Thyristor random access memory device and method
First Claim
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1. A thyristor memory device, comprising:
- an array of memory cells, each memory cell including a folded first conductivity type region, each folded first conductivity type region having two upward facing ends;
a pair of second conductivity type semiconductor regions coupled to the upward facing ends;
a control line within the folded first conductivity type region between the two upward facing ends, and below the second conductivity type semiconductor regions;
a first conductivity type semiconductor cap on one of the second conductivity type semiconductor regions; and
a first transmission line coupled to the other second conductivity type semiconductor region.
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Abstract
Memory devices and methods of making memory devices are shown. Methods and configurations as shown provide folded and vertical memory devices for increased memory density. Methods provided reduce a need for manufacturing methods such as deep dopant implants.
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Citations
8 Claims
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1. A thyristor memory device, comprising:
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an array of memory cells, each memory cell including a folded first conductivity type region, each folded first conductivity type region having two upward facing ends; a pair of second conductivity type semiconductor regions coupled to the upward facing ends; a control line within the folded first conductivity type region between the two upward facing ends, and below the second conductivity type semiconductor regions; a first conductivity type semiconductor cap on one of the second conductivity type semiconductor regions; and a first transmission line coupled to the other second conductivity type semiconductor region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification