Semiconductor devices and processing methods
First Claim
Patent Images
1. A method for processing a semiconductor device, comprising:
- providing the semiconductor device having a first pad and a second pad electrically disconnected from the first pad;
applying at least one electrical test potential to at least one of the first pad and the second pad; and
electrically connecting the first pad and the second pad to one another after applying the at least one electrical test potential;
wherein the semiconductor device comprises a plurality of device cells, andwherein the at least one electrical test potential is configured to detect defects in the plurality of device cells.
1 Assignment
0 Petitions
Accused Products
Abstract
A method for processing a semiconductor device in accordance with various embodiments may include: providing a semiconductor device having a first pad and a second pad electrically disconnected from the first pad; applying at least one electrical test potential to at least one of the first pad and the second pad; and electrically connecting the first pad and the second pad to one another after applying the at least one electrical test potential.
-
Citations
22 Claims
-
1. A method for processing a semiconductor device, comprising:
-
providing the semiconductor device having a first pad and a second pad electrically disconnected from the first pad; applying at least one electrical test potential to at least one of the first pad and the second pad; and electrically connecting the first pad and the second pad to one another after applying the at least one electrical test potential; wherein the semiconductor device comprises a plurality of device cells, and wherein the at least one electrical test potential is configured to detect defects in the plurality of device cells. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A semiconductor device, comprising:
-
at least one device cell comprising at least one trench, at least one first terminal electrode region, at least one second terminal electrode region, at least one gate electrode, and at least one additional electrode disposed at least partially in the at least one trench; a first pad coupled to the at least one first terminal electrode region; a second pad coupled to the at least one additional electrode; an electrically conductive layer disposed over at least a portion of the first pad and the second pad and electrically connecting the first pad to the second pad.
-
-
10. A method for processing a semiconductor device, comprising:
-
providing the semiconductor device having a first pad, a second pad, and a switching element coupled between the first pad and the second pad and switchable between a first state, in which the first and second pads are electrically connected to one another via the switching element, and a second state, in which the first and second pads are not electrically connected to one another via the switching element; applying at least one electrical test potential to at least one of the first and second pads while the switching element is in the second state; and switching the switching element from the second state to the first state after applying the at least one electrical test potential to the at least one of the first and second pads. - View Dependent Claims (11, 12, 13, 14)
-
-
15. A semiconductor device, comprising:
-
at least one device cell comprising at least one trench, at least one first terminal electrode region, at least one second terminal electrode region, at least one gate electrode, and at least one additional electrode disposed at least partially in the at least one trench; a first pad coupled to the at least one first terminal electrode region; a second pad coupled to the at least one additional electrode; a switching element electrically coupled between the first pad and the second pad and switchable between a first state, in which the first and second pads are electrically connected to one another via the switching element, and a second state, in which the first and second pads are electrically disconnected from one another. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
-
Specification