Light emitting device

• US 9,461,225 B2
• Filed: 11/18/2015
• Issued: 10/04/2016
• Est. Priority Date: 11/18/2008
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Seo, Eun Jung, Cho, Jae Ho, Kim, Bang Hyun
• Primary Examiner(s): YUSHIN, NIKOLAY K
• Application Number:
  US14/944,881
• Publication Number:
  US 20160072032A1
• Time in Patent Office: 321 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light-emitting device includes first and second lead frames spaced apart from each other, the first and second lead frames each comprising a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof, at least one of the first and second lead frames comprise three inset sidewalls that at least partially define a fixing space, the fixing space undercutting at least one of the first lead frame and second lead frame, a light-emitting diode chip arranged on the first surface of the first or second lead frame, a resin part disposed in the fixing space to support the first and second lead frames, and the first and second lead frames exposed to the outside through bottom surface.

Claims

1. A light-emitting device, comprising:

first and second lead frames spaced apart from each other, the first and second lead frames each comprising a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof,

wherein;

at least one of the first and second lead frames comprise three inset sidewalls that at least partially define a fixing space, the fixing space undercutting at least one of the first lead frame and second lead frame;

a light-emitting diode chip arranged on the first surface of the first or second lead frame;

a resin part disposed in the fixing space to support the first and second lead frames; and

the first and second lead frames exposed to the outside through bottom surface.

2. The light emitting device of claim 1 further comprising a fixing hole formed in at least one of the first and second lead frames.

3. The light emitting device of claim 2 wherein the first and second lead frames each have a side surface and the side surface is exposed to the outside.

4. The light emitting device of claim 1 wherein the first and second lead frames each have a side surface and the side surface is exposed to the outside.

5. The light emitting device of claim 4 wherein the first and second lead frames each have same thickness.

6. The light emitting device of claim 4 wherein a center of the side surface of the first and second lead frame exposed to the outside has same thickness with the lead frame arranged on the light-emitting diode chip.

7. The light emitting device of claim 4 wherein the center of the side surface of first lead frame is arranged on horizontal straight line of the center of the side surface of second lead frame.

8. A light-emitting device, comprising:

first and second lead frames spaced apart from each other, the first and second lead frames each comprising a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof,

wherein the first and second lead frames comprise three inset sidewalls that at least partially define a fixing space, the fixing space undercutting the first lead frame and second lead frame;

a light-emitting diode chip arranged on the first surface of the first or second lead frame;

a resin part disposed in the fixing space to support the first and second lead frames; and

the first and second lead frames exposed to the outside through bottom surface.

9. The light emitting device of claim 8 wherein a center of the side surface of the first and second lead frame exposed to the outside has same thickness with the lead frame arranged on the light-emitting diode chip.

10. The light emitting device of claim 8 further comprising a fixing hole formed in at least one of the first and second lead frames.

11. The light emitting device of claim 8 wherein the first and second lead frames each have same thickness.

12. The light emitting device of claim 11 wherein the center of the side surface of first lead frame is arranged on horizontal straight line of the center of the side surface of second lead frame.