Resin composition and use thereof

• US 9,458,279 B2
• Filed: 05/14/2009
• Issued: 10/04/2016
• Est. Priority Date: 06/02/2008
• Status: Active Grant

• Current Assignee: Kaneka Corporation
• Original Assignee: Kaneka Corporation
• Inventors: Sekito, Yoshihide
• Primary Examiner(s): Dollinger, Mike M
• Application Number:
  US12/993,721
• Publication Number:
  US 20110061915A1
• Time in Patent Office: 2,700 Days
• Field of Search: 525/454
• US Class Current: 1/1
• CPC Class Codes: C08G 18/348 Hydroxycarboxylic acids
• CPC Class Codes: C08G 18/44 Polycarbonates
• CPC Class Codes: C08G 18/6659 with compounds of group C08G18/34
• CPC Class Codes: C08G 18/758 containing two or more cycloaliphatic rings
• CPC Class Codes: C08G 73/1035 from tetracarboxylic acids or derivatives and diisocyanates
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C09D 179/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: G03F 7/027 Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds G03F7/075 takes precedence
• CPC Class Codes: G03F 7/037 the binders being polyamides or polyimides
• CPC Class Codes: H01B 3/306 Polyimides or polyesterimides
• CPC Class Codes: H01B 3/40 epoxy resins
• CPC Class Codes: H05K 3/287 Photosensitive compositions

Abstract

An object of the present invention is to provide: a (a) thermosetting resin composition, a photosensitive resin composition, a resin composition solution, a resin film, and an insulating film, each of which (i) is curable at a low temperature (not more than 200° C.), (ii) has excellent flexibility, electrical insulating reliability, solder heat resistance, and resistance to organic solvent, (iii) causes less warpage of a substrate after curing, and (iv) has excellent adhesiveness to a sealing agent; and a (b) printed wiring board provided with the insulating film mentioned above. The object of the present invention is attainable by using a thermosetting resin composition containing at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) thermosetting resin.

Claims

1. A resin composition solution obtained by dissolving, in an organic solvent, a thermosetting resin composition containing at least:

a (A) urethane imide oligomer having a terminal carboxylic acid group; and

a (B) thermosetting resin

wherein;

the (A) urethane imide oligomer having a terminal carboxylic acid group is obtained by;

(i) reacting at least a (a) diol compound and a (b) diisocyanate compound so as to synthesize a terminal isocyanate compound;

(ii) reacting the terminal isocyanate compound with a (c) tetracarboxylic acid dianhydride so as to synthesize a urethane imide oligomer having a terminal acid anhydride; and

(iii) reacting the urethane imide oligomer having a terminal acid anhydride with (d) water,

the (a) diol compound being represented by General Formula (1);

HOR₁OH 

 

(1)

wherein R represents a divalent organic group; and

1 represents an integer of 1 to 20,

O═

C═

N—

X—

N═

C═

O 

 

(2)

the (b) diisocyanate compound being represented by General Formula (2);

wherein X represents a divalent organic group, and

the (c) tetracarboxylic acid dianhydride being represented by General Formula (3);

2. The resin composition solution as set forth in claim 1, wherein the (B) thermosetting resin is contained in the resin composition solution by 1 to 100 parts by weight, relative to 100 parts by weight of the (A) urethane imide oligomer having a terminal carboxylic acid group.

3. A photosensitive resin composition containing at least:

a resin composition solution as set forth in claim 1;

a (C) photosensitive resin; and

a (D) photopolymerization initiator.

4. The photosensitive resin composition as set forth in claim 3, wherein:

the (A) urethane imide oligomer having a terminal carboxylic acid group, the (B) thermosetting resin, the (C) photosensitive resin, and the (D) photopolymerization initiator are contained in the photosensitive resin composition in such an amount ratio that the (C) photosensitive resin and the (D) photopolymerization initiator are contained therein respectively by 10 to 200 parts by weight and by 0.1 to 50 parts by weight, relative to 100 parts by weight of a total solid content of the (A) urethane imide oligomer having a terminal carboxylic acid group and the (B) thermosetting resin.

5. A resin film obtained by applying, to a surface of a base material, a resin composition solution as set forth in claim 3 and then drying the resin composition solution thus applied.

6. An insulating film obtained by curing a resin film as set forth in claim 5.

7. A printed wiring board provided with an insulating film, wherein:

the insulating film is an insulating film as set forth in claim 6; and

the printed wiring board is covered with the insulating film.

8. A resin composition solution obtained by dissolving, in an organic solvent, a photosensitive resin composition as set forth in claim 3.

9. A resin film obtained by applying, to a surface of a base material, a resin composition solution as set forth in claim 8 and then drying the resin composition solution thus applied.

10. An insulating film obtained by curing a resin film as set forth in claim 9.

11. A printed wiring board provided with an insulating film, wherein:

the insulating film is an insulating film as set forth in claim 10; and

the printed wiring board is covered with the insulating film.

12. The resin composition solution as set forth in claim 1, wherein the (A) urethane imide oligomer having a terminal carboxylic acid group further has a carboxyl group in its side chain.