Method for producing a plurality of opto-electronic components and opto-electronic component

• US 9,466,769 B2
• Filed: 07/30/2012
• Issued: 10/11/2016
• Est. Priority Date: 09/13/2011
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Halbritter, Hubert, Haas, Heinz, Jaeger, Claus, Stojetz, Bernhard
• Primary Examiner(s): Crawford, Latanya N
• Application Number:
  US14/344,871
• Publication Number:
  US 20140225147A1
• Time in Patent Office: 1,534 Days
• Field of Search: 257/88, 257/99, 257/100, 257/E33.057, 257/E33.056, 257/E33.058
• US Class Current: 1/1
• CPC Class Codes: F21V 5/007 Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane combination of two or more refractors F21V5/008
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

A method is provided for producing a plurality of optoelectronic components. A number of semiconductor chips are arranged on a connection carrier assembly. A frame assembly with a number of openings is arranged in such a way, relative to the connection carrier assembly, that the semiconductor chips are each arranged in one of the openings. A number of optical elements are positioned in such a way, relative to the frame assembly, that the optical elements cover the openings. The connection carrier assembly with the frame assembly and the optical elements is singulated into the number of optoelectronic components, such that each optoelectronic component includes one connection carrier with at least one optoelectronic semiconductor chip, one frame with at least one opening and at least one optical element.

Claims

1. A method for producing a plurality of optoelectronic components, the method comprising:

providing a connection carrier assembly;

arranging a plurality of semiconductor chips on the connection carrier assembly;

positioning a frame assembly with a plurality of openings such that, relative to the connection carrier assembly, each semiconductor chip is arranged in one of the openings;

providing a plurality of optical elements in a contiguous optics assembly, the optics assembly comprising a translucent or transparent material, and positioning the plurality of optical elements such that, relative to the frame assembly, the optical elements cover the openings; and

singulating the connection carrier assembly with the frame assembly and the optical elements into the plurality of optoelectronic components, such that each optoelectronic component comprises one connection carrier with an optoelectronic semiconductor chip, one frame with an opening, a first optical element and a second optical element, spaced apart from each other in a plan view of the components, wherein the singulating comprises severing the optics assembly, the connection carrier assembly and frame assembly in a common singulation step in such a way that the first optical element and the second optical element of each component are each separated completely from one another.

2. The method according to claim 1, wherein at least two optical elements are connected together in the optics assembly by a web.

3. The method according to claim 1, wherein the optical elements project into the openings after being positioned.

4. The method according to claim 1, wherein the singulating comprises sawing.

5. The method according to claim 1, wherein the first optical element extends at least in places as far as a side face defining the optoelectronic component in a lateral direction and wherein first optical element projects into the opening.

6. The method according to claim 1, wherein the semiconductor chip is configured to generate radiation, the method further comprising arranging a further semiconductor chip that is configured to receive radiation in a further opening in the frame.

7. The method according to claim 6, further comprising forming an optical decoupling element on the major face of the frame between the opening and the further opening.

8. The method according to claim 1, wherein the first optical element and the second optical element are convexly curved on a side facing the semiconductor chip.

9. The method according to claim 1, wherein the frame assembly comprises a major face remote from the connection carrier assembly, and wherein the first optical element and the second optical element are spaced apart from each other in a direction running parallel to the major face of the frame assembly.

10. An optoelectronic component comprising:

a connection carrier;

a first optoelectronic semiconductor chip and a second optoelectronic semiconductor chip attached to the connection carrier;

a frame arranged on the connection carrier;

the frame comprising a first opening and a second opening that extend from a major face remote from the connection carrier towards the connection carrier and in which the first semiconductor chip and the second semiconductor chip are arranged;

a first optical element covering the first opening on the frame; and

a second optical element covering the second opening on the frame and spaced apart from the first optical element in a plan view of the optoelectronic component, wherein at least one of the first optical element and the second optical element is connected with a web and formed in one piece with the web, which terminates flush with a side face defining the optoelectronic component in a lateral direction;

wherein the first optical element, the second optical element, and the web comprise a translucent or transparent material.

11. The optoelectronic component according to claim 10, wherein the first optical element extends at least in places as far as a side face defining the optoelectronic component in a lateral direction.

12. The optoelectronic component according to claim 10, wherein the first and second optical elements each project into the first opening and the second opening respectively.

13. The optoelectronic component according to claim 10, wherein a beam path between the first optical element and the first semiconductor chip is configured to be free of an enclosure surrounding the first semiconductor chip.

14. The optoelectronic component according to claim 10, wherein each opening tapers at least in places from the major face of the frame towards the connection carrier.

15. The optoelectronic component according to claim 10, wherein the first semiconductor chip is configured to generate radiation and the second semiconductor chip is configured to receive radiation.

16. The optoelectronic component according to claim 15, further comprising an optical decoupling element formed on the major face of the frame between the first opening and the second opening.

17. The optoelectronic component according to claim 10, wherein the first optical element and the second optical element are convexly curved on a side facing the semiconductor chip.

18. The optoelectronic component according to claim 10, wherein the web terminates flush with exactly one side face defining the optoelectronic component in lateral direction.