Method and apparatus for characterizing metal oxide reduction
First Claim
1. A method of characterizing metal oxide reduction, the method comprising:
- (a) providing oxygen into an anneal chamber;
(b) providing a substrate with a metal seed layer formed thereon in the anneal chamber;
(c) exposing the substrate to conditions for forming a metal oxide of the metal seed layer in the anneal chamber, wherein the conditions include the substrate being heated to a temperature equal to or greater than about 50°
C.;
(d) providing the substrate in a processing chamber; and
(e) exposing the substrate to a reducing treatment under conditions that reduce the metal oxide to metal in the form of a film integrated with the metal seed layer.
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Abstract
Method and apparatus for characterizing metal oxide reduction using metal oxide films formed in an anneal chamber are disclosed. Oxygen is provided into an anneal chamber. A substrate including a metal seed layer is exposed to the oxygen and exposed to a heated substrate support in the anneal chamber to form a metal oxide of the metal seed layer. The oxidized substrate can be stored for later use or transferred to a processing chamber for reducing the metal oxide to metal. The oxidized substrates formed in this manner provide metal oxides that are repeatable, uniform, and stable. The oxidized substrate is exposed to a reducing treatment under conditions that reduce the metal oxide to metal in the form of a film integrated with the metal seed layer.
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Citations
14 Claims
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1. A method of characterizing metal oxide reduction, the method comprising:
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(a) providing oxygen into an anneal chamber; (b) providing a substrate with a metal seed layer formed thereon in the anneal chamber; (c) exposing the substrate to conditions for forming a metal oxide of the metal seed layer in the anneal chamber, wherein the conditions include the substrate being heated to a temperature equal to or greater than about 50°
C.;(d) providing the substrate in a processing chamber; and (e) exposing the substrate to a reducing treatment under conditions that reduce the metal oxide to metal in the form of a film integrated with the metal seed layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification