Article with gasket having moisture transmission resistivity and method

• US 9,456,513 B2
• Filed: 02/12/2010
• Issued: 09/27/2016
• Est. Priority Date: 02/25/2009
• Status: Active Grant

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Charles, Scott B., Kropp, Michael A., Mujumdar, Ashu N.
• Primary Examiner(s): Wilson, Adrian S
• Application Number:
  US12/705,008
• Publication Number:
  US 20100214732A1
• Time in Patent Office: 2,419 Days
• Field of Search: 361/679.01, 361/679.02, 174/17, 174/50, 174/520, 174/521, 428/423.1, 264/127, 264/330, 264/331.14, 264/331.15, 264/331.18, 264/331.21, 264/496, 524/505, 524/528
• US Class Current: 1/1
• CPC Class Codes: H05K 5/061 sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
• CPC Class Codes: H05K 5/062 sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ

Abstract

This disclosure relates to gasket materials used for attaching and sealing covers to enclosures. More particularly, this disclosure relates to form-in-place gaskets, applied to surfaces of containers for sensitive electronic components. The gaskets include a flexible polymer and a micropowder polyolefin filler.

Claims

1. An article for housing an electronic device comprising:

a container having at least a first section and a second section, the first section having a first mating surface and the second section having a second mating surface; and

a gasket in contact with the first mating surface and the second mating surface, wherein the gasket comprises;

a flexible polymer; and

a filler, and

wherein the filler includes at least one hydrophobic semicrystalline polymer.

2. An article according to claim 1, wherein the flexible polymer comprises an acrylate polymer, an epoxy polymer, or a combination thereof.

3. An article according to claim 2, wherein the epoxy polymer is the reaction product of a two part epoxy system.

4. An article according to claim 2, wherein the epoxy polymer is the reaction product of a one part epoxy system.

5. An article according to claim 1, wherein the filler comprises a micropowder.

6. An article according to claim 1, wherein the at least one hydrophobic semicrystalline polymer has microcrystalline domains.

7. An article according to claim 1, wherein the at least one hydrophobic semicrystalline polymer comprises a polyolefin.

8. An article according to claim 1, wherein the at least one hydrophobic semicrystalline polymer is at least partially fluorinated.

9. An article according to claim 8, wherein the fluorinated polymer comprises poly(tetrafluoroethylene).

10. An article according to claim 1, wherein the filler comprises greater than about 20 wt % of the gasket.

11. An article according to claim 1, further comprising an electronic device.

12. An article according to claim 11, wherein the container and the gasket completely enclose the electronic device.

13. An article according to claim 11, wherein the electronic device comprises a hard disk drive.

14. A method of sealing an electronic device comprising:

providing a container having at least a first section and a second section, the first section having a first mating surface and the second section having a second mating surface;

locating the electronic device in the first section of the first container;

applying a bead of gasket precursor material to the first mating surface of the first section of the container;

curing the bead of gasket precursor material to form a cured gasket; and

placing the second section of the container such that the second mating surface of the second container comes into contact with the cured gasket and such that the first section of the container and the second section of the container at least partially surround the electronic device wherein the gasket comprises;

a flexible polymer; and

a filler, and

wherein the filler includes at least hydrophobic semicrystalline polymer.

15. A method according to claim 14, wherein the filler comprises a micropowder.

16. A method according to claim 14 wherein the at least one hydrophobic semicrystalline polymer has semicrystalline domains.

17. A method according to claim 14, wherein the at least one hydrophobic semicrystalline polymer is at least partially fluorinated.

18. A method according to claim 14, wherein the at least one hydrophobic semicrystalline polymer comprises a polyolefin.

19. A method according to claim 17, wherein the hydrophobic semicrystalline polymer comprises poly(tetrafluoroethylene).

20. A method according to claim 14, wherein the filler comprises wherein the filler comprises greater than about 25 wt % of the gasket.

21. A method according to claim 14, wherein the container and gasket completely encapsulate the electronic device.

22. A method according to claim 14, wherein curing comprises heating the precursor of a flexible polymer to a temperature capable of initiating a curing reaction.

23. A method according to claim 14, wherein curing comprises exposing the precursor of a flexible polymer to actinic radiation.