Concurrent dual-band WLAN device using MCM

• US 9,467,195 B2
• Filed: 07/28/2014
• Issued: 10/11/2016
• Est. Priority Date: 07/28/2014
• Status: Active Grant

• Current Assignee: Celeno Communications (Israel) Ltd.
• Original Assignee: Celeno Communications (Israel) Ltd.
• Inventors: Shapira, Nir
• Primary Examiner(s): Chu, Wutchung
• Application Number:
  US14/341,864
• Publication Number:
  US 20160029385A1
• Time in Patent Office: 806 Days
• Field of Search: 370/252, 370/329, 370/232, 370/338, 455/553.1, 455/127.4, 375/219
• US Class Current: 1/1
• CPC Class Codes: H04B 1/0064 with separate antennas for the more than one band H04B1/0053 takes precedence
• CPC Class Codes: H04B 1/401 for selecting or indicating operating mode
• CPC Class Codes: H04W 72/00 Local resource management
• CPC Class Codes: H04W 84/12 WLAN [Wireless Local Area Networks]
• CPC Class Codes: H04W 88/06 adapted for operation in multiple networks or having at least two operational modes, e.g. multi-mode terminals

Abstract

A wireless Local Area Network (WLAN) device includes a first transceiver and a second transceiver. The first transceiver is configured to communicate on a first frequency band, and includes a first Multi-Chip Module (MCM). The first MCM includes a first Radio-Frequency Integrated Circuit (RFIC) for transmitting and receiving on the first frequency band and a first BaseBand Integrated Circuit (BBIC). The second transceiver is configured to communicate on a second frequency band, and includes a second MCM. The second MCM includes a second RFIC for transmitting and receiving on the second frequency band and a second BBIC that is identical to the first BBIC.

Claims

1. A wireless Local Area Network (WLAN) device, comprising:

a first transceiver, which is configured to communicate on a first frequency band, and which comprises a first Multi-Chip Module (MCM) comprising a first Radio-Frequency Integrated Circuit (RFIC) for transmitting and receiving on the first frequency band and a first BaseBand Integrated Circuit (BBIC); and

a second transceiver, which is configured to communicate on a second frequency band, and which comprises a second MCM comprising a second RFIC for transmitting and receiving on the second frequency band and a second BBIC that is identical to the first BBIC.

2. The WLAN device according to claim 1, wherein the first and second RFICs and the first and second BBICs comprise bond pads, wherein the first RFIC is connected to the first BBIC and the second RFIC is connected to the second BBIC using direct bond wires between the bond pads, and wherein the bond pads are positioned such that no two bond wires cross over one another.

3. The WLAN device according to claim 1, wherein the first and second RFICs each comprises multiple transceiver sections whose interfaces are configured to face respective baseband circuits in the first and second BBICs, respectively.

4. The WLAN device according to claim 1, wherein the first RFIC comprises first transceiver sections, and wherein the second RFIC comprises second transceiver sections that correspond respectively to the first transceiver sections of the first RFIC, plus one or more additional transceiver sections.

5. The WLAN device according to claim 4, wherein the second transceiver sections in the second RFIC have interfaces that are ordered in the same order as corresponding interfaces of the first transceiver sections in the first RFIC, and wherein the additional transceiver sections are laid on one or more edges of the second transceiver sections.

6. A method, comprising:

in a Wireless Local Area Network (WLAN) device, communicating on a first frequency band, using a first Multi-Chip Module (MCM) comprising a first Radio-Frequency Integrated Circuit (RFIC) for transmitting and receiving on the first frequency band and a first BaseBand Integrated Circuit (BBIC); and

concurrently communicating on a second frequency band, using a second MCM comprising a second RFIC for transmitting and receiving on the second frequency band and a second BBIC that is identical to the first BBIC.

7. The method according to claim 6, wherein the first and second RFICs and the first and second BBICs comprise bond pads, wherein the first RFIC is connected to the first BBIC and the second RFIC is connected to the second BBIC using direct bond wires between the bond pads, and wherein the bond pads are positioned such that no two bond wires cross over one another.

8. The method according to claim 6, wherein the first and second RFICs each comprises multiple transceiver sections whose interfaces are configured to face respective baseband circuits in the first and second BBICs, respectively.

9. The method according to claim 6, wherein the first RFIC comprises first transceiver sections, and wherein the second RFIC comprises second transceiver sections that correspond respectively to the first transceiver sections of the first RFIC, plus one or more additional transceiver sections.

10. The method according to claim 9, wherein the second transceiver sections in the second RFIC have interfaces that are ordered in the same order as corresponding interfaces of the first transceiver sections in the first RFIC, and wherein the additional transceiver sections are laid on one or more edges of the second transceiver sections.

11. A method, comprising:

producing a first transceiver, which comprises a first Multi-Chip Module (MCM) comprising a first Radio-Frequency Integrated Circuit (RFIC) for transmitting and receiving on a first frequency band and a first BaseBand Integrated Circuit (BBIC);

producing a second transceiver, which comprises a second MCM comprising a second RFIC for transmitting and receiving on a second frequency band and a second BBIC that is identical to the first BBIC; and

integrating the first and second transceivers to produce a concurrent, dual-band communication device.

12. The method according to claim 11, wherein the first and second RFICs and the first and second BBICs comprise bond pads for connecting the first RFIC to the first BBIC and the second RFIC to the second BBIC using direct bond wires between the bond pads, wherein the bond pads are positioned such that no two bond wires cross over one another.

13. The method according to claim 11, wherein the first and second RFICs each comprises multiple transceiver sections whose interfaces are configured to face respective baseband circuits in the first and second BBICs, respectively.

14. The method according to claim 11, wherein the first RFIC comprises first transceiver sections, and wherein the second RFIC comprises second transceiver sections that correspond respectively to the first transceiver sections of the first RFIC, plus one or more additional transceiver sections.

15. The method according to claim 14, wherein the second transceiver sections in the second RFIC are laid adjacent to one another in a contiguous block and ordered in the same order as the first transceiver sections in the first RFIC, and wherein the additional transceiver sections are laid on one or more sides of the contiguous block.