Micromachined 3-axis accelerometer with a single proof-mass
First Claim
1. An inertial measurement system, comprising:
- a device layer including a single proof-mass 3-axis accelerometer formed in an x-y plane, the single proof-mass 3-axis accelerometer suspended about a single, central anchor, the single proof-mass 3-axis accelerometer including separate x, y, and z-axis flexure bearings;
wherein the x and y-axis flexure bearings are symmetrical about the single, central anchor;
wherein the z-axis flexure bearing defines a pivot line offset from the single, central anchor;
a cap wafer bonded to a first surface of the device layer; and
a via wafer bonded to a second surface of the device layer, wherein the cap wafer and the via wafer are configured to encapsulate the single proof-mass 3-axis accelerometer.
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Abstract
This document discusses, among other things, an inertial measurement system including a device layer including a single proof-mass 3-axis accelerometer, a cap wafer bonded to a first surface of the device layer, and a via wafer bonded to a second surface of the device layer, wherein the cap wafer and the via wafer are configured to encapsulate the single proof-mass 3-axis accelerometer. The single proof-mass 3-axis accelerometer can be suspended about a single, central anchor, and can include separate x, y, and z-axis flexure bearings, wherein the x and y-axis flexure bearings are symmetrical about the single, central anchor and the z-axis flexure is not symmetrical about the single, central anchor.
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Citations
20 Claims
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1. An inertial measurement system, comprising:
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a device layer including a single proof-mass 3-axis accelerometer formed in an x-y plane, the single proof-mass 3-axis accelerometer suspended about a single, central anchor, the single proof-mass 3-axis accelerometer including separate x, y, and z-axis flexure bearings; wherein the x and y-axis flexure bearings are symmetrical about the single, central anchor; wherein the z-axis flexure bearing defines a pivot line offset from the single, central anchor; a cap wafer bonded to a first surface of the device layer; and a via wafer bonded to a second surface of the device layer, wherein the cap wafer and the via wafer are configured to encapsulate the single proof-mass 3-axis accelerometer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A micromachined, monolithic inertial sensor apparatus, comprising:
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a single proof-mass 3-axis accelerometer formed in an x-y plane of a device layer, suspended about a single, central anchor, the single proof-mass 3-axis accelerometer including separate x, y, and z-axis flexure bearings; and wherein the x and y-axis flexure bearings are symmetrical about the single, central anchor; and wherein the z-axis flexure bearing defines a pivot line offset from the single, central anchor. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification