Pressure sensor and method for its manufacture

• US 9,459,169 B2
• Filed: 11/23/2011
• Issued: 10/04/2016
• Est. Priority Date: 12/14/2010
• Status: Active Grant

• Current Assignee: Endress + Hauser GmbH + Company KG (Endress+Hauser AG)
• Original Assignee: Endress + Hauser GmbH + Company KG (Endress+Hauser AG)
• Inventors: Selders, Peter, Rossberg, Andreas, Schmidt, Elke, Berlinger, Andrea
• Primary Examiner(s): Labaze, Edwyn
• Application Number:
  US13/993,111
• Publication Number:
  US 20130263670A1
• Time in Patent Office: 1,777 Days
• Field of Search: 235/462.12, 235/375, 737/24, 737/23, 737/53, 737/00, 737/18, 737/20, 737/21
• US Class Current: 1/1
• CPC Class Codes: B23K 31/02 relating to soldering or welding dip or wave soldering in the manufacture of printed circuits H05K3/34
• CPC Class Codes: G01L 7/00 Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements G01L11/004 takes precedence; transmitting or indicating the displacement of mechanical pressure-sensitive elements by electric , e.g., photoelectric or magnetic means G01L9/00; measuring differences of two or more pressure values G01L13/00; measuring two or more pressure values simultaneously G01L15/00
• CPC Class Codes: G01L 9/0044 Constructional details of non-semiconductive diaphragms
• CPC Class Codes: G01L 9/0075 using a ceramic diaphragm, e.g. alumina, fused quartz, glass

Abstract

A method for manufacturing a pressure sensor, comprising: providing a ceramic platform, a ceramic measuring membrane, and an intermediate ring; providing an active braze material by means of gas phase deposition at least on a first surface section of a first surface and on a second surface section of a second surface. The first surface is a platform surface, which is to be connected with the intermediate ring by means of the active hard solder, or braze, or a surface of the intermediate ring, which is to be connected with the platform by means of the active hard solder, or braze. The second surface is a measuring membrane surface, which is to be connected with the intermediate ring by means of the active hard solder, or braze, or a surface of the intermediate ring, which is to be connected with the measuring membrane by means of the active hard solder, or braze. The intermediate ring is positioned between the measuring membrane and the platform; the active hard solder, or braze, is heated in a soldering, or brazing, process, wherein the intermediate ring remains essentially solid during the soldering, or brazing, process.

Claims

1. A pressure sensor, comprising:

a ceramic platform;

a ceramic measuring membrane; and

an intermediate ring, which is arranged between said platform and said measuring membrane, wherein;

said platform is connected with said intermediate ting by means of a first joint;

said intermediate ring is connected with said measuring membrane by means of a second joint;

said first and second joints comprise, in each case, an active hard solder, or braze;

said intermediate ring comprises a metal material, especially W, MoTiZr, MoCu, said metal material essentially remaining solid at the melting temperature of said active hard solder, or a ceramic material, especially corundum; and

said intermediate ring has a thickness of no more than 45 μ

m.

2. The pressure sensor as claimed in claim 1, wherein:

said measuring membrane and/or said platform comprise corundum; and

said active hard solder comprises a Zr—

Ni—

Ti alloy.

3. The pressure sensor as claimed in claim 1, wherein:

said intermediate ring has a thickness of no more than 30 μ

m.

4. The pressure sensor as claimed in claim 1, wherein:

said intermediate ring has a thickness of no more than 20 μ

m.