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Semiconductor device and method for manufacturing the same

  • US 9,466,726 B2
  • Filed: 04/23/2015
  • Issued: 10/11/2016
  • Est. Priority Date: 09/29/2011
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a gate electrode layer over an insulating surface;

    a gate insulating film over the gate electrode layer;

    an oxide semiconductor film comprising a channel formation region over the gate insulating film;

    an insulating layer over and in contact with the oxide semiconductor film;

    a source electrode layer having an end portion over the insulating layer; and

    a drain electrode layer having an end portion over the insulating layer,wherein the end portion of the source electrode layer and the end portion of the drain electrode layer overlap with the channel formation region,wherein the source electrode layer is in direct contact with a surface of the oxide semiconductor film through a first opening,wherein the drain electrode layer is in direct contact with the surface of the oxide semiconductor film through a second opening,wherein the first opening comprises a first portion and a second portion,wherein the first portion of the first opening overlaps with the gate electrode layer and the second portion of the first opening does not overlap with the gate electrode layer, andwherein an angle between a side surface of an end portion of the insulating layer and the insulating surface is smaller than or equal to 60°

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