Method for producing semiconductor device
First Claim
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1. A method for producing a semiconductor device, comprising:
- forming a step portion on a rear surface of an upper terminal,close contacting the rear surface of the upper terminal where the step portion is not formed, to an upper surface of a lower terminal to thereby set a gap at the step portion between the upper surface of the lower terminal and the rear surface of the upper terminal to equal to or more than 20 μ
m and equal to or less than 400 μ
m, said gap being laterally open between the lower terminal and the upper terminal without being closed, said lower and upper terminals being internal wiring members of the semiconductor device, andradiating a laser beam to a surface of the upper terminal immediately above the step portion to laser-weld the upper terminal directly to the lower terminal while keeping the gap between the upper terminal and the lower terminal.
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Abstract
A method for producing a semiconductor device includes laser welding to bond an upper terminal and a lower terminal as internal wiring members of the semiconductor device. When the upper terminal is fixed to the lower terminal by the laser welding, a gap between an upper surface of the lower terminal and a lower surface of the upper terminal is equal to or more than 20 μm and equal to or less than 400 μm.
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Citations
4 Claims
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1. A method for producing a semiconductor device, comprising:
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forming a step portion on a rear surface of an upper terminal, close contacting the rear surface of the upper terminal where the step portion is not formed, to an upper surface of a lower terminal to thereby set a gap at the step portion between the upper surface of the lower terminal and the rear surface of the upper terminal to equal to or more than 20 μ
m and equal to or less than 400 μ
m, said gap being laterally open between the lower terminal and the upper terminal without being closed, said lower and upper terminals being internal wiring members of the semiconductor device, andradiating a laser beam to a surface of the upper terminal immediately above the step portion to laser-weld the upper terminal directly to the lower terminal while keeping the gap between the upper terminal and the lower terminal. - View Dependent Claims (2, 3, 4)
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Specification