Shielded three-terminal flat-through EMI/energy dissipating filter with co-fired hermetically sealed feedthrough
First Claim
1. A hermetic terminal assembly for an active implantable medical device (AIMD), the hermetic terminal assembly comprising:
- a) a hermetically sealed feedthrough configured to be attachable to a ferrule or an AIMD housing, the feedthrough comprising;
i) an alumina substrate comprised of at least 96 percent alumina and having a thickness extending from a first substrate side to a second substrate side;
ii) a via hole disposed through the alumina substrate from the first substrate side to the second substrate side;
iii) a substantially closed pore and substantially pure platinum fill disposed within the via hole and extending between the first substrate side and the second substrate side of the alumina substrate; and
iv) a hermetic seal between the platinum fill and the alumina substrate, wherein the platinum fill forms a tortuous and mutually conformal knitline or interface between the alumina substrate and the platinum fill; and
b) a shielded three-terminal flat-through EMI energy dissipating filter comprising;
i) at least one active electrode plate through which a circuit current is configured to pass between a first terminal and a second terminal;
ii) at least one first shield plate disposed on a first side of the at least one active electrode plate; and
iii) at least one second shield plate disposed on a second side of the at least one active electrode plate, where the at least one second shield plate is disposed opposite the at least one first shield plate;
iv) wherein the at least one first and second shield plates are both electrically coupled to a third terminal, where the third terminal is configured to be electrically coupled directly or indirectly to the ferrule or the AIMD housing;
v) wherein the platinum fill is electrically coupled directly or indirectly to the at least one active electrode plate and where the platinum fill is in non-conductive relationship to the at least one first and second shield plates, the ferrule and the AIMD housing.
5 Assignments
0 Petitions
Accused Products
Abstract
A hermetic terminal assembly for an AIMD includes a shielded three-terminal flat-through EMI energy dissipating filter and a hermetically sealed feedthrough configured to be attachable to the ferrule or AIMD housing. The flat-through filter includes a first shield plate, an active electrode plate, and a second shield plate where the shield plates are electrically coupled to a metallization which in turn is coupled either to the ferrule or AIMD housing. The feedthrough includes an alumina substrate comprised of at least 96% alumina and a via hole with a substantially closed pore and substantially pure platinum fill. The platinum fill forms a tortuous and mutually conformal knitline or interface between the alumina substrate and the platinum fill, wherein the platinum fill is electrically coupled to at least one active electrode plate in non-conductive relationship to the at least one first and second shield plates.
112 Citations
32 Claims
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1. A hermetic terminal assembly for an active implantable medical device (AIMD), the hermetic terminal assembly comprising:
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a) a hermetically sealed feedthrough configured to be attachable to a ferrule or an AIMD housing, the feedthrough comprising; i) an alumina substrate comprised of at least 96 percent alumina and having a thickness extending from a first substrate side to a second substrate side; ii) a via hole disposed through the alumina substrate from the first substrate side to the second substrate side; iii) a substantially closed pore and substantially pure platinum fill disposed within the via hole and extending between the first substrate side and the second substrate side of the alumina substrate; and iv) a hermetic seal between the platinum fill and the alumina substrate, wherein the platinum fill forms a tortuous and mutually conformal knitline or interface between the alumina substrate and the platinum fill; and b) a shielded three-terminal flat-through EMI energy dissipating filter comprising; i) at least one active electrode plate through which a circuit current is configured to pass between a first terminal and a second terminal; ii) at least one first shield plate disposed on a first side of the at least one active electrode plate; and iii) at least one second shield plate disposed on a second side of the at least one active electrode plate, where the at least one second shield plate is disposed opposite the at least one first shield plate; iv) wherein the at least one first and second shield plates are both electrically coupled to a third terminal, where the third terminal is configured to be electrically coupled directly or indirectly to the ferrule or the AIMD housing; v) wherein the platinum fill is electrically coupled directly or indirectly to the at least one active electrode plate and where the platinum fill is in non-conductive relationship to the at least one first and second shield plates, the ferrule and the AIMD housing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A hermetic terminal assembly for an active implantable medical device (AIMD), comprising:
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a) a shielded three-terminal flat-through EMI energy dissipating filter, comprising; i) at least one active electrode plate through which a circuit current is configured to pass between a first terminal and a second terminal; ii) at least one first shield plate disposed on a first side of the at least one active electrode plate; and iii) at least one second shield plate disposed on a second side of the at least one active electrode plate and disposed opposite the at least one first shield plate; iv) wherein the at least one first and second shield plates are both electrically coupled to a third terminal; and b) a hermetically sealed feedthrough configured to be attachable to a ferrule or an AIMD housing, the feedthrough comprising; i) an alumina substrate comprised of at least 96% alumina and having a thickness extending from a first substrate side to a second substrate side; ii) a via hole disposed through the alumina substrate from the first substrate side to the second substrate side; iii) a first substantially closed pore and substantially pure platinum fill disposed within the via hole and extending between the first substrate side and the second substrate side of the alumina substrate, wherein the first platinum fill forms a tortuous and mutually conformal knitline or interface between the alumina substrate and the first platinum fill; iv) a hermetic seal between the first platinum fill and the alumina substrate; v) wherein the platinum fill is electrically coupled to the first terminal where the at least one active electrode plate is in non-conductive relationship to the at least one first and second shield plates, the ferrule and the AIMD housing; vi) a grounded via hole disposed through the alumina substrate from the first substrate side to the second substrate side; vii) a second substantially closed pore platinum fill disposed within the grounded via hole and extending between the first substrate side and the second substrate side of the alumina substrate; and viii) a second hermetic seal between the second platinum fill and the alumina substrate; ix) wherein the second platinum fill is electrically coupled to the third terminal and wherein the second platinum fill is configured to be electrically coupled directly or indirectly to the ferrule or AIMD housing. - View Dependent Claims (30, 31)
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32. A hermetic terminal assembly for an active implantable medical device (AIMD), comprising:
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a) a shielded three-terminal flat-through EMI energy dissipating filter comprising; i) at least one active electrode plate through which a circuit current is configured to pass between a first terminal and a second terminal; ii) at least one first shield plate disposed on a first side of the at least one active electrode plate; and iii) at least one second shield plate disposed on a second side of the at least one active electrode plate and disposed opposite the at least one first shield plate; iv) wherein the at least one first and second shield plates are both electrically coupled to a third terminal, where the third terminal is configured to be electrically coupled directly or indirectly to a ferrule or an AIMD housing; v) wherein the at least one active electrode plate, the at least one first shield plate and the at least one second shield plate are disposed within a monolithic dielectric substrate and wherein the at least one active electrode plate is insulated from both the at least one first and second shield plates by the monolithic dielectric substrate; and b) a hermetically sealed feedthrough configured to be attachable to the ferrule or the AIMD housing, the feedthrough comprising; i) an alumina substrate comprised of at least 96 percent alumina and having a thickness extending from a first substrate side to a second substrate side; ii) a via hole disposed through the alumina substrate from the first substrate side to the second substrate side; iii) a substantially closed pore and substantially pure platinum fill disposed within the via hole and extending between the first substrate side and the second substrate side of the alumina substrate; and iv) a hermetic seal between the platinum fill and the alumina substrate, wherein the platinum fill forms a tortuous and mutually conformal knitline or interface between the alumina substrate and the platinum fill; v) wherein the platinum fill is electrically coupled directly or indirectly to the at least one active electrode plate where the platinum fill is in non-conductive relationship to the at least one first and second shield plates, the ferrule and the AIMD housing; and c) a monolithic chip capacitor electrically coupled directly or indirectly between the at least one active electrode plate and the at least one first or second shield plates.
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Specification