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Multilayer pillar for reduced stress interconnect and method of making same

  • US 9,472,520 B2
  • Filed: 08/21/2012
  • Issued: 10/18/2016
  • Est. Priority Date: 10/11/2007
  • Status: Active Grant
First Claim
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1. A method of forming a copper interconnect pillar, the method comprising:

  • forming a first copper layer on at least one other layer;

    forming a first nickel barrier protective layer on the first copper layer and in direct contact with the first copper layer;

    forming a substantially planar first intermediate layer on the first nickel barrier protective layer, the first intermediate layer having a first surface in direct contact with the first nickel barrier protective barrier layer, and having a modulus of elasticity lower than the first copper layer;

    forming a second nickel barrier protective layer on a second surface of the first intermediate layer opposing the first surface of the first intermediate layer and in direct contact with the second surface of the first intermediate layer; and

    forming a second copper layer on the second nickel barrier protective layer and in direct contact with a surface of the second nickel barrier layer opposing the first intermediate layer, the first intermediate layer having a modulus of elasticity lower than the second copper layer.

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