Integrated device with inductive and capacitive portions and fabrication methods

• US 9,460,996 B1
• Filed: 08/05/2015
• Issued: 10/04/2016
• Est. Priority Date: 08/05/2015
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: GlobalFoundries, Inc.
• Inventors: Zang, Hui, Chi, Min-hwa
• Primary Examiner(s): DANG, PHUC T
• Application Number:
  US14/818,351
• Time in Patent Office: 426 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 23/5223 Capacitor integral with wiring layers
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 27/013 Thick-film circuits
• CPC Class Codes: H01L 27/016 Thin-film circuits
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 28/60 Electrodes

Abstract

Integrated devices and fabrication methods thereof are presented. The methods include, for instance fabricating an integrated device comprising an inductive portion and a capacitive portion, the integrated device being at least partially embedded within an electrode. The fabricating includes providing a conductive coil at least partially within an insulator layer above a substrate, the conductive coil comprising exposed portions, wherein the inductive portion of the integrated device comprises the conductive coil; covering exposed portions of the conductive coil with a dielectric material; and forming the electrode at least partially around the dielectric covered portions of the conductive coil, the electrode being physically separated from the conductive coil by the dielectric material, wherein the capacitive portion of the integrated device comprises the electrode, the dielectric material, and the conductive coil. In one embodiment, the method further includes: exposing at least one further portion of the conductive coil; and providing another electrode in electrical contact with the at least one exposed further portion of the conductive coil.

Claims

1. A method comprising:

fabricating an integrated device comprising an inductive portion and a capacitive portion, the fabricating comprising;

providing a conductive coil at least partially within an insulator layer above a substrate, the conductive coil comprising exposed portions, wherein the inductive portion of the integrated device comprises the conductive coil;

covering exposed portions of the conductive coil with a dielectric material;

forming the electrode of the integrated device at least partially around the dielectric covered portions of the conductive coil, the electrode being physically separated from the conductive coil by the dielectric material, wherein the capacitive portion of the integrated device comprises the electrode, the dielectric material, and the conductive coil; and

producing another electrode in electrical contact with at least one further portion of the conductive coil.

2. The method of claim 1, further comprising:

exposing the at least one further portion of the conductive coil.

3. The method of claim 1, wherein the providing comprises forming the conductive coil within a cavity of the insulator layer, wherein the exposed portions of the conductive coil are exposed within the cavity of the insulator layer.

4. The method of claim 3, wherein the forming comprises filling the cavity of the insulator layer with the electrode.

5. The method of claim 3, wherein the providing comprises removing portions of the insulator layer to form the cavity and expose the exposed portions of the conductive coil.

6. The method of claim 1, wherein the providing comprises:

forming trenches in the insulator layer;

forming the conductive coil within the trenches of the insulator layer; and

etching the insulator layer to expose the exposed portions of the conductive coil.

7. The method of claim 6, wherein the etching comprises laterally etching the insulator layer to facilitate exposing lower portions of the conductive coil.

8. The method of claim 1, further comprising disposing, after the covering, a liner material over the dielectric covered portions of the conductive coil, the liner material inhibiting damage to the dielectric material during the forming.

9. The method of claim 1, wherein the providing comprises aligning the conductive coil with an axis substantially parallel to an upper surface of the insulator layer.

10. The method of claim 1, wherein the providing comprises aligning the conductive coil with an axis substantially perpendicular to an upper surface of the insulator layer.

11. The method of claim 1, wherein the fabricating further comprises forming at least one interconnect structure, wherein the at least one interconnect structure connects the inductive portion and the capacitive portion of the integrated device in a series electrical connection.

12. The method of claim 1, wherein the fabricating further comprises forming at least one interconnect, wherein the at least one interconnect structure connects the inductive portion and the capacitive portion of the integrated device in a parallel electrical connection.

13. The method of claim 1, wherein the forming comprises at least partially embedding the conductive coil within the electrode of the integrated device.

14. An integrated device comprising:

a conductive coil, the conductive coil comprising an inductive portion of the integrated device;

a dielectric material, the dielectric material covering exposed portions of the conductive coil;

an electrode, the electrode being disposed at least partially around the dielectric covered portions of the conductive coil and being physically separated from the conductive coil by the dielectric material, wherein a capacitive portion of the integrated device comprises the electrode, the dielectric material, and the conductive coil;

and another electrode in electrical contact with at least one further portion of the conductive coil.

15. The integrated device of claim 14, further comprising a liner material, the liner material being disposed over the dielectric covered portions of the conductive coil and inhibiting damage to the dielectric material from the electrode.

16. The integrated device of claim 14, wherein the conductive coil is aligned with an axis substantially parallel to an upper surface of an insulator layer.

17. The integrated device of claim 14, wherein the conductive coil is aligned with an axis substantially perpendicular to an upper surface of an insulator layer.

18. The integrated device of claim 14, further comprising at least one interconnect structure, the at least one interconnect structure connecting the inductive portion and the capacitive portion of the integrated device in a series electrical connection.

19. The integrated device of claim 14, further comprising at least one interconnect structure, the at least one interconnect structure connecting the inductive portion and the capacitive portion of the integrated device in a parallel electrical connection.

20. A method comprising:

fabricating an integrated device comprising an inductive portion and a capacitive portion, the fabricating comprising;

providing a conductive coil at least partially within an insulator layer above a substrate, the conductive coil comprising exposed portions, wherein the inductive portion of the integrated device comprises the conductive coil;

covering exposed portions of the conductive coil with a dielectric material;

forming the electrode of the integrated device at least partially around the dielectric covered portions of the conductive coil, the electrode being physically separated from the conductive coil by the dielectric material, wherein the capacitive portion of the integrated device comprises the electrode, the dielectric material, and the conductive coil;

producing another electrode in electrical contact with at least one further portion of the conductive coil and further comprising disposing, after the covering, a liner material over the dielectric covered portions of the conductive coil, the liner material inhibiting damage to the dielectric material during the forming; and

disposing, after the covering, a liner material over the dielectric covered portions of the conductive coil, the liner material inhibiting damage to the dielectric material during the forming.