Broken wafer recovery system
First Claim
1. A substrate processing system, comprising:
- a vacuum processing chamber;
a loadlock chamber coupled to the vacuum processing chamber via a vacuum valve;
a broken substrate removing apparatus comprising;
a placing mechanism movably supporting a suction head for moving the suction head to location of the broken substrate, the suction head comprising a suction inlet and a hood positioned at the inlet of the suction head and configured to allow sufficient air flow into the inlet to enable proper suction to remove broken pieces of the substrate;
a suction pump; and
,a flexible hose coupling the suction head to the suction pump;
wherein the hood comprises setback extensions to allow air flow into the inlet.
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Accused Products
Abstract
An apparatus and method for recovery and cleaning of broken substrates, especially beneficial for fabrication systems using silicon wafer carried on trays. Removal of broken wafers and particles from within the fabrication system is enabled without requiring disassembly of the system and without requiring manual labor. A placing mechanism moves a suction head to location of the broken substrate and a suction pump coupled to a flexible hose is used to remove the broken pieces. A hood is positioned at the inlet of the suction head, and setback extensions are provided at the bottom of the hood to allow air flow into the inlet and prevent thermal conductance from the tray to the hood. Pins are extendable about the inlet of the suction head to enable breakage of the wafer to smaller pieces for easy removal.
164 Citations
19 Claims
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1. A substrate processing system, comprising:
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a vacuum processing chamber; a loadlock chamber coupled to the vacuum processing chamber via a vacuum valve; a broken substrate removing apparatus comprising; a placing mechanism movably supporting a suction head for moving the suction head to location of the broken substrate, the suction head comprising a suction inlet and a hood positioned at the inlet of the suction head and configured to allow sufficient air flow into the inlet to enable proper suction to remove broken pieces of the substrate; a suction pump; and
,a flexible hose coupling the suction head to the suction pump; wherein the hood comprises setback extensions to allow air flow into the inlet. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification