RFID integrated circuits with large contact pads

• US 9,460,380 B1
• Filed: 08/04/2014
• Issued: 10/04/2016
• Est. Priority Date: 03/11/2008
• Status: Active Grant

• Current Assignee: Impinj International Ltd. (Impinj, Inc.)
• Original Assignee: Impinj International Ltd. (Impinj, Inc.)
• Inventors: Koepp, Ronald Lee, Wu, Tan Mau, Oliver, Ronald A., Heinrich, Harley, Mavoori, Jaideep, Diorio, Christopher J.
• Primary Examiner(s): TRINH, MINH N
• Application Number:
  US14/451,412
• Time in Patent Office: 792 Days
• US Class Current: 1/1
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: H01P 11/00 Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
• CPC Class Codes: H01Q 1/2208 associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

Technologies are generally directed to assembly of a Radio Frequency Identification (RFID) tag precursor. An assembly may be provided, the assembly having an RFID integrated circuit (IC), a nonconductive repassivation layer on a surface of the IC and confined within a perimeter of the surface, and a conductive redistribution layer on the repassivation layer and confined within the perimeter of the surface, in which a first portion of the redistribution layer is electrically connected to the IC through a first electrical connection. A substrate having a first antenna terminal to the assembly may be attached with an adhesive, and at least a first portion of a nonconductive barrier present on at least one of the first antenna terminal and the first portion of the redistribution layer may be reacted with a reactant to make the first portion of the nonconductive barrier conductive. A second electrical connection may then be formed between the first antenna terminal and the first portion of the redistribution layer through the first portion of the nonconductive barrier.

Claims

1. A method to assemble a Radio Frequency Identification (RFID) tag precursor, the method comprising:

providing an assembly having an RFID integrated circuit (IC), a nonconductive repassivation layer on a surface of the IC and confined within a perimeter of the surface, and a conductive redistribution layer on the repassivation layer and confined within the perimeter of the surface, in which a first portion of the redistribution layer is electrically connected to the IC through a first electrical connection;

attaching, with an adhesive, a substrate having a first antenna terminal to the assembly;

reacting, with a reactant, at least a first portion of a nonconductive barrier present on at least one of the first antenna terminal and the first portion of the redistribution layer to make the first portion of the nonconductive barrier conductive; and

forming a second electrical connection between the first antenna terminal and the first portion of the redistribution layer through the first portion of the nonconductive barrier.

2. The method of claim 1, wherein the first electrical connection includes an opening in the repassivation layer.

3. The method of claim 2, wherein the opening and a first portion of the nonconductive barrier are nonoverlapping.

4. The method of claim 2, wherein the opening and at least a portion of a first portion of the nonconductive barrier are nonoverlapping.

5. The method of claim 1, wherein the nonconductive barrier is at least one of an oxide and a masking layer.

6. The method of claim 1, wherein the adhesive includes the reactant.

7. The method of claim 1, wherein:

the substrate further includes a second antenna terminal;

the redistribution layer further includes a second portion electrically isolated from the first portion and electrically connected to the IC;

the nonconductive barrier is further present on at least one of the second antenna terminal and the second portion of the redistribution layer; and

the method further comprises forming a third electrical connection between the second antenna terminal and the second portion of the redistribution layer through a second portion of the nonconductive barrier made conductive by a reaction with the reactant.