Reflow solderable flexible circuit board — to — flexible circuit board connector reinforcement
First Claim
1. A system, comprising:
- a first flexible substrate with a first number of conductors, the first flexible substrate configured to be mechanically flexed, and the first flexible substrate having at least a first solder pad, a second solder pad and third solder pad;
a surface mounted device (SMD) soldered to the first solder pad of the first flexible substrate and connected to at least some of the first number of conductors;
a first board-to-board connector element soldered to the second solder pad that is on a first side of the first flexible substrate, the first board-to-board connector element connected to at least some of the first number of conductors, the first board-to-board connector element being configured to mechanically connect to a second board-to-board connector element on a second flexible substrate and to electrically connect at least some of the first number of conductors in the first flexible substrate to at least some conductors in the second flexible substrate; and
a stiffener board soldered to a third solder pad that is on a second side of the first flexible substrate opposite the second solder pad and the first board- to-board connector element.
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Accused Products
Abstract
A system embodiment may include a first flexible substrate with a first number of conductors, the first flexible substrate configured to be mechanically flexed. The system may further include a surface mounted device (SMD) mounted on the first flexible substrate and connected to at least some of the first number of conductors, and a first board-to-board connector element connected to at least some of the first number of conductors on a first side of the substrate. The first board-to-board connector element is configured to mechanically connect to a second board-to-board connector element on a second flexible substrate and to electrically connect at least some of the first number of conductors in the first flexible substrate to at least some conductors in the second flexible substrate. The system may further include a stiffener board connected by solder to a second side of the first flexible substrate opposite the board-to-board connector element.
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Citations
14 Claims
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1. A system, comprising:
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a first flexible substrate with a first number of conductors, the first flexible substrate configured to be mechanically flexed, and the first flexible substrate having at least a first solder pad, a second solder pad and third solder pad; a surface mounted device (SMD) soldered to the first solder pad of the first flexible substrate and connected to at least some of the first number of conductors; a first board-to-board connector element soldered to the second solder pad that is on a first side of the first flexible substrate, the first board-to-board connector element connected to at least some of the first number of conductors, the first board-to-board connector element being configured to mechanically connect to a second board-to-board connector element on a second flexible substrate and to electrically connect at least some of the first number of conductors in the first flexible substrate to at least some conductors in the second flexible substrate; and a stiffener board soldered to a third solder pad that is on a second side of the first flexible substrate opposite the second solder pad and the first board- to-board connector element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A system, comprising:
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a first flex circuit segment, including; a first flexible substrate with a first number of conductors, the first flexible substrate configured to be mechanically flexed, and the first flexible substrate having at least a first solder pad, a second solder pad and third solder pad; a first surface mounted device (SMD soldered to the first solder pad of the first flexible substrate and connected to at least some of the first number of conductors; a first board-to-board connector element soldered to the second solder pad of the first flexible substrate that is on a first side of the first flexible substrate, the first board-to-board connector element connected to at least some of the first number of conductors; and a first stiffener board soldered to a third solder pad of the first flexible substrate that is on a second side of the first flexible substrate opposite the second solder pad and the first board-to-board connector element; and a second flex circuit segment, including; a second flexible substrate with a second number of conductors, the second flexible substrate configured to be mechanically flexed and the second flexible substrate having at least a first solder pad, a second solder pad and third solder pad; a second SMD soldered to the first solder pad of the second flexible substrate and connected to at least some of the second number of conductors; a second board-to-board connector element soldered to the second solder pad that is on a first side of the second flexible substrate, the second board-to-board connector element connected to at least some of the second number of conductors, wherein the first and second board-to-board connector elements are configured to mechanically connect to each and to electrically connect at least some of the first number of conductors to at least some of the second number of conductors; and a second stiffener board soldered to a third solder pad that is on a second side of the second flexible substrate opposite the second solder pad and the second board-to-board connector element. - View Dependent Claims (10, 11, 12, 13, 14)
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Specification