Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the same
First Claim
1. A device comprising:
- a capping substrate having a cavity, wherein the capping substrate has a first surface of silicon; and
a substrate structure, wherein the substrate structure includes at least one micro-electro mechanical system (MEMS) device, wherein the MEMs device is disposed in the cavity, and wherein the substrate structure includes a layer providing a second surface of silicon;
wherein the first surface of silicon interfaces the second surface of silicon to form a fusion bond interface between the substrate structure and the capping substrate wherein the fusion bond interface is between the silicon of the first surface and silicon of the second surface;
at least one cavity surrounding at least a portion of the MEMS device;
at least one through substrate via (TSV) extending through the capping substrate and the fusion bond interface to contact the substrate structure, wherein the TSV comprises a central region free of conductive material and wherein the TSV provides an electrical connection to an integrated circuit component; and
a polymer material in the central region of the TSV.
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Accused Products
Abstract
The present disclosure includes micro-electro mechanical system (MEMS) structures and methods of forming the same. Substrates of the MEMS structures are bonded together by fusion bonding at high processing temperatures, which enables more complete removal of chemical species from the dielectric materials in the substrates prior to sealing cavities of the MEMS structures. Fusion bonding of MEMS structures reduces outgassing of chemical species and is compatible with the cavity formation process. The MEMS structures bonded by fusion bonding are mechanically stronger compared to eutectic bonding due to a higher bonding ratio. In addition, fusion bonding enables the formation of through substrate vias (TSVs) in the MEMS structures.
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Citations
20 Claims
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1. A device comprising:
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a capping substrate having a cavity, wherein the capping substrate has a first surface of silicon; and a substrate structure, wherein the substrate structure includes at least one micro-electro mechanical system (MEMS) device, wherein the MEMs device is disposed in the cavity, and wherein the substrate structure includes a layer providing a second surface of silicon; wherein the first surface of silicon interfaces the second surface of silicon to form a fusion bond interface between the substrate structure and the capping substrate wherein the fusion bond interface is between the silicon of the first surface and silicon of the second surface; at least one cavity surrounding at least a portion of the MEMS device; at least one through substrate via (TSV) extending through the capping substrate and the fusion bond interface to contact the substrate structure, wherein the TSV comprises a central region free of conductive material and wherein the TSV provides an electrical connection to an integrated circuit component; and a polymer material in the central region of the TSV. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of forming a micro-electro mechanical system (MEMS) structure, the method comprising:
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providing a first substrate structure having a first layer with a first silicon surface; providing a second substrate having a second layer with a second silicon surface; bonding the second substrate structure to the first substrate structure using fusion bonding at a temperature between about 500 Celsius and 1200 Celsius, wherein the fusion bonding fuses the first layer and the second layer by fusing the first and second silicon surfaces to form a fusion bonding interface, wherein the second substrate structure includes at least one micro-electro mechanical system (MEMS) device, and wherein there is at least one cavity surrounding at least a portion of the MEMS device; thinning the first substrate to provide a first surface of the thinned first substrate; and forming a TSV in the first substrate structure and through the fusion bonding interface between the first substrate and the second substrate such that a metal layer of the TSV extends through the fusion bonding interface, wherein the forming the TSV includes forming an isolation layer directly on the first surface of the thinned first substrate. - View Dependent Claims (11, 12, 13)
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14. A method of forming a micro-electro mechanical system (MEMS) structure, the method comprising:
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providing a first substrate structure having a first layer with a first silicon surface; providing a second substrate having at least one micro-electro mechanical system (MEMS) device and having a second layer with a second silicon surface; fusion bonding the second substrate structure to the first substrate structure, wherein the fusion bonding includes; pressing together the first and second silicon surfaces; annealing the pressed together first and second silicon surfaces; and thereby forming a bonding interface between the first and second silicon surfaces; and forming an interconnect through the first substrate and the bonding interface to contact the second substrate. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification