Integrated device comprising via with side barrier layer traversing encapsulation layer
First Claim
1. An integrated device comprising:
- a first die;
an encapsulation layer comprising a photo-patternable property, wherein the encapsulation layer at least partially encapsulates the first die;
a via structure traversing the encapsulation layer, wherein the via structure comprises;
a via comprising a first side, a second side, and a third side; and
a barrier layer surrounding at least the first side and the third side of the via; and
a substrate coupled to the first die, the substrate comprising a pad coupled to the barrier layer of the via structure, wherein the pad is free of direct contact with the via of the via structure.
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Abstract
Some novel features pertain to an integrated device that includes an encapsulation layer, a via structure traversing the encapsulation layer, and a pad. The via structure includes a via that includes a first side, a second side, and a third side. The via structure also includes a barrier layer surrounding at least the first side and the third side of the via. The pad is directly coupled to the barrier layer of the via structure. In some implementations, the integrated device includes a first dielectric layer coupled to a first surface of the encapsulation layer. In some implementations, the integrated device includes a substrate coupled to a first surface of the encapsulation layer. In some implementations, the integrated device includes a first die coupled to the substrate, where the encapsulation layer encapsulates the first die. In some implementations, the via includes a portion configured to operate as a pad.
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Citations
28 Claims
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1. An integrated device comprising:
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a first die; an encapsulation layer comprising a photo-patternable property, wherein the encapsulation layer at least partially encapsulates the first die; a via structure traversing the encapsulation layer, wherein the via structure comprises; a via comprising a first side, a second side, and a third side; and a barrier layer surrounding at least the first side and the third side of the via; and a substrate coupled to the first die, the substrate comprising a pad coupled to the barrier layer of the via structure, wherein the pad is free of direct contact with the via of the via structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An apparatus comprising:
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a first die; an encapsulation layer comprising a photo-patternable property, wherein the encapsulation layer at least partially encapsulates the first die; a via structure traversing the encapsulation layer, wherein the via structure comprises; a via comprising a first side, a second side, and a third side; and a barrier means surrounding at least the first side and the third side of the via; and a substrate coupled to the first die, the substrate comprising a pad coupled to the barrier means of the via structure, wherein the pad is free of direct contact with the via of the via structure. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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20. A method for fabricating an integrated device, comprising:
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forming a pad on a substrate; coupling a first die to the substrate; forming an encapsulation layer over the substrate such that the encapsulation layer at least partially encapsulates the first die, wherein the encapsulation layer comprises a photo-patternable property; and forming a via structure in the encapsulation layer, wherein forming the via structure comprises; photo-etching a cavity in the encapsulation layer; forming a barrier layer in the cavity of the encapsulation layer and over the pad of the substrate; and forming a via on the barrier layer such that the via is free of direct contact with the pad, the via comprising a first side, a second side, and a third side, the via is formed on the barrier layer such that the barrier layer surrounds at least the first side and the third side of the via. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28)
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Specification