×

Reflow solderable flexible circuit board — to — flexible circuit board connector reinforcement

  • US 9,474,154 B2
  • Filed: 07/18/2014
  • Issued: 10/18/2016
  • Est. Priority Date: 07/18/2014
  • Status: Active Grant
First Claim
Patent Images

1. A system, comprising:

  • a first flexible substrate with a first number of conductors, the first flexible substrate configured to be mechanically flexed, and the first flexible substrate having at least a first solder pad, a second solder pad and third solder pad;

    a surface mounted device (SMD) soldered to the first solder pad of the first flexible substrate and connected to at least some of the first number of conductors;

    a first board-to-board connector element soldered to the second solder pad that is on a first side of the first flexible substrate, the first board-to-board connector element connected to at least some of the first number of conductors, the first board-to-board connector element being configured to mechanically connect to a second board-to-board connector element on a second flexible substrate and to electrically connect at least some of the first number of conductors in the first flexible substrate to at least some conductors in the second flexible substrate; and

    a stiffener board soldered to a third solder pad that is on a second side of the first flexible substrate opposite the second solder pad and the first board- to-board connector element.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×