Semiconductor device including multiple fin heights
First Claim
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1. A method of making a semiconductor device comprising:
- forming a mask on a portion of a base layer covering a substrate;
removing a portion of the base layer from the unmasked region such that the base layer has at least two thicknesses;
removing the mask from the base layer having at least two thicknesses;
forming a hole in the base layer to reveal the substrate;
depositing a sacrificial material over the base layer having two thicknesses and a hole;
planarizing the sacrificial material;
patterning and etching the sacrificial material to define active areas comprising the hole;
disposing a dielectric material over the patterned and etched sacrificial material;
patterning and etching the dielectric material to form trenches to the base layer on two opposing sides of the active area, wherein the trenches are adjacent to the sacrificial material;
removing the sacrificial material beneath the dielectric material to form a cavity bounded by the trenches and comprising the hole;
forming a semiconductor layer in the cavity on the base layer having two thicknesses by epitaxial lateral overgrowth;
removing the dielectric material to expose the semiconductor layer; and
patterning and etching the semiconductor layer to form a first fin having a first height and a second fin having a second height.
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Abstract
A semiconductor device comprising a substrate, an base layer disposed on the substrate having a thickness C in first area and a thickness B in a second area and a hole extending to the substrate filled with semiconductor, a first semiconductor fin disposed on the first area and having a height A, and a second semiconductor fin disposed on the second area and having a height D, wherein (A+C)=(B+D).
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Citations
13 Claims
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1. A method of making a semiconductor device comprising:
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forming a mask on a portion of a base layer covering a substrate; removing a portion of the base layer from the unmasked region such that the base layer has at least two thicknesses; removing the mask from the base layer having at least two thicknesses; forming a hole in the base layer to reveal the substrate; depositing a sacrificial material over the base layer having two thicknesses and a hole; planarizing the sacrificial material; patterning and etching the sacrificial material to define active areas comprising the hole; disposing a dielectric material over the patterned and etched sacrificial material; patterning and etching the dielectric material to form trenches to the base layer on two opposing sides of the active area, wherein the trenches are adjacent to the sacrificial material; removing the sacrificial material beneath the dielectric material to form a cavity bounded by the trenches and comprising the hole; forming a semiconductor layer in the cavity on the base layer having two thicknesses by epitaxial lateral overgrowth; removing the dielectric material to expose the semiconductor layer; and patterning and etching the semiconductor layer to form a first fin having a first height and a second fin having a second height. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of making a semiconductor device comprising:
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forming a mask on a portion of a base layer comprising silicon oxide covering a substrate comprising silicon; removing a portion of the base layer from the unmasked region such that the base layer has two thicknesses; removing the mask from the base layer having two thicknesses; forming at least one hole in the base layer to reveal the substrate; depositing a sacrificial material comprising silicon nitride over the base layer having two thicknesses and at least one hole; planarizing the sacrificial material; patterning and etching the sacrificial material to provide an active area comprising the hole; disposing a dielectric material comprising SiOCN, SiBCN, or a combinations there of over the patterned and etched sacrificial material; patterning and etching the dielectric material to form trenches to the base layer on at least two opposing sides of the active area, wherein the trenches are adjacent to the sacrificial material; removing the sacrificial material beneath the dielectric material to form a cavity bounded by the trenches and comprising the hole; forming a semiconductor layer comprising InGaAs in the cavity on the base layer, wherein the semiconductor layer has two thicknesses; removing the dielectric material to expose the semiconductor layer; and patterning and etching the semiconductor layer to form a first fin having a first height and a second fin having a second height. - View Dependent Claims (11, 12, 13)
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Specification