling an array of optical fibers to respective grating couplers on the photonic IC.

6. The method according to claim 1, wherein the test optical splitter and deembedding optical splitter have a common splitting ratio.

7. The method according to claim 6, wherein the common splitting ratio is 50/50.

8. The method according to claim 1, wherein the photonic IC further comprises electronic circuitry coupled to the DUT.

9. A test probe device for testing a photonic integrated circuit (IC) comprising a test structure and a deembedding structure, the test structure comprising a test optical splitter, a test optical input coupled to an input of the test optical splitter, first and second test optical outputs coupled to respective first and second outputs of the test optical splitter, and a device under test (DUT) coupled between the first test optical output and the first output of the test optical splitter;

the deembedding structure comprising a deembedding optical splitter, a deembedding optical input coupled to an input of the deembedding optical splitter, and first and second deembedding optical outputs coupled to respective first and second outputs of the deembedding optical splitter;

the test probe device comprising;

a plurality of optical fibers to be temporarily coupled to the test optical input, first and second test optical outputs, the deembedding optical input, and first and second deembedding optical outputs;

at least one optical transmitter and a plurality of optical receivers coupled to the plurality of optical fibers and configured to make at least one test measurement related to the DUT, and at least one deembedding measurement; and

a processor coupled to the at least one optical transmitter and plurality of optical receivers and being configured to process the at least one test measurement and the at least one deembedding measurement to thereby determine whether the DUT is acceptable and independent of alignment error.

10. The test probe device according to claim 9, wherein said processor cooperates with the at least one optical transmitter to transmit an optical signal to the test optical input and the deembedding optical input.

11. The test probe device according to claim 9, wherein said processor cooperates with said plurality of optical receivers to receive optical signals from the first and second test optical outputs and first and second deembedding optical outputs.

12. The test probe device according to claim 9, wherein said plurality of optical fibers are arranged in an array to be temporarily coupled to respective grating couplers on the photonic IC.

13. The test probe device according to claim 9, wherein the test optical splitter and deembedding optical splitter have a common splitting ratio.

14. The test probe device according to claim 13, wherein the common splitting ratio is 50/50.

15. The test probe device according to claim 9, wherein the photonic IC further comprises electronic circuitry coupled to the DUT.

16. A photonic integrated circuit (IC) comprising:

a test structure comprising a test optical splitter, a test optical input coupled to an input of the test optical splitter, first and second test optical outputs coupled to respective first and second outputs of the test optical splitter, and a device under test (DUT) coupled between the first test optical output and the first output of the test optical splitter; and

a deembedding structure comprising a deembedding optical splitter, a deembedding optical input coupled to an input of the deembedding optical splitter, and first and second deembedding optical outputs coupled to respective first and second outputs of the deembedding optical splitter;

the test optical input, first and second test optical outputs, the deembedding optical input, and first and second deembedding optical outputs configured to be temporarily coupled to a test probe device to make at least one test measurement related to the DUT, and at least one deembedding measurement to thereby determine whether the DUT is acceptable and independent of alignment error.

17. The photonic IC according to claim 16, wherein the optical inputs and optical outputs each comprise a respective grating coupler.

18. The photonic IC according to claim 16, wherein the test optical splitter and deembedding optical splitter have a common splitting ratio.

19. The photonic IC according to claim 18, wherein the common splitting ratio is 50/50.

20. The photonic IC according to claim 16, further comprising electronic circuitry coupled to the DUT.