MEMS apparatus with increased back volume

• US 9,467,785 B2
• Filed: 03/20/2014
• Issued: 10/11/2016
• Est. Priority Date: 03/28/2013
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Conklin, Wade
• Primary Examiner(s): COLEMAN, WILLIAM D
• Application Number:
  US14/220,664
• Publication Number:
  US 20140291784A1
• Time in Patent Office: 936 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 1/2807 Enclosures comprising vibrating or resonating arrangements for the reduction of undesired resonances or vibrations H04R1/2869
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005

Abstract

A microelectromechanical system (MEMS) microphone assembly includes a base and a cover. The cover is coupled to the base and together with the base defines a cavity. The base forms a recess and the recess has dimensions and a shape so as to hold a MEMS die. The MEMS die includes a diaphragm and back plate.

Claims

1. A microelectromechanical system (MEMS) microphone assembly, comprising

a cover having volume,

a base, the base being coupled to the cover and together with the cover defining an interior cavity, the base including a top surface facing the interior cavity and a bottom surface extending over substantially all of the base, the bottom surface of the base being exposed to an exterior environment of the microphone;

wherein the base comprises a plurality of layers including at least one bottom layer having an exterior surface that forms the bottom surface of the base, and the base having an interior surface disposed in parallel to the exterior surface, the interior surface being at least partially exposed to the interior cavity;

wherein the base forms a recess extending from the top surface of the base to the interior surface of the bottom layer of the base, the recess having a horizontal dimension and a shape so as to hold a MEMS die, the MEMS die disposed on the interior surface of the bottom layer of the base and within the recess, the MEMS die including a diaphragm and back plate; and

wherein the bottom layer forms a port opening extending from the exterior surface of the bottom layer to the interior surface of the bottom layer, the port opening having a port diameter, the port diameter being less than the horizontal dimension of the recess.

2. The MEMS microphone assembly of claim 1, further comprising an integrated circuit disposed at least partially within the recess, the integrated circuit electrically coupled to the MEMS die.

3. The MEMS microphone assembly of claim 1, wherein the base comprises a multi-layer printed circuit board.

4. The MEMS microphone assembly of claim 1 wherein the port opening communicates with portions of the MEMS die.

5. The MEMS microphone assembly of claim 1 wherein the MEMS die extends above the top surface and into the cavity.

6. The MEMS microphone assembly of claim 1, wherein the MEMS die extends below the top surface and into the cavity.