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Heat-flux measuring method, substrate processing system, and heat-flux measuring member

  • US 9,459,159 B2
  • Filed: 12/23/2014
  • Issued: 10/04/2016
  • Est. Priority Date: 12/26/2013
  • Status: Active Grant
First Claim
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1. A heat-flux measuring method for measuring an ion flux of plasma generated in a substrate processing chamber using a heat flux, the method comprising:

  • providing a heat-flux measuring member comprising;

    a first layer that is low-coherent light transmittable;

    a second layer stacked on the first layer; and

    a third layer that is stacked on the second layer and low-coherent light transmittable,wherein the second layer is made of a material different from a material of each of the first layer and the third layer;

    exposing the heat-flux measuring member;

    irradiating a low coherent light to the heat-flux measuring member in a thickness direction of the heat-flux measuring member;

    measuring a first length of a first optical path in which the low-coherent light reciprocates in the first layer along the thickness direction, and a second length of a second optical path in which the low-coherent light reciprocates in the third layer along the thickness direction, using optical interference of reflected lights of the irradiated low-coherent light reflected from the heat-flux measuring member;

    providing data representing relationships between temperatures of the first layer and lengths of an optical path in the first layer and between temperatures of the third layer and lengths of an optical path in the third layer;

    obtaining current temperatures of the first layer and the third layer based on the first length, the second length and the data; and

    calculating the heat flux flowing through the heat-flux measuring member based on the obtained temperatures, and a thickness and a thermal conductivity of the second layer.

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