Edge crack detection system

• US 9,454,684 B2
• Filed: 05/28/2014
• Issued: 09/27/2016
• Est. Priority Date: 05/28/2014
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Hsiao, Huang-Ting, Xu, An-Tai, Tsai, Cheng-Hung, Chen, Tsui-Mei, Lu, Nai-Cheng, Tsao, Pei-Haw
• Primary Examiner(s): Phan, Hai
• Assistant Examiner(s): Bousono, Orlando
• Application Number:
  US14/288,462
• Publication Number:
  US 20150347793A1
• Time in Patent Office: 853 Days
• US Class Current: 1/1
• CPC Class Codes: G01R 31/2822 of microwave or radiofrequency circuits of attenuation, gain, e.g. using network analyzers G01R27/28
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: G06K 19/0722 comprising an arrangement for testing the record carrier
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: G06K 7/10336 the antenna being of the near field type, inductive coil
• CPC Class Codes: G06K 7/10366 the interrogation device being adapted for miscellaneous applications
• CPC Class Codes: H01L 21/304 Mechanical treatment, e.g. grinding, polishing, cutting H01L21/30625 takes precedence
• CPC Class Codes: H01L 22/34 Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line switching, multiplexing, gating devices G01R19/25; process control with lithography, e.g. dose control, G03F7/20; structures for alignment control by optical means G03F7/70633

Abstract

According to an exemplary embodiment, a method of detecting edge cracks in a die under test is provided. The method includes the following operations: receiving a command signal; providing power from the command signal; providing a response signal based on the command signal; and self-destructing based on the command signal.

Claims

1. A method of detecting edge cracks in a die under test, comprising:

providing a command signal regarding a radio frequency identification (RFID) tag'"'"'s response using an RFID reader;

completely encircling a die under test using an antenna of the RFID tag disposed outside a seal ring surrounding the entire periphery of the die under test;

using the RFID tag to receive the command signal and produce power from the command signal;

providing a response signal using the RFID tag based on the command signal;

receiving the response signal and providing the command signal regarding the RFID tag'"'"'s self-destruction based on the response signal using the RFID reader; and

receiving the command signal and self-destructing based on the command signal using the RFID tag.

2. The method of claim 1, further comprising disposing a processor of the RFID tag under the seal ring of the die.

3. The method of claim 1, further comprising determining that the die under test has no edge cracks when receiving the response signal.

4. The method of claim 1, further comprising no longer providing the response signal after the self-destruction of the RFID tag.

5. The method of claim 1, further comprising having no impact to the die under test after the self-destruction of the RFID tag.

6. The method of claim 1, further comprising comparing the command signal with a lookup table to determine whether to self-destruct.

7. The method of claim 1, wherein providing the command signal by using the RFID reader further comprises providing the command signal in the form of an electromagnetic wave.

8. The method of claim 1, wherein providing the response signal further comprises providing the response signal in the form of an electromagnetic wave.

9. An edge crack detection system, comprising:

a radio frequency identification (RFID) reader providing a command signal; and

an RFID tag wirelessly connected to the RFID reader, the RFID tag comprising an antenna completely encircling a die under test, the antenna disposed outside a seal ring surrounding the entire periphery of the die under test, wherein the antenna receives the command signal, produces power from the command signal, and provides a response signal based on the command signal,

wherein the RFID reader receives the response signal from the RFID tag and provides the command signal regarding the RFID tag'"'"'s self-destruction based on the response signal from the RFID tag, and the RFID tag receives the command signal and self-destructs based on the command signal.

10. The system of claim 9, wherein the RFID reader further determines that the die under test has no edge cracks when receiving the response signal.

11. The system of claim 9, wherein after the self-destruction of the RFID tag, the RFID tag no longer provides the response signal.

12. The system of claim 9, wherein after the self-destruction of the RFID tag, the RFID tag has no adverse impact to the die under test.

13. The system of claim 9, wherein the RFID tag compares the command signal with a lookup table to determine whether to provide the response signal or to self-destruct.

14. The system of claim 9, wherein the RFID reader provides the command signal in the form of an electromagnetic wave.

15. The system of claim 9, wherein the RFID tag provides the response signal in the form of an electromagnetic wave.

16. The system of claim 9, wherein the RFID tag further comprises:

a processor disposed under the seal ring of the die.