Test system with localized heating and method of manufacture thereof

• US 9,470,720 B2
• Filed: 03/08/2013
• Issued: 10/18/2016
• Est. Priority Date: 03/08/2013
• Status: Active Grant

• Current Assignee: SanDisk Technologies LLC (Western Digital Corporation)
• Original Assignee: SanDisk Technologies LLC (Western Digital Corporation)
• Inventors: Dean, David Lee, Ellis, Robert W., Harrow, Scott
• Primary Examiner(s): Nguyen, Tung X
• Assistant Examiner(s): HAWKINS, DOMINIC E
• Application Number:
  US13/791,797
• Publication Number:
  US 20140253157A1
• Time in Patent Office: 1,320 Days
• Field of Search: 324/750.1, 324/750.11, 324/750.12, 324/750.13, 324/750.14
• US Class Current: 1/1
• CPC Class Codes: G01R 1/0458 related to environmental aspects, e.g. temperature
• CPC Class Codes: G01R 1/44 Modifications of instruments for temperature compensation
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2874 related to temperature
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A test system, and a method of manufacture thereof, including: a thermal management head including a heat spreader; an electronic device in direct contact with the heat spreader; and an electrical current for transferring energy between the heat spreader and the electronic device.

Claims

1. A method of manufacture of a test system comprising:

providing a thermal management head including a thermal management element, a heat spreader with a plurality of projections, and a thermally insulative mounting substrate, wherein the thermal management element is thermally engaged with the heat spreader and has a portion that is not covered by the heat spreader, and the thermally insulative mounting substrate covers the portion of the thermal management element to stop heat from radiating outward from the portion of the thermal management element;

placing each of the projections in direct contact with a respective electronic device of a plurality of electronic devices; and

transferring heat from the plurality of projections to the plurality of electronic devices by supplying an electrical current to the thermal management head.

2. The method as claimed in claim 1 further comprising heating at least one electronic device of the plurality of electronic devices at a ramp rate of at least seven degrees Celsius per minute.

3. The method as claimed in claim 1 further comprising providing a proportional-integral-derivative (PID) controller, and a sensor for communicating information about the heat transfer between the heat spreader and the plurality of electronic devices to the PID controller for controlling the temperature of the plurality of electronic devices.

4. The method as claimed in claim 1 wherein the thermal management element includes a Peltier device.

5. The method as claimed in claim 1 wherein placing the plurality of projections in direct contact with the plurality of electronic devices includes placing the plurality of projections in direct contact with a plurality of integrated circuits, a plurality of devices under test, or a plurality of sockets.

6. The method as claimed in claim 1 wherein each of the respective electronic devices is on a substrate.

7. The method as claimed in claim 1 further comprises testing the plurality of electronic devices by heating or cooling the plurality of electronic devices.

8. The method as claimed in claim 1

further comprising placing the thermal management element in contact with the heat spreader.

9. The method as claimed in claim 1 wherein the heat spreader includes an aperture.

10. A test system comprising:

a thermal management head including a thermal management element, a heat spreader with a plurality of projections, and a thermally insulative mounting substrate, wherein the thermal management element is thermally engaged with the heat spreader and has a portion that is not covered by the heat spreader, and the thermally insulative mounting substrate covers the portion of the thermal management element to stop heat from radiating outward from the portion of the thermal management element;

wherein the plurality of projections are configured to directly contact respective electronic devices of a plurality of electronic devices; and

a power connector to provide an electrical current for transferring heat from the plurality of projections to the plurality of electronic devices.

11. The system as claimed in claim 10 wherein the thermal management element is in contact with the heat spreader.

12. The system as claimed in claim 10 wherein the heat spreader includes an aperture.

13. The system as claimed in claim 10 further comprising a proportional-integral-derivative (PID) controller, and a sensor for communicating information about the heat transfer between the heat spreader and the plurality of electronic devices to the PID controller for controlling the temperature of the plurality of electronic devices.

14. The system as claimed in claim 10 wherein each electronic device of the plurality of electronic devices is on a substrate.

15. The system as claimed in claim 10 wherein the plurality of electronic devices includes a plurality of integrated circuits, a plurality of devices under test, or a plurality of sockets.

16. The system as claimed in claim 10 wherein the thermal management head is further configured to cool the plurality of electronic devices.

17. The system as claimed in claim 10 wherein the thermal management element includes a Peltier device.

18. The system as claimed in claim 10 wherein at least one electronic device of the plurality of electronic devices is heated at a ramp rate of at least seven degrees Celsius per minute.