×

RFID integrated circuits with large contact pads

  • US 9,460,380 B1
  • Filed: 08/04/2014
  • Issued: 10/04/2016
  • Est. Priority Date: 03/11/2008
  • Status: Active Grant
First Claim
Patent Images

1. A method to assemble a Radio Frequency Identification (RFID) tag precursor, the method comprising:

  • providing an assembly having an RFID integrated circuit (IC), a nonconductive repassivation layer on a surface of the IC and confined within a perimeter of the surface, and a conductive redistribution layer on the repassivation layer and confined within the perimeter of the surface, in which a first portion of the redistribution layer is electrically connected to the IC through a first electrical connection;

    attaching, with an adhesive, a substrate having a first antenna terminal to the assembly;

    reacting, with a reactant, at least a first portion of a nonconductive barrier present on at least one of the first antenna terminal and the first portion of the redistribution layer to make the first portion of the nonconductive barrier conductive; and

    forming a second electrical connection between the first antenna terminal and the first portion of the redistribution layer through the first portion of the nonconductive barrier.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×