Substrate for organic electronic device

• US 9,461,275 B2
• Filed: 04/17/2014
• Issued: 10/04/2016
• Est. Priority Date: 10/17/2011
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: Lee, Yeon Keun, Ahn, Yong Sik, Kim, Jung Doo, Park, Min Choon, Kim, Ji Hee
• Primary Examiner(s): STARK, JARRETT J
• Application Number:
  US14/255,493
• Publication Number:
  US 20140225098A1
• Time in Patent Office: 901 Days
• US Class Current: 1/1
• CPC Class Codes: G02B 5/0268 characterized by the fabrication or manufacturing method
• CPC Class Codes: G02B 5/0273 characterized by the use
• CPC Class Codes: H05B 33/22 characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
• CPC Class Codes: H10K 50/84 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 50/841 Self-supporting sealing arrangements
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 50/854 comprising scattering means
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

The present application relates to a substrate for an organic electronic device, an organic electronic device, a method of preparing the substrate or the device, and a lighting apparatus. The substrate for an organic electronic device of the present application may, for example, be used to fabricate an organic electronic device, to which foreign substances such as moisture and oxygen are not permeated, and which has enhanced durability and superior light extraction efficiency. If the organic electronic device includes an encapsulation structure, the substrate may be stably attached to the encapsulation structure, and a surface hardness of outside connector part of the organic electronic device may be maintained to an appropriate level.

Claims

1. A substrate for an organic electronic device, comprising a base layer;

a light scattering layer and an electrode layer in this order,

wherein the light scattering layer contacts the base layer,

wherein the electrode layer extends beyond the entire peripheries of the light scattering layer,

wherein the light scattering layer comprises a matrix material and a scattering region, wherein the matrix material is a polysiloxane, a poly(amic acid), a polyimide, a cardo resin having a fluorene ring, urethane, epoxide, or a polyester or acrylate based thermo-curable or photo-curable monomeric, oligomeric or polymeric organic material,

wherein a formation area of the electrode layer is broader than a formation area of the light scattering layer, and the electrode layer is formed also on the surface of the base layer on which the light scattering layer is not formed.

2. The substrate according to claim 1, wherein a ratio (A/B) of the formation area (A) of the electrode layer with respect to the formation area (B) of the light scattering layer is 1.04 to 2.0.

3. The substrate according to claim 1, wherein the base layer is transparent.

4. The substrate according to claim 1, wherein the electrode layer is an electrode layer capable of injecting a hole or an electrode layer capable of injecting an electron.

5. The substrate according to claim 1, wherein the light scattering region is a light scattering particle having a different refractive index from the matrix material.

6. The substrate according to claim 1, wherein the matrix material comprises polysiloxane, poly(amic acid) or polyimide.

7. The substrate according to claim 5, wherein the refractive index of the light scattering particle is in the range from 1.0 to 3.5.

8. The substrate according to claim 1, wherein the light scattering layer has a concavo-convex structure.

9. The substrate according to claim 1, further comprising a planarization layer between the light scattering layer and the electrode layer.

10. The substrate according to claim 9, wherein a refractive index of the planarization layer is 1.7 or more.

11. An organic electronic device comprising:

a base layer;

a light scattering layer formed on the base layer;

a first electrode layer formed on the light scattering layer;

an organic layer that is formed on the first electrode layer and that comprises a light-emitting layer;

a second electrode layer formed on the organic layer; and

an encapsulation structure which protects the organic layer and the second electrode layer,

wherein a formation area of the first electrode layer is broader than a formation area of the light scattering layer, and the electrode layer is formed also on the surface of the base layer on which the light scattering layer is not formed, and

wherein the bottom surface of encapsulation structure is attached to a top surface of the first electrode layer beneath which the light scattering layer is not formed.

12. The organic electronic device according to claim 11, wherein a difference (B-C) between a length (B) of the formation area of the light scattering layer and a length (C) of a light-emitting area of the light-emitting layer is in the range from 10 μ

m to 2 mm.

13. The organic electronic device according to claim 11, wherein the encapsulation structure is a glass can or a metal can.

14. The organic electronic device according to claim 11, wherein the encapsulation structure is a film covering the entire surface of the organic layer and the second electrode layer.

17. A lighting apparatus comprising the organic electronic device of claim 11.

15. A method of preparing a substrate for an organic electronic device comprising providing a base laser;

providing a light scattering layer and eliminating at least a part of a light scattering layer by processing the light scattering layer which is formed on the base layer; and

forming an electrode layer on a region including the part where the light scattering layer is eliminated to form the electrode layer beyond the entire peripheries of the light scattering layer,

wherein the light scattering layer contacts the base layer,

wherein the light scattering layer comprises a matrix material and a scattering region, and

wherein the matrix material is a polysiloxane, a poly(amic acid), a polyimide, a cardo resin having a fluorene ring, urethane, epoxide, or a polyester or acrylate based thermo-curable or photo-curable monomeric, oligomeric or polymeric organic material.

16. The method according to claim 15, wherein the processing of the light scattering layer is performed by wet etching, dry etching, laser processing or a water jetting.